JPH0183361U - - Google Patents
Info
- Publication number
- JPH0183361U JPH0183361U JP1987178200U JP17820087U JPH0183361U JP H0183361 U JPH0183361 U JP H0183361U JP 1987178200 U JP1987178200 U JP 1987178200U JP 17820087 U JP17820087 U JP 17820087U JP H0183361 U JPH0183361 U JP H0183361U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- wiring board
- circuit wiring
- solder resist
- model registration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims 2
- 239000011521 glass Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
第１図〜第４図は、本考案の実施例を回路基板
の製造工程に従つて示した配線回路基板のスルー
ホール部分の断面図、第５図及び第６図ａ，ｂは
、同スルーホール部分の半田付け工程前の平面図
、第７図は従来例を示す配線回路基板のスルーホ
ール部分の断面図である。
１１…絶縁基板、１２，１３…配線パターン、
１４…スルーホール、１５…スルーホール導体、
１６…半田レジスト。
1 to 4 are cross-sectional views of the through-hole portion of a printed circuit board showing an embodiment of the present invention according to the manufacturing process of the circuit board, and FIGS. FIG. 7 is a plan view of the hole portion before the soldering process, and a cross-sectional view of the through-hole portion of a printed circuit board showing a conventional example. 11... Insulating substrate, 12, 13... Wiring pattern,
14...Through hole, 15...Through hole conductor,
16...Solder resist.
Claims (1)
ターンを、スルーホールの内周面に形成したスル
ーホール導体で互いに接続した回路配線基板にお
いて、前記スルーホールの周縁部分の少なくとも
一部のスルーホール導体を、半田レジストで覆つ
たことを特徴とする回路配線基板。 (2) 前記実用新案登録請求の範囲第１項に於て
、半田レジストがガラス材料を主成分とするもの
からなる回路配線基板。 (3) 前記実用新案登録請求の範囲第１項に於て
、半田レジストが樹脂成分を多量に含む導電ペー
ストからなる回路配線基板。[Claims for Utility Model Registration] (1) In a circuit wiring board in which wiring patterns provided on both main surfaces of an insulating board are connected to each other by through-hole conductors formed on the inner peripheral surface of the through-hole, the through-hole 1. A circuit wiring board characterized in that at least a portion of the through-hole conductor at the peripheral portion of the circuit board is covered with a solder resist. (2) The circuit wiring board according to claim 1 of the above-mentioned utility model registration, wherein the solder resist is mainly composed of a glass material. (3) The circuit wiring board according to claim 1 of the above-mentioned utility model registration, wherein the solder resist is made of a conductive paste containing a large amount of resin component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987178200U JPH0183361U (en) | 1987-11-21 | 1987-11-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987178200U JPH0183361U (en) | 1987-11-21 | 1987-11-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0183361U true JPH0183361U (en) | 1989-06-02 |
Family
ID=31469827
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987178200U Pending JPH0183361U (en) | 1987-11-21 | 1987-11-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0183361U (en) |
-
1987
- 1987-11-21 JP JP1987178200U patent/JPH0183361U/ja active Pending
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