JPS61173175U - - Google Patents
Info
- Publication number
- JPS61173175U JPS61173175U JP5556785U JP5556785U JPS61173175U JP S61173175 U JPS61173175 U JP S61173175U JP 5556785 U JP5556785 U JP 5556785U JP 5556785 U JP5556785 U JP 5556785U JP S61173175 U JPS61173175 U JP S61173175U
- Authority
- JP
- Japan
- Prior art keywords
- land
- circuit board
- printed circuit
- surface side
- interval
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 description 1
Description
第１図はこの考案の両面プリント基板の半田付
状態を示す断面図、第２図はプリント面とマウン
ド面のランドの形状及びレジスト面を示す平面図
、第３図はレジストの他の実施例を示す平面図、
第４図はこの考案の他の実施例を示すランド形状
の平面図である。
図中、１は電子部品、２はリード端子、３はプ
リント基板、４Ｐはプリント面側のランド、４Ｍ
はマウント面側のランド、５は半田、６はレジス
ト層を示す。
Fig. 1 is a sectional view showing the soldered state of the double-sided printed circuit board of this invention, Fig. 2 is a plan view showing the shape of the land on the printed surface and the mound surface, and the resist surface, and Fig. 3 is another example of the resist. A plan view showing
FIG. 4 is a plan view of a land shape showing another embodiment of this invention. In the figure, 1 is an electronic component, 2 is a lead terminal, 3 is a printed circuit board, 4P is a land on the printed surface side, 4M
5 indicates a land on the mounting surface side, 5 indicates solder, and 6 indicates a resist layer.
Claims (1)
第１のランド列と、前記プリント基板のプリント
面側に設けられている第２のランド列のそれぞれ
対応するランドをスルーホールにより接続し、前
記第１及び第２のランド列は、ランド露出面の部
分の間隔がランド間隔より広くなるようにレジス
トがかけられていることを特徴とする両面プリン
ト基板。 The corresponding lands of a first land row provided on the mounting surface side of the printed circuit board and a second land row provided on the printed surface side of the printed circuit board are connected by through holes, and and a double-sided printed circuit board, characterized in that the second land row is coated with a resist so that the interval between the land exposed surface portions is wider than the land interval.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5556785U JPS61173175U (en) | 1985-04-16 | 1985-04-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5556785U JPS61173175U (en) | 1985-04-16 | 1985-04-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61173175U true JPS61173175U (en) | 1986-10-28 |
Family
ID=30578361
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5556785U Pending JPS61173175U (en) | 1985-04-16 | 1985-04-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61173175U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5550684A (en) * | 1978-10-06 | 1980-04-12 | Hitachi Ltd | Printed circuit board |
-
1985
- 1985-04-16 JP JP5556785U patent/JPS61173175U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5550684A (en) * | 1978-10-06 | 1980-04-12 | Hitachi Ltd | Printed circuit board |
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