JPH0348265U - - Google Patents
Info
- Publication number
- JPH0348265U JPH0348265U JP10998989U JP10998989U JPH0348265U JP H0348265 U JPH0348265 U JP H0348265U JP 10998989 U JP10998989 U JP 10998989U JP 10998989 U JP10998989 U JP 10998989U JP H0348265 U JPH0348265 U JP H0348265U
- Authority
- JP
- Japan
- Prior art keywords
- land portion
- soldering
- circuit board
- printed circuit
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Description
第1図はこの考案に係るプリント基板の一実施
例の要部断面図、第2図は第1図のプリント基板
へのチツプ部品の実装を示す断面図、第3図は本
考案の他の実施例の要部断面図、第4図は従来の
プリント基板の要部断面図、第5図及び第6図は
第4図のプリント基板でのチツプ部品の実装状態
を示す要部断面図である。
10,20……プリント基板、11,21……
絶縁基板、12,22……はんだ付けランド部、
13,23……導電ランド部、14,24……レ
ジスト被膜。
FIG. 1 is a sectional view of a main part of an embodiment of a printed circuit board according to this invention, FIG. 2 is a sectional view showing the mounting of chip components on the printed circuit board of FIG. 1, and FIG. FIG. 4 is a sectional view of the main part of the embodiment, FIG. 4 is a sectional view of the main part of a conventional printed circuit board, and FIGS. be. 10,20...Printed circuit board, 11,21...
Insulating board, 12, 22... soldering land part,
13, 23... Conductive land portion, 14, 24... Resist coating.
Claims (1)
の露呈するはんだ付けランド部とはんだレジスト
被膜を施した導電ランド部とを有するプリント基
板において、 前記はんだ付けランド部とはんだレジスト被膜
を施した導電ランド部との各表面を均一面に形成
したことを特徴とするプリント基板。[Claims for Utility Model Registration] A printed circuit board having an insulating substrate on which a conductive pattern is formed, a soldering land portion where the pattern is exposed, and a conductive land portion coated with a solder resist film, comprising: the soldering land portion and the soldering resist film; A printed circuit board characterized in that each surface of a coated conductive land portion is formed into a uniform surface.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10998989U JPH0348265U (en) | 1989-09-19 | 1989-09-19 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10998989U JPH0348265U (en) | 1989-09-19 | 1989-09-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0348265U true JPH0348265U (en) | 1991-05-08 |
Family
ID=31658547
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10998989U Pending JPH0348265U (en) | 1989-09-19 | 1989-09-19 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0348265U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008060182A (en) * | 2006-08-30 | 2008-03-13 | Hitachi Ltd | In-vehicle electronic circuit device |
-
1989
- 1989-09-19 JP JP10998989U patent/JPH0348265U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008060182A (en) * | 2006-08-30 | 2008-03-13 | Hitachi Ltd | In-vehicle electronic circuit device |
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