JPS6230381U - - Google Patents
Info
- Publication number
- JPS6230381U JPS6230381U JP12254585U JP12254585U JPS6230381U JP S6230381 U JPS6230381 U JP S6230381U JP 12254585 U JP12254585 U JP 12254585U JP 12254585 U JP12254585 U JP 12254585U JP S6230381 U JPS6230381 U JP S6230381U
- Authority
- JP
- Japan
- Prior art keywords
- conductor members
- wiring board
- printed wiring
- circuit components
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims 1
- 238000005476 soldering Methods 0.000 description 4
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図ないし第４図は本考案の一実施例を示し
、第１図は各半田付用ランドの形状および面積を
示す平面図、第２図は半田ブリツジの現象を説明
する縦断面図、第３図および第４図は半田付用ラ
ンドに回路部品を半田付けした状態の平面図およ
び縦断面図、第５図ないし第７図は従来例を示し
、第５図は各半田付用ランドの平面図、第６図は
回路部品を半田付けした平面図、第７図は縦断面
図である。
１，２，３，４……半田付用ランド（導体部材
）、５……プリント配線基板、６……半田、１１
，１２，１３，１４……回路部品。
1 to 4 show an embodiment of the present invention, FIG. 1 is a plan view showing the shape and area of each soldering land, FIG. 2 is a longitudinal cross-sectional view illustrating the phenomenon of solder bridging, Figures 3 and 4 are a plan view and a vertical sectional view of circuit components soldered to soldering lands, Figures 5 to 7 show conventional examples, and Figure 5 shows each soldering land. FIG. 6 is a plan view of soldered circuit components, and FIG. 7 is a longitudinal sectional view. 1, 2, 3, 4...Soldering land (conductor member), 5...Printed wiring board, 6...Solder, 11
, 12, 13, 14... circuit parts.
Claims (1)
これら導体部材にリード線を有しない各回路部品
が半田デイツプによつて同時に半田付けされるプ
リント配線基板において、 隣り合う前記導体部材の形状および面積が互い
に異なるように形成されてなることを特徴とする
プリント配線基板。[Claims for Utility Model Registration] A plurality of conductor members are arranged close to each other on a substrate,
In a printed wiring board to which circuit components having no lead wires are simultaneously soldered to the conductor members using a solder dip, the adjacent conductor members are formed to have different shapes and areas. Printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12254585U JPS6230381U (en) | 1985-08-08 | 1985-08-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12254585U JPS6230381U (en) | 1985-08-08 | 1985-08-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6230381U true JPS6230381U (en) | 1987-02-24 |
Family
ID=31012831
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12254585U Pending JPS6230381U (en) | 1985-08-08 | 1985-08-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6230381U (en) |
-
1985
- 1985-08-08 JP JP12254585U patent/JPS6230381U/ja active Pending