JPS5866679U - Printed wiring body with ground plate - Google Patents
Printed wiring body with ground plateInfo
- Publication number
- JPS5866679U JPS5866679U JP16089181U JP16089181U JPS5866679U JP S5866679 U JPS5866679 U JP S5866679U JP 16089181 U JP16089181 U JP 16089181U JP 16089181 U JP16089181 U JP 16089181U JP S5866679 U JPS5866679 U JP S5866679U
- Authority
- JP
- Japan
- Prior art keywords
- wiring body
- printed
- printed wiring
- sub
- printed board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図乃至第５図はプリント配線体の従来例を示す図面
、第６図は本考案に係るプリント配線体の要部を示す部
分断面図、及び第７図は本考案に係るプリント配線体を
他の具体例であり、電子チューナのアース片としての利
用を示す部分断面図である。
２０・・・メインプリント基板、２Ｆ・・・サブプリン
ト基板、２２・・・嵌合穴、２３・・・凸部、２４・・
・リード用導電ランド、２５・・・金属薄板（シールド
板）、２８．２９・・・導電ランド、３０．３１・・・
半田。
第５図
Ｚ Ｚ1 to 5 are drawings showing conventional examples of printed wiring bodies, FIG. 6 is a partial sectional view showing the main parts of the printed wiring body according to the present invention, and FIG. 7 is a printed wiring body according to the present invention. is another specific example, and is a partial sectional view showing its use as a grounding piece of an electronic tuner. 20... Main printed circuit board, 2F... Sub printed circuit board, 22... Fitting hole, 23... Convex portion, 24...
・Conductive land for lead, 25... Metal thin plate (shield plate), 28.29... Conductive land, 30.31...
solder. Figure 5 Z Z
Claims (2)
ント基板の周縁部に形成した凸部を嵌合して両プリント
基板の導電ランド間を半田結合するプリント配線体にお
いて、前記サブプリント基板はその一方の面に導電ラン
ドを一体に形成し、また、他方の面に金属薄板を載置し
、前記凸部の両面側で前記メインプリント基板に一体形
成された所定の導電ランド部分と半田固着したことを特
徴とするプリント配線体。(1) In a printed wiring body in which a protrusion formed on the peripheral edge of a sub-printed board is fitted into a fitting hole formed on a main printed board to connect conductive lands of both printed boards by soldering, the sub-printed board is A conductive land is integrally formed on one surface, and a thin metal plate is placed on the other surface, and is soldered to a predetermined conductive land portion integrally formed on the main printed circuit board on both sides of the convex portion. A printed wiring body characterized by:
ら延びる条片部分を一体形成して成り、この条片部分を
アースバネとして利用した実用新案登録請求の範囲第１
項に記載のプリント配線体。(2) The thin metal plate is formed by integrally forming a strip portion extending from the convex side of the sub-printed board, and the strip portion is used as an earth spring.Claim 1 of Utility Model Registration:
Printed wiring body as described in section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16089181U JPS5866679U (en) | 1981-10-27 | 1981-10-27 | Printed wiring body with ground plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16089181U JPS5866679U (en) | 1981-10-27 | 1981-10-27 | Printed wiring body with ground plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5866679U true JPS5866679U (en) | 1983-05-06 |
Family
ID=29953279
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16089181U Pending JPS5866679U (en) | 1981-10-27 | 1981-10-27 | Printed wiring body with ground plate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5866679U (en) |
-
1981
- 1981-10-27 JP JP16089181U patent/JPS5866679U/en active Pending
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