JPH0171467U - - Google Patents
Info
- Publication number
- JPH0171467U JPH0171467U JP1987167235U JP16723587U JPH0171467U JP H0171467 U JPH0171467 U JP H0171467U JP 1987167235 U JP1987167235 U JP 1987167235U JP 16723587 U JP16723587 U JP 16723587U JP H0171467 U JPH0171467 U JP H0171467U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- sub
- main
- soldered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Combinations Of Printed Boards (AREA)
Description
第1図は本考案のプリント配線体の連結構体の
一実施例を示す断面図、第2図〜第4図は、夫々
本考案で使用されるリード線の形状例を示す斜視
図である。第5図は従来例であるプリント配線体
の連結構体を示す断面図である。
10……プリント配線体の連結構体、11……
メインプリント基板、12……サブプリント基板
、12a……透孔、13……シールドケース、1
4……リード線、14a……屈曲部。15……半
田。
FIG. 1 is a cross-sectional view showing one embodiment of a linked structure of a printed wiring body according to the present invention, and FIGS. 2 to 4 are perspective views showing examples of the shapes of lead wires used in the present invention. FIG. 5 is a sectional view showing a conventional example of a linked structure of printed wiring bodies. 10... Linked structure of printed wiring bodies, 11...
Main printed circuit board, 12...Sub printed board, 12a...Through hole, 13...Shield case, 1
4... Lead wire, 14a... Bent part. 15...Solder.
Claims (1)
し、このメインプリント基板と対面する状態でサ
ブプリント基板をシールドケース内に収納固定し
、上記両基板をリード線で電気的に接続したもの
において、 上記リード線は一端を半田接続したメインプリ
ント基板から、サブプリント基板の透孔に遊挿さ
れて延び、サブプリント基板の主面より突出した
部位に屈曲部を設け、この屈曲部を介して他端を
サブプリント基板に半田接続したことを特徴とす
るプリント配線体の連結構体。[Scope of claim for utility model registration] A shield case is fixed on the main printed circuit board, a sub-printed circuit board is housed and fixed inside the shield case in a state facing the main printed circuit board, and both boards are electrically connected with lead wires. In the connected type, the lead wire extends from the main printed circuit board, one end of which is soldered, and is loosely inserted into the through hole of the sub printed circuit board, and has a bent portion at a portion protruding from the main surface of the sub printed circuit board. 1. A linked structure of printed wiring bodies, characterized in that the other end is soldered to a sub-printed circuit board through a part.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987167235U JPH0171467U (en) | 1987-10-30 | 1987-10-30 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987167235U JPH0171467U (en) | 1987-10-30 | 1987-10-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0171467U true JPH0171467U (en) | 1989-05-12 |
Family
ID=31455343
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987167235U Pending JPH0171467U (en) | 1987-10-30 | 1987-10-30 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0171467U (en) |
-
1987
- 1987-10-30 JP JP1987167235U patent/JPH0171467U/ja active Pending