JPS6247169U - - Google Patents
Info
- Publication number
- JPS6247169U JPS6247169U JP13757685U JP13757685U JPS6247169U JP S6247169 U JPS6247169 U JP S6247169U JP 13757685 U JP13757685 U JP 13757685U JP 13757685 U JP13757685 U JP 13757685U JP S6247169 U JPS6247169 U JP S6247169U
- Authority
- JP
- Japan
- Prior art keywords
- soldering
- soldering land
- land parts
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005476 soldering Methods 0.000 claims description 9
- 229910000679 solder Inorganic materials 0.000 claims description 3
Description
第１図はこの考案のプリント配線基板の一実施
例を示す平面図、第２図は第１図の主要部分を示
す拡大平面図、第３図はこの考案の他の実施例の
主要部分を示す拡大平面図、第４図は従来のプリ
ント配線基板を示す平面図である。
図中、１はプリント配線基板、２は絶縁基板、
３，４は配線パターン、３Ｌ，４Ｌははんだ付用
ランド部、４ＬＬははんだ付用ランド部分、４Ｌ
Ｓは余剰はんだ用ランド部分、５はソルダレジス
ト層、Ｒは電子部品、Ｌはリード端子を示す。
Fig. 1 is a plan view showing one embodiment of the printed wiring board of this invention, Fig. 2 is an enlarged plan view showing the main parts of Fig. 1, and Fig. 3 shows the main parts of another embodiment of this invention. FIG. 4 is an enlarged plan view showing a conventional printed wiring board. In the figure, 1 is a printed wiring board, 2 is an insulating board,
3 and 4 are wiring patterns, 3L and 4L are soldering land parts, 4LL is soldering land parts, 4L
S indicates a surplus solder land portion, 5 indicates a solder resist layer, R indicates an electronic component, and L indicates a lead terminal.
Claims (1)
れぞれ電気的に接続するはんだ付用ランド部列が
並設されたプリント配線基板において、前記はん
だ付用ランド部列の最も外側のはんだ付用ランド
部を前記はんだ付用ランド部列の延長方向へ幅広
に形成するとともに、このはんだ付用ランド部を
ソルダレジスト層で前記リード端子をはんだ付け
するはんだ付用ランド部分と、余剰はんだ用ラン
ド部分とに分離したことを特徴とするプリント配
線基板。 In a printed wiring board in which rows of soldering lands are arranged in parallel to electrically connect a large number of lead terminals of electronic components on the same plane, the outermost soldering land of the rows of soldering lands is formed to be wide in the extending direction of the row of soldering land parts, and the soldering land parts are formed into soldering land parts to which the lead terminals are soldered using a solder resist layer, and surplus soldering land parts. A printed wiring board characterized by being separated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985137576U JPH0526784Y2 (en) | 1985-09-10 | 1985-09-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985137576U JPH0526784Y2 (en) | 1985-09-10 | 1985-09-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6247169U true JPS6247169U (en) | 1987-03-23 |
| JPH0526784Y2 JPH0526784Y2 (en) | 1993-07-07 |
Family
ID=31041758
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985137576U Expired - Lifetime JPH0526784Y2 (en) | 1985-09-10 | 1985-09-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0526784Y2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5744699U (en) * | 1980-08-19 | 1982-03-11 | ||
| JPS60163496A (en) * | 1984-02-06 | 1985-08-26 | キヤノン株式会社 | Printed circuit board |
-
1985
- 1985-09-10 JP JP1985137576U patent/JPH0526784Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5744699U (en) * | 1980-08-19 | 1982-03-11 | ||
| JPS60163496A (en) * | 1984-02-06 | 1985-08-26 | キヤノン株式会社 | Printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0526784Y2 (en) | 1993-07-07 |