JPH0336167U - - Google Patents
Info
- Publication number
- JPH0336167U JPH0336167U JP9711089U JP9711089U JPH0336167U JP H0336167 U JPH0336167 U JP H0336167U JP 9711089 U JP9711089 U JP 9711089U JP 9711089 U JP9711089 U JP 9711089U JP H0336167 U JPH0336167 U JP H0336167U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- board
- terminal part
- section
- connection structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図〜第３図はこの考案の一実施例を示し、
第１図はプリント基板上に電極部および載置部を
設けた状態の断面図、第２図は載置部にチツプ部
品を載置した状態の断面図、第３図は対向する電
極部を半田付けした状態の断面図、第４図は他の
接続構造を示す断面図である。
１……プリント基板、２……端子部、５……電
極部、３，８……載置部、４……チツプ部品、６
……隙間、７……半田。
Figures 1 to 3 show an embodiment of this invention,
Figure 1 is a cross-sectional view of the printed circuit board with the electrode part and the mounting part provided, Figure 2 is a cross-sectional view of the chip component placed on the mounting part, and Figure 3 is the opposing electrode part. A cross-sectional view of the soldered state, and FIG. 4 is a cross-sectional view showing another connection structure. DESCRIPTION OF SYMBOLS 1... Printed circuit board, 2... Terminal part, 5... Electrode part, 3, 8... Placement part, 4... Chip parts, 6
...Gap, 7...Solder.
Claims (1)
り接続する電子部品の接続構造において、 前記基板上に、該基板の端子部よりも厚く形成
され、かつこの端子部と前記電子部品の電極部の
間に隙間をもたせて前記電子部品を載置する載置
部を設けたことを特徴とする電子部品の接続構造
。[Claims for Utility Model Registration] In a connection structure for an electronic component in which an electrode part of an electronic component is connected to a terminal part on a board by soldering, the terminal part is formed on the board to be thicker than the terminal part of the board; A connection structure for an electronic component, characterized in that a mounting section is provided on which the electronic component is placed with a gap between the section and the electrode section of the electronic component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9711089U JPH0336167U (en) | 1989-08-22 | 1989-08-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9711089U JPH0336167U (en) | 1989-08-22 | 1989-08-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0336167U true JPH0336167U (en) | 1991-04-09 |
Family
ID=31646260
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9711089U Pending JPH0336167U (en) | 1989-08-22 | 1989-08-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0336167U (en) |
-
1989
- 1989-08-22 JP JP9711089U patent/JPH0336167U/ja active Pending
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