JPS6237968U - - Google Patents
Info
- Publication number
- JPS6237968U JPS6237968U JP13063585U JP13063585U JPS6237968U JP S6237968 U JPS6237968 U JP S6237968U JP 13063585 U JP13063585 U JP 13063585U JP 13063585 U JP13063585 U JP 13063585U JP S6237968 U JPS6237968 U JP S6237968U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- conductor
- soldering
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第1図はこの考案に係わるプリント基板の一実
施例を示す平面図、第2図は第1図のA矢視図で
半田付けされた状態を示す図、第3図はこの考案
の他の実施例を示す平面図、第4図はこの考案に
適用するチツプ部品の一例を示す斜視図、第5図
は従来のプリント基板の平面図、第6図はチツプ
部品の他の例を示す斜視図である。
1:プリント基板、2,3,4,12,13,
14,15:導体ランド、2a,3a,12a,
13a,14a,15a:切欠き凹部、5,9:
チツプ部品、6a,6b,6c,9a,9b:端
子、10:半田。
Fig. 1 is a plan view showing an embodiment of the printed circuit board according to this invention, Fig. 2 is a view showing the soldered state as viewed from arrow A in Fig. 1, and Fig. 3 is a plan view showing an embodiment of the printed circuit board according to this invention. 4 is a perspective view showing an example of a chip component applied to this invention; FIG. 5 is a plan view of a conventional printed circuit board; FIG. 6 is a perspective view showing another example of the chip component. It is a diagram. 1: Printed circuit board, 2, 3, 4, 12, 13,
14, 15: conductor land, 2a, 3a, 12a,
13a, 14a, 15a: notch recess, 5, 9:
Chip parts, 6a, 6b, 6c, 9a, 9b: terminal, 10: solder.
Claims (1)
ドが複数個設けられているプリント基板において
、 前記導体ランドの対向縁部に、半田ブリツジ防
止用の切欠き凹部を設けたことを特徴とするプリ
ント基板。[Claims for Utility Model Registration] In a printed circuit board in which a plurality of conductor lands for soldering are provided at relatively narrow intervals, a cutout recess for preventing solder bridging is provided at the opposite edge of the conductor land. A printed circuit board characterized by the following features:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13063585U JPS6237968U (en) | 1985-08-27 | 1985-08-27 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13063585U JPS6237968U (en) | 1985-08-27 | 1985-08-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6237968U true JPS6237968U (en) | 1987-03-06 |
Family
ID=31028321
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13063585U Pending JPS6237968U (en) | 1985-08-27 | 1985-08-27 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6237968U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09177673A (en) * | 1995-12-05 | 1997-07-11 | Samsung Electronics Co Ltd | Suction muffler for hermetic reciprocating compressor |
-
1985
- 1985-08-27 JP JP13063585U patent/JPS6237968U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09177673A (en) * | 1995-12-05 | 1997-07-11 | Samsung Electronics Co Ltd | Suction muffler for hermetic reciprocating compressor |
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