JPS58189567U - printed wiring board - Google Patents
printed wiring boardInfo
- Publication number
- JPS58189567U JPS58189567U JP8725682U JP8725682U JPS58189567U JP S58189567 U JPS58189567 U JP S58189567U JP 8725682 U JP8725682 U JP 8725682U JP 8725682 U JP8725682 U JP 8725682U JP S58189567 U JPS58189567 U JP S58189567U
- Authority
- JP
- Japan
- Prior art keywords
- land
- wiring board
- printed wiring
- circuit pattern
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来例の印刷配線板の部分平面図。第２図は本
考案−実施例の印刷配線板の部分平面図。
第３図は本考案−実施例の印刷配線板の検査状態を示す
部分断面図。
図中の記号、１，１１・・・絶縁基板、２，１２・・・
回路パターン、２ａ、１２ａ・・・（回路パターンの一
方の）端部、３．１３・・・スルホール、４．１４・・
・ランド、５．１５・・・ソルダレジスト被膜、１６Ａ
。
１６Ｂ、１６Ｃ・・・銅箔パッド部、１７・・・（電気
的に導通する）測定治具端子。FIG. 1 is a partial plan view of a conventional printed wiring board. FIG. 2 is a partial plan view of a printed wiring board according to an embodiment of the present invention. FIG. 3 is a partial cross-sectional view showing the inspection state of the printed wiring board according to the present invention - an embodiment. Symbols in the diagram: 1, 11...Insulating substrate, 2, 12...
Circuit pattern, 2a, 12a... (one end of the circuit pattern), 3.13... Through hole, 4.14...
・Land, 5.15...Solder resist coating, 16A
. 16B, 16C...Copper foil pad portion, 17...Measurement jig terminal (electrically conductive).
Claims (1)
たランドと、前記ランドと接続した回路パターンのうち
、一端が前記ランドに接続されない回路パターンの端部
に前記回路パターンの幅と異なる形状のパッド部を付設
し、かつ前記ランドおよびパッドの部分を除いて基板表
面を絶縁性を有する膜で被覆したことを特徴とする印刷
配線板。A land is provided on the surface of the insulating substrate to be connected to the through-hole conductive layer, and among the circuit patterns connected to the land, one end of the circuit pattern that is not connected to the land has a shape different from the width of the circuit pattern. 1. A printed wiring board, characterized in that a pad portion is provided, and the surface of the substrate except for the land and pad portions is covered with an insulating film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8725682U JPS58189567U (en) | 1982-06-11 | 1982-06-11 | printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8725682U JPS58189567U (en) | 1982-06-11 | 1982-06-11 | printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58189567U true JPS58189567U (en) | 1983-12-16 |
Family
ID=30095982
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8725682U Pending JPS58189567U (en) | 1982-06-11 | 1982-06-11 | printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58189567U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5519014U (en) * | 1978-07-24 | 1980-02-06 |
-
1982
- 1982-06-11 JP JP8725682U patent/JPS58189567U/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5519014U (en) * | 1978-07-24 | 1980-02-06 |
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