JPS6344475U - - Google Patents
Info
- Publication number
- JPS6344475U JPS6344475U JP13720986U JP13720986U JPS6344475U JP S6344475 U JPS6344475 U JP S6344475U JP 13720986 U JP13720986 U JP 13720986U JP 13720986 U JP13720986 U JP 13720986U JP S6344475 U JPS6344475 U JP S6344475U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- circuit board
- printed circuit
- case
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Mounting Components In General For Electric Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第1図はこの考案に係る電子部品の実装構造を
示す第1の例の斜視図、第2図は同上の正面図、
第3図は同じく第2の例を示す斜視図、第4図は
従来の電子部品を示す斜視図、第5図は同上の縦
断面図、第6図は同上における寝かせタイプの正
面図、第7図は同側面図である。
11……電子部品、12……ケース、14……
リード端子、15……突片、16……穴、A……
プリント基板。
FIG. 1 is a perspective view of a first example of the electronic component mounting structure according to this invention, FIG. 2 is a front view of the same as above,
FIG. 3 is a perspective view showing the second example, FIG. 4 is a perspective view showing a conventional electronic component, FIG. 5 is a vertical sectional view of the same, FIG. FIG. 7 is a side view of the same. 11...Electronic parts, 12...Case, 14...
Lead terminal, 15... protrusion, 16... hole, A...
Printed board.
Claims (1)
品素子のリード端子をケースの厚み方向の端部か
ら外部に突出させて電子部品を形成し、プリント
基板にこの電子部品の嵌合する穴を設け、ケース
の厚み方向の外面に、穴へ嵌合した電子部品のリ
ード端子がプリント基板上に当る状態でプリント
基板上へ重なる突片を設けたことを特徴とする電
子部品の実装構造。 An electronic component element is housed inside a case, the lead terminal of the electronic component element is made to protrude outside from the edge in the thickness direction of the case to form an electronic component, and a hole is provided in the printed circuit board into which the electronic component fits. An electronic component mounting structure characterized in that a protruding piece is provided on the outer surface of the case in the thickness direction so as to overlap the printed circuit board in such a manner that the lead terminal of the electronic component fitted into the hole is in contact with the printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13720986U JPS6344475U (en) | 1986-09-05 | 1986-09-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13720986U JPS6344475U (en) | 1986-09-05 | 1986-09-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6344475U true JPS6344475U (en) | 1988-03-25 |
Family
ID=31041050
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13720986U Pending JPS6344475U (en) | 1986-09-05 | 1986-09-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6344475U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010093107A (en) * | 2008-10-09 | 2010-04-22 | Tdk Corp | Lateral type coil component |
| JP2013222766A (en) * | 2012-04-13 | 2013-10-28 | Nippon Soken Inc | Mounting substrate |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5561088A (en) * | 1978-10-31 | 1980-05-08 | Matsushita Electric Works Ltd | Device for mounting electronic part to printed substrate |
| JPS6132919A (en) * | 1984-07-26 | 1986-02-15 | 日本開閉器工業株式会社 | Method of mounting control device |
-
1986
- 1986-09-05 JP JP13720986U patent/JPS6344475U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5561088A (en) * | 1978-10-31 | 1980-05-08 | Matsushita Electric Works Ltd | Device for mounting electronic part to printed substrate |
| JPS6132919A (en) * | 1984-07-26 | 1986-02-15 | 日本開閉器工業株式会社 | Method of mounting control device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010093107A (en) * | 2008-10-09 | 2010-04-22 | Tdk Corp | Lateral type coil component |
| JP2013222766A (en) * | 2012-04-13 | 2013-10-28 | Nippon Soken Inc | Mounting substrate |
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