JPS58456U - Printed board - Google Patents

Printed board

Info

Publication number
JPS58456U
JPS58456U JP9358681U JP9358681U JPS58456U JP S58456 U JPS58456 U JP S58456U JP 9358681 U JP9358681 U JP 9358681U JP 9358681 U JP9358681 U JP 9358681U JP S58456 U JPS58456 U JP S58456U
Authority
JP
Japan
Prior art keywords
printed board
printed circuit
circuit board
abstract
electrolytic capacitor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9358681U
Other languages
Japanese (ja)
Inventor
猿渡　伸寛
和夫 中村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP9358681U priority Critical patent/JPS58456U/en
Publication of JPS58456U publication Critical patent/JPS58456U/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は電解コンデンサの斜視図、第２図は電解コンデ
ンサを基板に取り付けた図、第３図は半田付は部の拡大
図、第４図は本考案の一実施例による端子リード部分の
斜視図、第５図は本考案の一実施例による半田付は部め
拡大図である。 １・・・外装ケース、２・・・端子リード、３・・・底
面カバー、４・・・リング状の突起、５・・・プリント
基板、６・・・銅箔パターン、７・・・半田、８・・・
基板穴、９・・・スリット、１０・・・電解コンデンサ
。Figure 1 is a perspective view of an electrolytic capacitor, Figure 2 is a diagram of the electrolytic capacitor attached to a board, Figure 3 is an enlarged view of the soldering part, and Figure 4 is a terminal lead part according to an embodiment of the present invention. The perspective view and FIG. 5 are partially enlarged views of soldering according to an embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Exterior case, 2... Terminal lead, 3... Bottom cover, 4... Ring-shaped protrusion, 5... Printed circuit board, 6... Copper foil pattern, 7... Solder , 8...
Board hole, 9...slit, 10...electrolytic capacitor.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] プリント基板において電解コンデンサの底面部分に、該
底面部分と該底面部分以外の部分とを少なくとも１ケ所
以上連結するスリットを設けたことを特徴とするプリン
ト基板。1. A printed circuit board, characterized in that a bottom surface of an electrolytic capacitor in the printed circuit board is provided with a slit that connects the bottom surface and a portion other than the bottom surface at at least one location.
JP9358681U 1981-06-26 1981-06-26 Printed board Pending JPS58456U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9358681U JPS58456U (en) 1981-06-26 1981-06-26 Printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9358681U JPS58456U (en) 1981-06-26 1981-06-26 Printed board

Publications (1)

Publication Number Publication Date
JPS58456U true JPS58456U (en) 1983-01-05

Family

ID=29888547

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9358681U Pending JPS58456U (en) 1981-06-26 1981-06-26 Printed board

Country Status (1)

Country Link
JP (1) JPS58456U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0710971U (en) * 1993-07-23 1995-02-14 株式会社ユタカ電機製作所 Electronic component mounting structure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0710971U (en) * 1993-07-23 1995-02-14 株式会社ユタカ電機製作所 Electronic component mounting structure

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