JPS62201947U - - Google Patents
Info
- Publication number
- JPS62201947U JPS62201947U JP9017286U JP9017286U JPS62201947U JP S62201947 U JPS62201947 U JP S62201947U JP 9017286 U JP9017286 U JP 9017286U JP 9017286 U JP9017286 U JP 9017286U JP S62201947 U JPS62201947 U JP S62201947U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- lead
- lead member
- thickness
- contacts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 4
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の電子部品のリード構造の一実
施例を示す斜視図、第２図は第１図に示した本考
案の電子部品のリード構造の実施例を一層詳細に
示す拡大部分斜視図、第３図は同拡大部分断面図
、第４図は、同他の実施例を示す拡大部分斜視図
、第５図は同拡大部分断面図、第６図は従来の電
子部品のリード構造を示す斜視図である。
１：電子部品本体、２：リード部材、３：印刷
配線基板のはんだ付けランド、４：印刷配線基板
、２１：本リード部材、２２：補助リード部材。
FIG. 1 is a perspective view showing an embodiment of the lead structure for an electronic component according to the present invention, and FIG. 2 is an enlarged perspective view showing the embodiment of the lead structure for an electronic component according to the present invention shown in FIG. 1 in more detail. 3 is an enlarged partial sectional view of the same, FIG. 4 is an enlarged partial perspective view showing another embodiment, FIG. 5 is an enlarged partial sectional view of the same, and FIG. 6 is a conventional electronic component lead structure. FIG. 1: electronic component main body, 2: lead member, 3: soldering land of printed wiring board, 4: printed wiring board, 21: main lead member, 22: auxiliary lead member.
Claims (1)
ド部材が接触されはんだ付けされる電子部品のリ
ード構造において、前記リード部材のはんだ付け
ランドに接触する部分の厚さが電子部品本体の厚
さよりも大きく、かつ前記リード部材のはんだ付
けランドに接触する部分が電子部品本体の両面か
らそれぞれ突出されてなることを特徴とする電子
部品のリード構造。 In the lead structure of an electronic component in which a lead member contacts and is soldered to a soldering land of a printed wiring board, the thickness of the portion of the lead member that contacts the soldering land is greater than the thickness of the electronic component body; A lead structure for an electronic component, characterized in that portions of the lead member that contact the soldering lands protrude from both sides of the electronic component body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9017286U JPS62201947U (en) | 1986-06-13 | 1986-06-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9017286U JPS62201947U (en) | 1986-06-13 | 1986-06-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62201947U true JPS62201947U (en) | 1987-12-23 |
Family
ID=30949797
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9017286U Pending JPS62201947U (en) | 1986-06-13 | 1986-06-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62201947U (en) |
-
1986
- 1986-06-13 JP JP9017286U patent/JPS62201947U/ja active Pending