JPH02142574U - - Google Patents
Info
- Publication number
- JPH02142574U JPH02142574U JP5141489U JP5141489U JPH02142574U JP H02142574 U JPH02142574 U JP H02142574U JP 5141489 U JP5141489 U JP 5141489U JP 5141489 U JP5141489 U JP 5141489U JP H02142574 U JPH02142574 U JP H02142574U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- protrusion
- electronic component
- molded electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 2
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図はこの考案の実施例を示す分解斜視図及
び第２図は従来の組立状態を示す斜視図である。
１１……モールド電子部品、１２……配線導体
ランド、１３……プリント基板、１４……端子、
１５……突起、１６……抜穴。
FIG. 1 is an exploded perspective view showing an embodiment of this invention, and FIG. 2 is a perspective view showing a conventional assembled state. 11... Molded electronic component, 12... Wiring conductor land, 13... Printed circuit board, 14... Terminal,
15... protrusion, 16... hole.
Claims (1)
に側面に多数の導出端子を有するモールド電子部
品を表面実装する組立構造において、前記プリン
ト基板の実装側となる底面に突起を設け、この突
起をプリント基板の抜穴に嵌合させて位置決めす
るようにしたことを特徴とするモールド電子部品
。 In an assembly structure in which a molded electronic component having a large number of lead-out terminals on the side surface is surface mounted on a printed circuit board on which a predetermined wiring conductor land is formed, a protrusion is provided on the bottom surface of the printed circuit board on the mounting side, and this protrusion is attached to the printed circuit board. A molded electronic component characterized by being positioned by fitting into a punched hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5141489U JPH02142574U (en) | 1989-04-28 | 1989-04-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5141489U JPH02142574U (en) | 1989-04-28 | 1989-04-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02142574U true JPH02142574U (en) | 1990-12-04 |
Family
ID=31570836
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5141489U Pending JPH02142574U (en) | 1989-04-28 | 1989-04-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02142574U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011085073A (en) * | 2009-10-15 | 2011-04-28 | Denso Corp | Fuel supply system |
-
1989
- 1989-04-28 JP JP5141489U patent/JPH02142574U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011085073A (en) * | 2009-10-15 | 2011-04-28 | Denso Corp | Fuel supply system |