JPS6379675U - - Google Patents
Info
- Publication number
- JPS6379675U JPS6379675U JP17306286U JP17306286U JPS6379675U JP S6379675 U JPS6379675 U JP S6379675U JP 17306286 U JP17306286 U JP 17306286U JP 17306286 U JP17306286 U JP 17306286U JP S6379675 U JPS6379675 U JP S6379675U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- window
- electronic component
- metal pattern
- type electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は、本考案の実施例を示す断面図で、第
２図は、平面図を示す。
１……チツプ型電子部品本体、２ａ，２ｂ……
チツプ型電子部品の電極、３……プリント基板、
４……プリント基板上面パターン、５……プリン
ト基板下面パターン、６……スルーホール金属パ
ターン、７……ハンダ。
FIG. 1 is a sectional view showing an embodiment of the present invention, and FIG. 2 is a plan view. 1... Chip type electronic component body, 2a, 2b...
Electrodes of chip-type electronic components, 3...Printed circuit board,
4... Printed circuit board upper surface pattern, 5... Printed circuit board lower surface pattern, 6... Through-hole metal pattern, 7... Solder.
Claims (1)
ント基板において、対向する両端側面と、前記側
面に接する上面と下面の一部が金属パターンで覆
われた窓部を有する前記プリント基板と、前記窓
部に挿入されたチツプ型電子部品とから成り、前
記チツプ型電子部品が、前記窓部側面金属パター
ンにハンダ付けで接合されている事を特徴とする
チツプ型電子部品の取付け構造。 (2) 前記金属パターンで覆われた窓部側面がス
ルーホール加工によつて形成された側面である実
用新案登録請求の範囲第１項記載のチツプ型電子
部品の取付け構造。[Scope of Claim for Utility Model Registration] (1) In a printed circuit board on which active elements and passive elements are assembled and mounted, a window portion whose opposite end side surfaces and a portion of the upper and lower surfaces in contact with the side surfaces are covered with a metal pattern. and a chip-type electronic component inserted into the window, the chip-type electronic component being joined to the metal pattern on the side surface of the window by soldering. Mounting structure for electronic components. (2) The mounting structure for a chip-type electronic component according to claim 1, wherein the side surface of the window portion covered with the metal pattern is a side surface formed by through-hole processing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17306286U JPS6379675U (en) | 1986-11-11 | 1986-11-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17306286U JPS6379675U (en) | 1986-11-11 | 1986-11-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6379675U true JPS6379675U (en) | 1988-05-26 |
Family
ID=31110174
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17306286U Pending JPS6379675U (en) | 1986-11-11 | 1986-11-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6379675U (en) |
-
1986
- 1986-11-11 JP JP17306286U patent/JPS6379675U/ja active Pending