JPS6163876U - - Google Patents
Info
- Publication number
- JPS6163876U JPS6163876U JP14747484U JP14747484U JPS6163876U JP S6163876 U JPS6163876 U JP S6163876U JP 14747484 U JP14747484 U JP 14747484U JP 14747484 U JP14747484 U JP 14747484U JP S6163876 U JPS6163876 U JP S6163876U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- circuit component
- land
- conductive film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図ａ，ｂは本考案の一実施例における印刷
配線板の構成を示すもので、ａはその平面図、ｂ
はａのＡ−Ａ矢視断面図、第２図は第１図ａ，ｂ
に示した印刷配線板に回路部品を装着した状態を
示す断面図、第３図および第４図はそれぞれ本考
案の他の異なる実施例における印刷配線板の構成
を示す平面図である。
１…印刷配線板本体、２ａ，２１ａ，２２ａ…
非使用のリード端子に対応するランドパターン、
２ｂ，２１ｂ，２２ｂ…使用するリード端子に対
応するランドパターン、３…レジスト膜、４，４
０…回路部品、５ａ…非使用のリード端子、５ｂ
…使用するリード端子、６…はんだ。
Figures 1a and 1b show the configuration of a printed wiring board in an embodiment of the present invention, where a is a plan view thereof, and b
is a cross-sectional view taken along the line A-A of a, and Figure 2 is a cross-sectional view of Figure 1 a and b.
3 and 4 are plan views showing the structure of the printed wiring board in other different embodiments of the present invention, respectively. 1...Printed wiring board main body, 2a, 21a, 22a...
Land pattern corresponding to unused lead terminals,
2b, 21b, 22b... Land pattern corresponding to the lead terminal to be used, 3... Resist film, 4, 4
0...Circuit component, 5a...Unused lead terminal, 5b
...Lead terminal to be used, 6...Solder.
Claims (1)
される印刷配線板において、前記回路部品の各リ
ード端子に個々に対応するランドパターンを有し
、これらのランドパターンのうち非使用の上記リ
ード端子に対応するランドパターンに非導電膜を
被覆したことを特徴とする印刷配線板。 (2) 少なくとも非導電膜を被覆していないラン
ドパターンを回路部品の外方へ延長したことを特
徴とする実用新案登録請求の範囲第(1)項記載の
印刷配線板。[Claims for Utility Model Registration] (1) A printed wiring board on which a circuit component having a large number of lead terminals is mounted, which has a land pattern that individually corresponds to each lead terminal of the circuit component, and these land patterns A printed wiring board characterized in that land patterns corresponding to unused lead terminals are coated with a non-conductive film. (2) The printed wiring board according to claim (1) of the utility model registration, characterized in that at least a land pattern not covered with a non-conductive film extends outward from the circuit component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14747484U JPS6163876U (en) | 1984-09-29 | 1984-09-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14747484U JPS6163876U (en) | 1984-09-29 | 1984-09-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6163876U true JPS6163876U (en) | 1986-04-30 |
Family
ID=30705700
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14747484U Pending JPS6163876U (en) | 1984-09-29 | 1984-09-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6163876U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0224574U (en) * | 1988-07-30 | 1990-02-19 | ||
| JP2013009158A (en) * | 2011-06-24 | 2013-01-10 | Murata Mfg Co Ltd | Electronic component |
-
1984
- 1984-09-29 JP JP14747484U patent/JPS6163876U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0224574U (en) * | 1988-07-30 | 1990-02-19 | ||
| JP2013009158A (en) * | 2011-06-24 | 2013-01-10 | Murata Mfg Co Ltd | Electronic component |