JPS6291479U - - Google Patents
Info
- Publication number
- JPS6291479U JPS6291479U JP1985181444U JP18144485U JPS6291479U JP S6291479 U JPS6291479 U JP S6291479U JP 1985181444 U JP1985181444 U JP 1985181444U JP 18144485 U JP18144485 U JP 18144485U JP S6291479 U JPS6291479 U JP S6291479U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- terminal
- terminals
- solder
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 5
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Details Of Resistors (AREA)
- Coils Or Transformers For Communication (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図Ａは本考案の実施例を示す電子部品の側
面図、同ＢはＡに示した電子部品を基板に装着し
た状態の基板断面図、第２図は電子部品をダイオ
ードとした基板の断面図、第３図は従来型の電子
部品を取り付けた基板断面図、第４図は従来型電
子部品の側面図である。
１……基板、２……電子部品、３……端子、４
……スルーホール、５……半田、６……半田抵抗
層。
FIG. 1A is a side view of an electronic component showing an embodiment of the present invention, FIG. 3 is a cross-sectional view of a board to which a conventional electronic component is attached, and FIG. 4 is a side view of the conventional electronic component. 1... Board, 2... Electronic component, 3... Terminal, 4
...Through hole, 5...Solder, 6...Solder resistance layer.
Claims (1)
ールに挿通させ、かつこの部品本体の端子とスル
ーホールとを半田により電気的に接続するよう構
成した電子部品の構造において、この端子をスル
ーホールに挿通させた際に、端子のうちスルーホ
ール内に位置する部分に対して半田抵抗層を形成
したことを特徴とする電子部品。 (2) 実用新案登録請求の範囲第(1)項記載におい
て、端子をスルーホールに挿通させた際に、半田
抵抗層の下端がスルーホール下端部よりもスルー
ホールの内側に位置していることを特徴とする電
子部品。[Claims for Utility Model Registration] (1) An electronic component configured such that the terminals, which are the legs of the component body, are inserted into through-holes in a board, and the terminals of the component body and the through-holes are electrically connected by solder. An electronic component having a structure characterized in that, when the terminal is inserted into the through hole, a solder resistance layer is formed on a portion of the terminal located within the through hole. (2) As stated in paragraph (1) of the claims for utility model registration, when the terminal is inserted into the through hole, the lower end of the solder resistance layer is located inside the through hole than the lower end of the through hole. Electronic components featuring:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985181444U JPS6291479U (en) | 1985-11-27 | 1985-11-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985181444U JPS6291479U (en) | 1985-11-27 | 1985-11-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6291479U true JPS6291479U (en) | 1987-06-11 |
Family
ID=31126316
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985181444U Pending JPS6291479U (en) | 1985-11-27 | 1985-11-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6291479U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4943747B1 (en) * | 1969-07-15 | 1974-11-22 | ||
| JPS5024019A (en) * | 1973-07-05 | 1975-03-14 |
-
1985
- 1985-11-27 JP JP1985181444U patent/JPS6291479U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4943747B1 (en) * | 1969-07-15 | 1974-11-22 | ||
| JPS5024019A (en) * | 1973-07-05 | 1975-03-14 |