JPS61177472U - - Google Patents
Info
- Publication number
- JPS61177472U JPS61177472U JP6037385U JP6037385U JPS61177472U JP S61177472 U JPS61177472 U JP S61177472U JP 6037385 U JP6037385 U JP 6037385U JP 6037385 U JP6037385 U JP 6037385U JP S61177472 U JPS61177472 U JP S61177472U
- Authority
- JP
- Japan
- Prior art keywords
- mount component
- surface mount
- utility
- component structure
- protrusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の実施例の一部省略した斜視図
、第２図は本考案の実施例のリード付き面実装部
品を半田付けによつて実装した状態を説明するた
めの断面図、第３図は従来のリード付き面実装部
品を説明するための図であつて、ａは一部省略し
た斜視図、ｂは断面図である。また第４図は従来
のリード付き面実装部品の半田付け不良の状態を
説明するための図であつて、ａはリードが半田不
揚となつた場合の断面図、ｂはリードが基板と平
行になつていない場合の断面図である。
FIG. 1 is a partially omitted perspective view of an embodiment of the present invention, and FIG. 2 is a sectional view for explaining a state in which a surface mount component with leads according to an embodiment of the present invention is mounted by soldering. FIG. 3 is a diagram for explaining a conventional surface mount component with leads, in which a is a partially omitted perspective view and b is a cross-sectional view. Furthermore, Fig. 4 is a diagram for explaining the state of soldering failure of a conventional surface mount component with leads, in which a is a cross-sectional view when the lead has failed to solder, and b is a cross-sectional view when the lead is parallel to the board. FIG.
Claims (1)
おいて、回路基板と半田接続するリード半田付け
部に、前記リード半田付け部の下面から上面に半
田を逃がす突抜部を設けたことを特徴とするリー
ド付き面実装部品構造。 ２ 実用新案登録請求の範囲第１項記載のリード
付き面実装部品構造において、突抜部が貫通孔で
あることを特徴とするリード付き面実装部品構造
。 ３ 実用新案登録請求の範囲第１項記載のリード
付き面実装部品構造において、突抜部が切り込み
であることを特徴とするリード付き面実装部品構
造。[Claims for Utility Model Registration] 1. In the structure of a surface mount component having flat leads, a lead soldering portion that is soldered to a circuit board is provided with a protrusion that allows solder to escape from the bottom surface of the lead soldering portion to the top surface. A surface mount component structure with leads. 2 Utility Model Registered Scope of Claims The leaded surface mount component structure according to claim 1, wherein the punched out portion is a through hole. 3 Utility Model Registration Scope of Claim 1. The leaded surface mount component structure according to claim 1, wherein the protrusion is a notch.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6037385U JPS61177472U (en) | 1985-04-24 | 1985-04-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6037385U JPS61177472U (en) | 1985-04-24 | 1985-04-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61177472U true JPS61177472U (en) | 1986-11-05 |
Family
ID=30587659
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6037385U Pending JPS61177472U (en) | 1985-04-24 | 1985-04-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61177472U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02152243A (en) * | 1988-12-02 | 1990-06-12 | Rohm Co Ltd | Semiconductor device |
-
1985
- 1985-04-24 JP JP6037385U patent/JPS61177472U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02152243A (en) * | 1988-12-02 | 1990-06-12 | Rohm Co Ltd | Semiconductor device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS61177472U (en) | ||
| JPS61136576U (en) | ||
| JPH01168951U (en) | ||
| JPH0369269U (en) | ||
| JPS6343352U (en) | ||
| JPH01137072U (en) | ||
| JPS6217176U (en) | ||
| JPS61166563U (en) | ||
| JPS6186947U (en) | ||
| JPS59101460U (en) | Grounding structure of electronic components | |
| JPS6161873U (en) | ||
| JPS6159376U (en) | ||
| JPS6094866U (en) | Leadless electrical components with through holes | |
| JPS6042761U (en) | printed circuit board equipment | |
| JPH0338656U (en) | ||
| JPS59149662U (en) | Electrical component mounting device | |
| JPS60179070U (en) | Electronic component mounting board | |
| JPS6157558U (en) | ||
| JPS62160577U (en) | ||
| JPS6219776U (en) | ||
| JPS61183566U (en) | ||
| JPS63149566U (en) | ||
| JPH0436272U (en) | ||
| JPS60119777U (en) | Assembly structure of parts | |
| JPS59101463U (en) | Grounding structure of electronic components |