JPS6244464U - - Google Patents
Info
- Publication number
- JPS6244464U JPS6244464U JP13526385U JP13526385U JPS6244464U JP S6244464 U JPS6244464 U JP S6244464U JP 13526385 U JP13526385 U JP 13526385U JP 13526385 U JP13526385 U JP 13526385U JP S6244464 U JPS6244464 U JP S6244464U
- Authority
- JP
- Japan
- Prior art keywords
- area
- adhesive
- printed board
- solder resist
- land portions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
図面は何れも本考案プリント板の一実施例を示
し、第１図は電気部品を取付ける前の状態の裏面
図、第２図は電気部品を取付けた状態の断面図で
ある。
３：ハンダ付けランド部、８：ハンダレジスト
無塗布領域、９：接着剤。
The drawings all show one embodiment of the printed circuit board of the present invention; FIG. 1 is a back view of the printed board before electrical components are attached, and FIG. 2 is a sectional view of the printed board with electrical components attached. 3: Soldering land portion, 8: Solder resist-free area, 9: Adhesive.
Claims (1)
付けランド部を残してハンダレジスト層を形成す
ると共に、前記ランド部間間隔の狭い部分にハン
ダレジスト無塗布領域を設け、この領域内にチツ
プ部品固定用の接着剤をハンダブリツジ防止用の
ハンダ付け抵抗層として塗布するようにしたこと
を特徴とするプリント板。 (2) 前記接着剤は前記領域よりも若干狭い範囲
に塗布されることを特徴とする登録請求の範囲第
１項記載のプリント板。[Claims for Utility Model Registration] (1) A solder resist layer is formed leaving the soldering land portions of the conductor pattern formed on the substrate, and a solder resist-free area is formed in the narrow portions between the land portions. 1. A printed board, characterized in that an adhesive for fixing chip components is applied in this region as a soldering resistance layer for preventing solder bridging. (2) The printed board according to claim 1, wherein the adhesive is applied to an area slightly narrower than the area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13526385U JPS6244464U (en) | 1985-09-04 | 1985-09-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13526385U JPS6244464U (en) | 1985-09-04 | 1985-09-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6244464U true JPS6244464U (en) | 1987-03-17 |
Family
ID=31037279
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13526385U Pending JPS6244464U (en) | 1985-09-04 | 1985-09-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6244464U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5842966B2 (en) * | 1976-11-16 | 1983-09-22 | セイコーインスツルメンツ株式会社 | crystal unit |
-
1985
- 1985-09-04 JP JP13526385U patent/JPS6244464U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5842966B2 (en) * | 1976-11-16 | 1983-09-22 | セイコーインスツルメンツ株式会社 | crystal unit |
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