JPS62203398A - Shielding of printed board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method for shielding a printed circuit board, which maintains good electrical contact between the ground plane of the printed circuit board and a shield plate in electronic equipment construction. .

2. Description of the Related Art Conventionally, when a printed circuit board 3 is mounted on a casing 1 shown in FIG.
As shown in FIG. 5, an end portion of a shield plate 8 has been brought into pressure contact with a ground pattern 3a to which a solder layer 5a is adhered.

Problems to be Solved by the Invention However, in the conventional method described above, the width of the ground pattern 3a is not uniform over the entire surface in contact with the shield plate 8, and therefore, the height dd of the solder layer 5a also varies depending on the location. Therefore, there was a drawback that there were some places where the shielding effect was insufficient.

An object of the present invention is to eliminate the drawbacks of the above-mentioned conventional examples and to provide a shielding method for a printed circuit board that can obtain good grounding over the entire contact surface with the shield wall, that is, a shielding effect, by a simple method. It is something.

Means for Solving the Problems In order to achieve the above object, the present invention has a method in which a solder layer of a constant width and a non-solder resistor layer are alternately sandwiched relatively between the earth pattern of the printed circuit board that contacts the shield wall. It is configured to have a striped pattern arrangement.

Therefore, according to the present invention, since the width of the solder layer is constant, its bulge is also almost uniform, and therefore it is crimped uniformly over the entire contact surface with the shield wall, and therefore a good shielding effect is achieved. That's what you get.

EXAMPLES Hereinafter, examples of the present invention will be described with reference to the drawings. Third
The figure shows an overall view of the casing, FIG. 1 shows a sectional view, and FIG. 2 shows a bottom view. In these figures, 1 is the case, 2 is its side wall,
3 is a printed circuit board held inside the housing 1 by set screws 4, 5 is a strip-shaped solder layer (width - W) provided on the ground pattern surface 3a made of copper foil, etc. of the printed circuit board 4, and 6 is a solder layer. 5 and adjacent resist layers, 7 are electronic components mounted on the upper surface of the printed circuit board 3, and 8 is a shield wall, which is fixed to the side wall 2 and is formed of die cast or sheet metal. Reference numeral 9 denotes a holding portion provided below the set screw 4 of the printed circuit board.

Next, the operation of the above configuration will be explained. A grounding pattern 3a is provided on the lower surface of the printed circuit board 3 fixed to the holding part 9 of the housing 1 with a set screw 4, and a solder layer of a certain width (approximately 1 to several mm) is provided on the grounding pattern 3a. It is formed using methods such as automatic soldering. Since this solder layer 5 has a constant width W, a bulge d of a constant thickness is obtained due to surface tension. Therefore, as shown in FIG. 1, the entire upper part of the shield wall 8 is in close contact with the solder layer. (In Fig. 1, the bulge d is also exaggerated for the convenience of explanation.) Next, Fig. 4 shows the solder layer 5 provided on the ground pattern 3a.
FIG. 2 is a diagram showing examples of various shapes of resist layers,
(B) shows an example in which the width W is constant, and (C) shows an example in which L is changed while keeping W constant in consideration of the elasticity of the printed circuit board 3 and the deflection due to the distance from its edge. ) is an example in which the solder layer is provided obliquely so as to increase the contact area with the shield wall 8.

Effects of the Invention As is clear from the above embodiments, the present invention has a ground pattern of a printed circuit board having a solder layer of a constant width, and the striped solder forms a surface between the ground pattern of the printed circuit board and the resist layer. Soldering has the characteristic that a good shielding effect can be obtained over the entire surface of the shield wall by pressure bonding between the surface and the shield wall.

[Brief explanation of drawings]

FIG. 1 is a sectional view of an apparatus in which a printed circuit board shielding method according to an embodiment of the present invention is used, FIG. 2 is a bottom view of the same, FIG. 3 is a perspective view showing the overall configuration of the apparatus, and FIG. 4 (A
)-4DJ is a plan view of essential parts of various ground patterns of the device, and FIG. 5 is a sectional view of essential parts in a conventional printed circuit board shielding method configuration. 1... Housing, 2... Side wall, 3... Printed circuit board,
3a...Earth pattern, 5...Solder layer, 6...
・Resist layer, 8 shield wall. Name of agent: Patent attorney Toshio Nakao (1st person)
Figure WJ z Figure
6/6'J Figure 3 Figure 4 Figure 5

Claims (1)

[Claims] A printed circuit board shield in which a solder layer of a constant width and a resist layer to which no solder is adhered are alternately formed in a striped pattern on the ground pattern surface of the printed circuit board, and the end of the shield plate is crimped to the solder layer. Method.