JPS6433775U - - Google Patents
Info
- Publication number
- JPS6433775U JPS6433775U JP12938887U JP12938887U JPS6433775U JP S6433775 U JPS6433775 U JP S6433775U JP 12938887 U JP12938887 U JP 12938887U JP 12938887 U JP12938887 U JP 12938887U JP S6433775 U JPS6433775 U JP S6433775U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- electronic components
- type electronic
- printed wiring
- adjacent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の実施例を示す要部側断面図、
第２図乃至第５図は半田レジスト層の形成例を示
し、第２図は要部正面図、第３図は要部側面図、
第４図は要部平面図、第５図は要部側面図を示す
。第６図はプリント配線回路体の一例を示す要部
側断面図を示す。
１……プリント配線基板、３……導電パターン
、４……チツプ型電子部品、４ｂ……電極部、４
ｃ……電極部の対向面、４ｄ……電極部の基板と
略平行な部位、７……半田レジスト層。
FIG. 1 is a side sectional view of the main part showing an embodiment of the present invention;
2 to 5 show examples of forming the solder resist layer, FIG. 2 is a front view of the main part, FIG. 3 is a side view of the main part,
FIG. 4 shows a plan view of the main part, and FIG. 5 shows a side view of the main part. FIG. 6 shows a side sectional view of a main part showing an example of a printed wiring circuit body. DESCRIPTION OF SYMBOLS 1... Printed wiring board, 3... Conductive pattern, 4... Chip type electronic component, 4b... Electrode portion, 4
c... Opposing surface of the electrode part, 4d... Portion of the electrode part substantially parallel to the substrate, 7... Solder resist layer.
Claims (1)
電子部品の電極部を載置し半田付け固定したもの
において、近接配置されたチツプ型電子部品の電
極部の互に対向する対向面と隣接しかつ基板と略
平行な部位に半田レジスト層を形成したことを特
徴とするプリント配線回路体。 In the case where the electrode portions of chip-type electronic components are placed on the conductive pattern of a printed wiring board and fixed by soldering, the electrode portions of the chip-type electronic components that are placed in close proximity to each other are adjacent to the mutually opposing opposing surfaces of the chip-type electronic components, and are adjacent to the substrate. A printed wiring circuit body characterized in that a solder resist layer is formed in substantially parallel parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12938887U JPS6433775U (en) | 1987-08-25 | 1987-08-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12938887U JPS6433775U (en) | 1987-08-25 | 1987-08-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6433775U true JPS6433775U (en) | 1989-03-02 |
Family
ID=31383617
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12938887U Pending JPS6433775U (en) | 1987-08-25 | 1987-08-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6433775U (en) |
-
1987
- 1987-08-25 JP JP12938887U patent/JPS6433775U/ja active Pending
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