JPS6247147U - - Google Patents
Info
- Publication number
- JPS6247147U JPS6247147U JP13883085U JP13883085U JPS6247147U JP S6247147 U JPS6247147 U JP S6247147U JP 13883085 U JP13883085 U JP 13883085U JP 13883085 U JP13883085 U JP 13883085U JP S6247147 U JPS6247147 U JP S6247147U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- terminal
- dip type
- circuit
- type electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は、本考案の一実施例の回路部品の半田
を除いて示した斜視図、第２図は、第１図の回路
部品に用いられる接続端子の斜視図、第３図は、
第１図の回路部品の接続端子とＤＩＰ型ＩＣの端
子との嵌合状態を示す側面図、第４図は、接続端
子の変形例の斜視図、第５図は、従来の回路部品
の半田を除いて示した斜視図、第６図は、第５図
の回路部品に用いられる接続端子の斜視図、第７
図は、第５図の回路部品の接続端子とＤＩＰ型Ｉ
Ｃの端子との接続状態を示す側面図である。
１１―ＤＩＰ型ＩＣ、１２……端子、１３……
回路基板、１４……パターン、１５……電子部品
、１６……アースパターン、１７……接続端子、
１８……孔、１９……コ字状部。
FIG. 1 is a perspective view of a circuit component according to an embodiment of the present invention, excluding the solder, FIG. 2 is a perspective view of a connecting terminal used in the circuit component of FIG. 1, and FIG.
Fig. 1 is a side view showing the fitted state of the connection terminal of the circuit component and the terminal of the DIP type IC, Fig. 4 is a perspective view of a modification of the connection terminal, and Fig. 5 is a solder of the conventional circuit component. FIG. 6 is a perspective view of the connection terminal used in the circuit component of FIG. 5, and FIG.
The diagram shows the connection terminals of the circuit components in Figure 5 and the DIP type I.
FIG. 3 is a side view showing a state of connection with terminals of C; 11-DIP type IC, 12... terminal, 13...
Circuit board, 14... Pattern, 15... Electronic component, 16... Earth pattern, 17... Connection terminal,
18... hole, 19... U-shaped part.
Claims (1)
に配置される回路基板とを一体化してなる回路部
品において、 前記ＤＩＰ型電子部品の端子と前記回路基板と
を接続する接続端子の、前記ＤＩＰ型電子部品の
端子と接続される一端側を、前記電子部品の端子
へ外嵌可能な形状としたことを特徴とする回路部
品。 ２ 前記接続端子の一端側に、前記ＤＩＰ型電子
部品の端子が挿通可能な孔を形成して、この電子
部品の端子に外嵌可能な形状とした実用新案登録
請求の範囲第１項記載の回路部品。 ３ 前記接続端子の一端側を、コ字状に形成して
、前記ＤＩＰ型電子部品の端子に外嵌可能な形状
とした実用新案登録請求の範囲第１項記載の回路
部品。[Claims for Utility Model Registration] 1. A circuit component formed by integrating a DIP type electronic component and a circuit board disposed on one side of the electronic component, wherein the terminals of the DIP type electronic component and the circuit board are connected to each other. A circuit component characterized in that one end side of a connecting terminal to be connected to the terminal of the DIP type electronic component is shaped so that it can be externally fitted onto the terminal of the electronic component. 2. A utility model registration according to claim 1, wherein a hole through which the terminal of the DIP type electronic component can be inserted is formed on one end side of the connection terminal, and the shape is such that it can be externally fitted onto the terminal of the electronic component. circuit parts. 3. The circuit component according to claim 1, wherein one end of the connection terminal is formed in a U-shape so that it can be fitted onto the terminal of the DIP type electronic component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13883085U JPS6247147U (en) | 1985-09-10 | 1985-09-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13883085U JPS6247147U (en) | 1985-09-10 | 1985-09-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6247147U true JPS6247147U (en) | 1987-03-23 |
Family
ID=31044164
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13883085U Pending JPS6247147U (en) | 1985-09-10 | 1985-09-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6247147U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009124071A (en) * | 2007-11-19 | 2009-06-04 | Powertech Technology Inc | Stacked assembly of semiconductor package |
-
1985
- 1985-09-10 JP JP13883085U patent/JPS6247147U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009124071A (en) * | 2007-11-19 | 2009-06-04 | Powertech Technology Inc | Stacked assembly of semiconductor package |
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