JPS62177075U - - Google Patents

Info

Publication number
JPS62177075U
JPS62177075U JP6456586U JP6456586U JPS62177075U JP S62177075 U JPS62177075 U JP S62177075U JP 6456586 U JP6456586 U JP 6456586U JP 6456586 U JP6456586 U JP 6456586U JP S62177075 U JPS62177075 U JP S62177075U
Authority
JP
Japan
Prior art keywords
circuit
circuit component
wiring board
thermoplastic resin
lead terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6456586U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6456586U priority Critical patent/JPS62177075U/ja
Publication of JPS62177075U publication Critical patent/JPS62177075U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は、本考案の一実施例による回路部品の
半田上がり防止構造の概念的構成図、第２図は、
第１図に示す回路部品を回路配線基板に半田付け
実装した状態の要部断面説明図、そして、第３図
は、従来の回路部品を回路配線基板に半田付け実
装した状態の同様な要部断面説明図である。 １：回路部品、２：リード端子、３：熱可塑性
樹脂、４：回路配線基板、５：接続用半田。 FIG. 1 is a conceptual block diagram of a structure for preventing solder wicking of circuit components according to an embodiment of the present invention, and FIG.
Fig. 1 is a sectional explanatory diagram of the main parts of the circuit components shown in the circuit wiring board soldered and mounted, and Fig. 3 is the same main parts of the conventional circuit parts soldered and mounted on the circuit wiring board. It is a cross-sectional explanatory view. 1: Circuit component, 2: Lead terminal, 3: Thermoplastic resin, 4: Circuit wiring board, 5: Solder for connection.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 回路配線基板に実装する回路部品のリード端子
に熱可塑性樹脂を設けるように構成したことを特
徴とする回路部品の半田上がり防止構造。 A structure for preventing solder wicking of a circuit component, characterized in that a thermoplastic resin is provided on the lead terminal of a circuit component mounted on a circuit wiring board.
JP6456586U 1986-04-28 1986-04-28 Pending JPS62177075U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6456586U JPS62177075U (en) 1986-04-28 1986-04-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6456586U JPS62177075U (en) 1986-04-28 1986-04-28

Publications (1)

Publication Number Publication Date
JPS62177075U true JPS62177075U (en) 1987-11-10

Family

ID=30900837

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6456586U Pending JPS62177075U (en) 1986-04-28 1986-04-28

Country Status (1)

Country Link
JP (1) JPS62177075U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007194451A (en) * 2006-01-20 2007-08-02 Cosel Co Ltd Electronic component and its mounting method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4978880A (en) * 1972-12-08 1974-07-30

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4978880A (en) * 1972-12-08 1974-07-30

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007194451A (en) * 2006-01-20 2007-08-02 Cosel Co Ltd Electronic component and its mounting method

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