JPS6289184U - - Google Patents
Info
- Publication number
- JPS6289184U JPS6289184U JP18075585U JP18075585U JPS6289184U JP S6289184 U JPS6289184 U JP S6289184U JP 18075585 U JP18075585 U JP 18075585U JP 18075585 U JP18075585 U JP 18075585U JP S6289184 U JPS6289184 U JP S6289184U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- solder
- solder resistance
- printed circuit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 8
- 230000002093 peripheral effect Effects 0.000 claims 1
Description
第１図は本考案の実施例を示す電子部品取り付
け部のプリント基板の断面図、第２図Ａは別の実
施例を示し、円筒形に形成した半田抵抗層形成用
部材の斜視図、同Ｂは同Ａに示した部材を半田抵
抗層とした基板の断面図、第３図は従来の電子部
品に対する半田付け状態を示すプリント基板の断
面図である。
１……基板、２……電子部品、３……端子、４
……スルーホール、５……半田、６……半田抵抗
層、７……半田抵抗層形成用部材。
FIG. 1 is a sectional view of a printed circuit board of an electronic component mounting part showing an embodiment of the present invention, and FIG. 2A is a perspective view of a cylindrical solder resistance layer forming member, showing another embodiment. FIG. 3 is a sectional view of a printed circuit board showing a state in which conventional electronic components are soldered. 1... Board, 2... Electronic component, 3... Terminal, 4
...Through hole, 5...Solder, 6...Solder resistance layer, 7...Solder resistance layer forming member.
Claims (1)
に対して電子部品の端子を挿通し、半田によりこ
の端子とスルーホールとを電気的に接続するよう
に構成した基板において、スルーホールの内周面
に対して半田抵抗層を形成したことを特徴とする
プリント基板。 (2) 実用新案登録請求の範囲第(1)項記載におい
て、半田抵抗層が半田抵抗性を備えた筒体から成
ることを特徴とするプリント基板。[Claims for Utility Model Registration] (1) A board configured to form a through hole, insert a terminal of an electronic component into the through hole, and electrically connect the terminal and the through hole with solder. A printed circuit board characterized in that a solder resistance layer is formed on the inner peripheral surface of the through hole. (2) The printed circuit board as claimed in claim (1) of the utility model registration, characterized in that the solder resistance layer is made of a cylindrical body having solder resistance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18075585U JPS6289184U (en) | 1985-11-26 | 1985-11-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18075585U JPS6289184U (en) | 1985-11-26 | 1985-11-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6289184U true JPS6289184U (en) | 1987-06-08 |
Family
ID=31125001
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18075585U Pending JPS6289184U (en) | 1985-11-26 | 1985-11-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6289184U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56103498A (en) * | 1980-01-22 | 1981-08-18 | Matsushita Electric Ind Co Ltd | Method of solder resisting through hole of printed circuit board |
| JPS6049664B2 (en) * | 1975-02-28 | 1985-11-02 | チバ・ガイキー、アクチエンゲゼルシヤフト | Storage-stable aqueous dispersions of water-soluble compounds for finishing organic materials |
-
1985
- 1985-11-26 JP JP18075585U patent/JPS6289184U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6049664B2 (en) * | 1975-02-28 | 1985-11-02 | チバ・ガイキー、アクチエンゲゼルシヤフト | Storage-stable aqueous dispersions of water-soluble compounds for finishing organic materials |
| JPS56103498A (en) * | 1980-01-22 | 1981-08-18 | Matsushita Electric Ind Co Ltd | Method of solder resisting through hole of printed circuit board |