JPS6020163U - printed wiring board - Google Patents
printed wiring boardInfo
- Publication number
- JPS6020163U JPS6020163U JP11281783U JP11281783U JPS6020163U JP S6020163 U JPS6020163 U JP S6020163U JP 11281783 U JP11281783 U JP 11281783U JP 11281783 U JP11281783 U JP 11281783U JP S6020163 U JPS6020163 U JP S6020163U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- hole
- solder resist
- connection pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の印刷配線板のランド部の平面図、第２図
はそのランド部に対すや照明バルブの取付状態を示す断
面図、第３図は従来のランド部に対する半田付は状態を
示す断面図、第４図乃至第８図は本考案印刷配線板の一
実施例を示すランド部の平面図、第９図、第１０図は前
記第４図乃至第８図のランド部に対する半田付は状態を
示す断面図、第１１図は本考案印刷配線板の他の実施例
を示すランド部の断面図である。
１・・・・・・絶縁性基板、２・・・・・・透孔、３・
・・・・・接続用パターン、３ａ・・・・・・欠如、４
・・・・・・ソルダーレジスト、５・・・・・・部品、
６・・・・・・マスキング用の耐熱テープ、７・・・・
・・半田。各図中、同一符号は同一または共通部分を示
す。Figure 1 is a plan view of the land of a conventional printed wiring board, Figure 2 is a sectional view showing how a lighting bulb is attached to the land, and Figure 3 is a diagram showing the state of soldering to the land. 4 to 8 are plan views of a land portion showing an embodiment of the printed wiring board of the present invention, and FIGS. 9 and 10 are solder diagrams for the land portions shown in FIGS. 4 to 8. 11 is a cross-sectional view of a land portion showing another embodiment of the printed wiring board of the present invention. 1...Insulating substrate, 2...Through hole, 3.
... Connection pattern, 3a... Missing, 4
...Solder resist, 5...Parts,
6...Heat-resistant tape for masking, 7...
··solder. In each figure, the same reference numerals indicate the same or common parts.
Claims (1)
に、前記透孔２に挿着される部品５との電気的接触を行
う接続用パターン３が印刷成形されてなる印刷配線板に
おいて、前記接続用パターン３はその表面が箔の欠如３
ａ又はソルダーレジスト４の塗布によって多数に分割さ
れてなることを特徴とする印刷配線板。Printing in which a connection pattern 3 for making electrical contact with a component 5 inserted into the through hole 2 is printed on the surface of the substrate 1 around a through hole 2 formed in the insulating substrate 1. In the wiring board, the connection pattern 3 has a surface lacking foil 3.
A printed wiring board characterized in that it is divided into a large number of parts by applying a solder resist 4 or a solder resist 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11281783U JPS6020163U (en) | 1983-07-20 | 1983-07-20 | printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11281783U JPS6020163U (en) | 1983-07-20 | 1983-07-20 | printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6020163U true JPS6020163U (en) | 1985-02-12 |
Family
ID=30261394
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11281783U Pending JPS6020163U (en) | 1983-07-20 | 1983-07-20 | printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6020163U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62203398A (en) * | 1986-03-04 | 1987-09-08 | 松下電器産業株式会社 | Shielding of printed board |
| JPH0275775U (en) * | 1988-11-30 | 1990-06-11 | ||
| JPH031471U (en) * | 1989-05-22 | 1991-01-09 | ||
| JP2018129393A (en) * | 2017-02-08 | 2018-08-16 | オムロンオートモーティブエレクトロニクス株式会社 | Printed board and electronic equipment |
-
1983
- 1983-07-20 JP JP11281783U patent/JPS6020163U/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62203398A (en) * | 1986-03-04 | 1987-09-08 | 松下電器産業株式会社 | Shielding of printed board |
| JPH0275775U (en) * | 1988-11-30 | 1990-06-11 | ||
| JPH031471U (en) * | 1989-05-22 | 1991-01-09 | ||
| JP2018129393A (en) * | 2017-02-08 | 2018-08-16 | オムロンオートモーティブエレクトロニクス株式会社 | Printed board and electronic equipment |
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