JPH0231182U - - Google Patents
Info
- Publication number
- JPH0231182U JPH0231182U JP10934788U JP10934788U JPH0231182U JP H0231182 U JPH0231182 U JP H0231182U JP 10934788 U JP10934788 U JP 10934788U JP 10934788 U JP10934788 U JP 10934788U JP H0231182 U JPH0231182 U JP H0231182U
- Authority
- JP
- Japan
- Prior art keywords
- board
- pattern
- row
- printed wiring
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案を実施したプリント配線基板の
平面図である。第２図は従来例のプリント配線基
板の平面図である。
１…ＩＣ、２…接続端子、３…基板パターン、
４…半田溜りパターン、５…中間半田溜りパター
ン。
FIG. 1 is a plan view of a printed wiring board embodying the present invention. FIG. 2 is a plan view of a conventional printed wiring board. 1...IC, 2...connection terminal, 3...board pattern,
4...Solder puddle pattern, 5...Intermediate solder puddle pattern.
Claims (1)
基板パターン列に半田付けして電気的に接続する
プリント配線基板において、前記基板パターン列
途中に中間半田溜りパターンを設けたことを特徴
とするプリント配線基板。 A printed wiring board in which an IC having a terminal row consisting of a large number of connection terminals is electrically connected by soldering to a board pattern row, characterized in that an intermediate solder pool pattern is provided in the middle of the board pattern row. substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10934788U JPH0231182U (en) | 1988-08-19 | 1988-08-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10934788U JPH0231182U (en) | 1988-08-19 | 1988-08-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0231182U true JPH0231182U (en) | 1990-02-27 |
Family
ID=31345509
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10934788U Pending JPH0231182U (en) | 1988-08-19 | 1988-08-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0231182U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012176246A1 (en) * | 2011-06-22 | 2012-12-27 | 住友電装株式会社 | Printed circuit board |
| WO2012176247A1 (en) * | 2011-06-22 | 2012-12-27 | 住友電装株式会社 | Printed circuit board |
-
1988
- 1988-08-19 JP JP10934788U patent/JPH0231182U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012176246A1 (en) * | 2011-06-22 | 2012-12-27 | 住友電装株式会社 | Printed circuit board |
| WO2012176247A1 (en) * | 2011-06-22 | 2012-12-27 | 住友電装株式会社 | Printed circuit board |