JPS6430877U - - Google Patents
Info
- Publication number
- JPS6430877U JPS6430877U JP12567787U JP12567787U JPS6430877U JP S6430877 U JPS6430877 U JP S6430877U JP 12567787 U JP12567787 U JP 12567787U JP 12567787 U JP12567787 U JP 12567787U JP S6430877 U JPS6430877 U JP S6430877U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- integrated circuit
- notch
- electronic component
- terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の一実施例による高密度実装構
造の要部分解斜視図、第２図は同要部側面図、第
３図は従来の実装構造の要部分解斜視図である。
１……集積回路、２……端子、３……導体パタ
ーン、４……主回路基板、５……スルーホール、
６……面実装部品、７……切欠部、８……電子部
品回路板、９……印刷厚膜抵抗器、１０……接続
端子部。
FIG. 1 is an exploded perspective view of a main part of a high-density mounting structure according to an embodiment of the present invention, FIG. 2 is a side view of the main part, and FIG. 3 is an exploded perspective view of a main part of a conventional mounting structure. 1... integrated circuit, 2... terminal, 3... conductor pattern, 4... main circuit board, 5... through hole,
6...Surface mount component, 7...Notch, 8...Electronic component circuit board, 9...Printed thick film resistor, 10...Connection terminal portion.
Claims (1)
前記集積回路の端子に切欠部を設け、前記切欠部
に対応して接続端子部を有する電子部品回路板を
、前記集積回路と主回路基板間に位置させ、前記
切欠部で嵌合または挟持し、前記主回路基板に集
積回路の端子を半田付けする際に、予めまたは同
時に前記端子と電子部品回路板の接続端子とを半
田付けしてなることを特徴とする高密度実装構造
。 In the mounting structure of the integrated circuit on the main circuit board,
A notch is provided in the terminal of the integrated circuit, and an electronic component circuit board having a connection terminal portion corresponding to the notch is positioned between the integrated circuit and the main circuit board, and the electronic component circuit board is fitted or held in the notch. . A high-density mounting structure, characterized in that when the terminals of the integrated circuit are soldered to the main circuit board, the terminals and the connection terminals of the electronic component circuit board are soldered in advance or simultaneously.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12567787U JPS6430877U (en) | 1987-08-20 | 1987-08-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12567787U JPS6430877U (en) | 1987-08-20 | 1987-08-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6430877U true JPS6430877U (en) | 1989-02-27 |
Family
ID=31376493
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12567787U Pending JPS6430877U (en) | 1987-08-20 | 1987-08-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6430877U (en) |
-
1987
- 1987-08-20 JP JP12567787U patent/JPS6430877U/ja active Pending