JPS61102032U - - Google Patents

Info

Publication number
JPS61102032U
JPS61102032U JP18758584U JP18758584U JPS61102032U JP S61102032 U JPS61102032 U JP S61102032U JP 18758584 U JP18758584 U JP 18758584U JP 18758584 U JP18758584 U JP 18758584U JP S61102032 U JPS61102032 U JP S61102032U
Authority
JP
Japan
Prior art keywords
electronic component
melting point
high melting
lead terminal
protrusion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18758584U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP18758584U priority Critical patent/JPS61102032U/ja
Publication of JPS61102032U publication Critical patent/JPS61102032U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、本考案の電子部品の断面図。第2図
は、本考案の電子部品を印刷配線板に仮固着した
状態を示す断面図。第3図は、本考案の電子部品
を印刷配線板にハンダ付け実装した状態の断面図
である。 1……コンデンサ本体、2……リード端子、3
……高融点ハンダの突設部、4……印刷配線板、
5……スルーホール孔、6……ランド部。
FIG. 1 is a sectional view of the electronic component of the present invention. FIG. 2 is a sectional view showing a state in which the electronic component of the present invention is temporarily fixed to a printed wiring board. FIG. 3 is a sectional view of the electronic component of the present invention soldered and mounted on a printed wiring board. 1...Capacitor body, 2...Lead terminal, 3
...High melting point solder protrusion, 4...Printed wiring board,
5...Through hole hole, 6...Land part.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 電子部品素子の絶縁外装体より同一方向に突出
している直線状のリード端子の根元部に高融点ハ
ンダの突設部を設けたことを特徴とする電子部品
An electronic component characterized in that a protrusion of high melting point solder is provided at the base of a linear lead terminal protruding in the same direction from an insulating exterior body of an electronic component element.
JP18758584U 1984-12-11 1984-12-11 Pending JPS61102032U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18758584U JPS61102032U (en) 1984-12-11 1984-12-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18758584U JPS61102032U (en) 1984-12-11 1984-12-11

Publications (1)

Publication Number Publication Date
JPS61102032U true JPS61102032U (en) 1986-06-28

Family

ID=30745047

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18758584U Pending JPS61102032U (en) 1984-12-11 1984-12-11

Country Status (1)

Country Link
JP (1) JPS61102032U (en)

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