JPS60179070U - Electronic component mounting board - Google Patents
Electronic component mounting boardInfo
- Publication number
- JPS60179070U JPS60179070U JP6643484U JP6643484U JPS60179070U JP S60179070 U JPS60179070 U JP S60179070U JP 6643484 U JP6643484 U JP 6643484U JP 6643484 U JP6643484 U JP 6643484U JP S60179070 U JPS60179070 U JP S60179070U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- component mounting
- mounting board
- hole
- circuit pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は本考案による電子部品実装基板の斜視図、第2
図は従来の電子部品実装基板の斜視図である。 。
1・・・電子部品、2・・・フラット端子、13・・・
絶縁基板、14・・・回路パターン、15・・・ペース
ト半田、17・・・スルーホール。Fig. 1 is a perspective view of an electronic component mounting board according to the present invention;
The figure is a perspective view of a conventional electronic component mounting board. . 1...Electronic component, 2...Flat terminal, 13...
Insulating board, 14... Circuit pattern, 15... Paste solder, 17... Through hole.
Claims (1)
が設置されて半田付けされている電子部品実装基板にお
いて、上記回路パターン部分には絶縁基板を貫通するス
ルーホールが形成されており、絶縁基板の裏面からこの
スルーホールを経て回路パターン上に浸出した半田によ
り、上記フラット端子が半田付けされていることを特徴
とする電子部品実装基板。In an electronic component mounting board in which a flat terminal of an electronic component is installed and soldered to a circuit pattern on an insulating board, a through hole that penetrates the insulating board is formed in the circuit pattern part, and a through hole is formed to penetrate the insulating board. An electronic component mounting board characterized in that the flat terminal is soldered by solder that seeps out from the back side onto the circuit pattern through the through hole.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6643484U JPS60179070U (en) | 1984-05-07 | 1984-05-07 | Electronic component mounting board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6643484U JPS60179070U (en) | 1984-05-07 | 1984-05-07 | Electronic component mounting board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS60179070U true JPS60179070U (en) | 1985-11-28 |
Family
ID=30599336
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6643484U Pending JPS60179070U (en) | 1984-05-07 | 1984-05-07 | Electronic component mounting board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60179070U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007017938A1 (en) * | 2005-08-10 | 2007-02-15 | Fujitsu Limited | Chip part mounting member |
-
1984
- 1984-05-07 JP JP6643484U patent/JPS60179070U/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007017938A1 (en) * | 2005-08-10 | 2007-02-15 | Fujitsu Limited | Chip part mounting member |
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