JPS63118227U - - Google Patents
Info
- Publication number
- JPS63118227U JPS63118227U JP829487U JP829487U JPS63118227U JP S63118227 U JPS63118227 U JP S63118227U JP 829487 U JP829487 U JP 829487U JP 829487 U JP829487 U JP 829487U JP S63118227 U JPS63118227 U JP S63118227U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- chip
- type electronic
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
Description
第１図は本考案のチツプ型電子部品を示す断面
図、第２図は第１図に示すチツプ型電子部品の斜
視図、第３図は従来のリード線付電子部品の実装
状態を示す断面図、第４，５図及び第６，７図は
従来のチツプ型電子部品を自動はんだ槽の噴流部
に適用した場合のはんだ流の流れを示す図及びチ
ツプ型電子部品の斜視図である。
１……チツプ型電子部品、２……プリント基板
、３ａ，３ｂ……電極、４ａ，４ｂ……はんだ、
１０６，１１１……従来のチツプ型電子部品。
Fig. 1 is a sectional view showing the chip type electronic component of the present invention, Fig. 2 is a perspective view of the chip type electronic component shown in Fig. 1, and Fig. 3 is a sectional view showing the mounting state of the conventional electronic component with lead wires. Figures 4 and 5 and 6 and 7 are diagrams showing the flow of solder flow when a conventional chip-type electronic component is applied to the jet section of an automatic solder bath, and a perspective view of the chip-type electronic component. 1... Chip type electronic component, 2... Printed circuit board, 3a, 3b... Electrode, 4a, 4b... Solder,
106, 111...Conventional chip-type electronic components.
Claims (1)
電極をはんだ付けするようにしたチツプ型電子部
品において、 プリント基板に相対する面と反対側面をはんだ
流に対する抵抗を少なくするように形成したこと
を特徴とするチツプ型電子部品。[Claim for Utility Model Registration] In a chip-type electronic component in which electrodes are soldered onto a non-porous pattern formed on a printed circuit board, the resistance to the solder flow is reduced on the side facing the printed circuit board and the opposite side. A chip-type electronic component characterized by being formed so as to.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP829487U JPS63118227U (en) | 1987-01-23 | 1987-01-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP829487U JPS63118227U (en) | 1987-01-23 | 1987-01-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63118227U true JPS63118227U (en) | 1988-07-30 |
Family
ID=30792545
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP829487U Pending JPS63118227U (en) | 1987-01-23 | 1987-01-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63118227U (en) |
-
1987
- 1987-01-23 JP JP829487U patent/JPS63118227U/ja active Pending