JPH05136593A - Shield structure - Google Patents

Abstract

PURPOSE:To obtain a shielding structure which is small in number of component parts, space-saving, and easily mounted by a method wherein the terminal exposed part of a connector is covered with an FPC, and the FPC is connected to a board with solder. CONSTITUTION:The exposed part of a terminal 34 of a connector 32 is covered with a flexible printed circuit(FPC) 33. The FPC 33 and a board 31 are connected together through such a manner that the FPC 33 is fixed to a conduction solid pattern 36 formed on the board 31 with solder 35. By this setup, a shield structure which is small in number of component parts, space-saving, and easily mounted can be obtained.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a shield structure for a terminal exposed portion of a connector mounted on a board such as a printed board unit or a flexible printed circuit (hereinafter referred to as FPC).

With the recent miniaturization of information processing systems,
High-density packaging technology is required, and digital / analog LSIs are supplied for electronic circuits, and FPCs capable of effectively wiring a small space including a mechanical section (mechanical section) are supplied.

In order to realize miniaturization, for example,
The circuit is divided by function, and it is inevitably mounted on the device as a printed circuit board unit (hereinafter referred to as PCA) and mounted in the device or as a PCA combined with other completely different functional circuits. These signals, for example, a digital control signal or an analog weak signal are connected using the FPC mentioned above.

Further, since these information devices are often used in the office environment, it is necessary to prevent the other devices from being affected by the electromagnetic waves emitted from or entering the devices. It is necessary to electromagnetically shield an FPC that transmits a weak signal or a high frequency signal with the information device itself, or a terminal of a connector that causes generation or intrusion of electromagnetic waves.

[0005]

2. Description of the Related Art Next, a conventional example will be described with reference to the drawings. 10 is a diagram illustrating a first example of a conventional shield structure, FIG. 11 is a cross-sectional view of a main part in FIG. 10, FIG. 12 is a diagram illustrating a second example of a conventional shield structure, and FIG. 14 is a cross-sectional view of a main part in FIG. 14, FIG. 14 is a view for explaining a third example of the conventional shield structure, and FIG. 15 is an enlarged cross-sectional view of a main part in FIG.

First, a first example of a conventional shield structure will be described with reference to FIGS. 10 and 11. In FIG. 10, a connector 2 is attached to the printed board 1. A shield plate 3 formed by sheet metal working of a thin plate of aluminum or the like is attached to the terminal portion 2a of the connector 2 so as to cover the terminal portion 2a.

The method for attaching the shield plate 3 is shown in FIG.
As shown in FIG. 1, in the through hole portion 4 of the printed board 1,
The lower end portion of the shield plate 3 is inserted, and the inserted portion is attached using the solder 5.

Next, a second example of the conventional shield structure will be described with reference to FIGS. 12 and 13. In FIG. 12, a connector 2 is attached to the printed board 1. A shield plate 3 formed by sheet metal working of a thin plate of aluminum or the like is attached to the terminal portion 2a of the connector 2 so as to cover the terminal portion 2a.

The method of attaching the shield plate 3 is shown in FIG.
As shown in FIG. 3, a screw hole 3a is provided at the lower end of the shield plate 3, and the screw hole 3a and the through hole portion (solid pattern) 4 of the printed board 1 are attached using screws 5, nuts 6 and washers 7. ing.

Next, a third example of the conventional shield structure will be described with reference to FIGS. 14 and 15. In FIG. 14, the first connector 8 is mounted on the printed board 1. On the other hand, a second connector 10 connected to the first connector 8 is attached to the FPC 9.

Next, the shield structure at the joint between the first connector 8 and the second connector 10 will be described with reference to FIG. The second connector 10 and the FPC 9 are attached by mounting the first reinforcing plate 11 and the first shield plate 12 on one surface of the FPC 9 and the second reinforcing plate 13 and the second shield plate 12 on the other surface.
The shield plate 14 is attached using screws 15, nuts 16 and washers 17. The second shield plate 14 is set to have a shape that covers the joint between the first connector 8 and the second connector 10.

Then, the second shield plate 14 connects the through hole portion (solid pattern) 4 of the printed board 1 with the screw 1
8, nuts 19 and washers 20 are attached.

In recent years, instead of a thin plate material such as aluminum, a conductive sheet in which soft aluminum is deposited on flame-retardant vinyl chloride is used. The conductive sheet is attached to the substrate or the like by using screws or the like.

[0014]

However, in the conventional example having the above-mentioned structure, in the first and second examples, since a shield plate is used, a large mounting space is required,
The small device has a problem that it is difficult to secure a space. Furthermore, when soldering the shield plate, you must use a trowel with high power in consideration of the heat dissipation of the shield plate itself, but the heat from the iron may damage the PCA. Has a problem that it needs to be performed by a skilled person to some extent.

In the third example, as in the first and second examples, since a plurality of shield plates are used, a large space is required and there is a problem that the assembly work efficiency is reduced. Furthermore, due to surface treatment of the shield plate and rust over time due to contact between different metals, PCA and FPC
There is also a problem that it is not possible to obtain sufficient continuity with.

Finally, although the method using the conductive sheet saves space, it has to be attached with screws or the like, which requires a lot of man-hours. Further, since the conductor portion is exposed on one surface of the conductive sheet, there is a problem that it may come into contact with the terminal of the circuit to be shielded.

The present invention has been made in view of the above problems, and its object is to reduce the number of constituent parts, save space, and
It provides a shield structure that is easy to install.

[0018]

FIG. 1 is a diagram showing the first principle of the present invention. FIG. 1 (a) is a diagram for explaining the whole, FIG. 1 (b) is an enlarged view of a main part, and FIG. It is a second principle diagram,
(A) figure is a figure explaining the whole, (b) figure is a principal part enlarged view.

First, the first principle diagram will be described with reference to FIG. 31 is a printed board unit or flexible
A printed circuit (hereinafter referred to as FPC) substrate or the like, and 32 is a connector attached to the substrate 31.
An FPC 33 covers the exposed portion of the terminal 34 of the connector 32. As for the connection between the FPC 33 and the substrate 31, the FPC 33 is attached to the conductive solid pattern 36 formed on the substrate 31 by using the solder 35 as shown in FIG.

Next, the second principle diagram will be described with reference to FIG. The same parts as those in FIG. 1 are designated by the same reference numerals and the description thereof will be omitted. As for the connection between the FPC 33 and the substrate 31, the FPC 33 is attached to the through hole 37 formed in the substrate 31 using the solder 35 as shown in FIG.

[0021]

In the shield structure of the present invention, the FPC 33 is used as the shield material, and the attachment to the substrate 31 is performed by the solder 35.
By using, the number of components is small, the space is saved, and the installation is easy.

[0022]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of the present invention will be described with reference to the drawings. 3 is a diagram showing a first embodiment of the present invention, and FIG. 4 is a diagram showing FIG.
5 is an enlarged exploded view of an essential part of FIG. 5, FIG. 5 is a diagram showing a second embodiment of the present invention, FIG. 6 is an enlarged exploded view of an essential part of FIG. 5, and FIG. 8 is a front cross-sectional configuration diagram in FIG. 7, and FIG. 9 is an enlarged view of a main part in FIG.

First, the first aspect of the present invention will be described with reference to FIGS. 3 and 4.
An example will be described. In FIG. 3, an FPC with a three-layer structure
A connector 42 is attached to 41. The FPC 41 on the side where the terminal 46 of the connector 42 is exposed
On the surface of the 1st layer of FP for shielding via the protective plate 43.
C44 is attached using solder 45.

Next, referring to FIG. 4, the shielding FPC 4
4 and the FPC 41 will be described. The protective plate 43 is provided with a hole 43a into which the terminal 46 of the connector 42 is inserted. At the edge of the FPC 44 for shielding, the polyimide protective layer is removed, and a conductor exposed portion 44a is formed in which the copper foil layer that is the conductor is exposed to the outside. Furthermore,
A through hole 44b is formed in the exposed portion 44a.

Similarly, at the edge of the FPC 41, the polyimide protective layer is removed so as to face the conductor exposed portion 44a of the shielding FPC 44, and the conductor exposed portion 41a where the copper foil layer as the conductor portion is exposed to the outside. Are formed.

Then, the protection plate 43 is set on the FPC 41, and the shield FPC 41 is placed on the protection plate 43.
The conductor-exposed portion 44a and the conductor-exposed portion 41a are connected by the solder 45 and are electrically connected.

According to the above configuration, the terminal 4 of the connector 42
6 The exposed portion is covered with the FPC 44 for shielding, and the connection with the FPC 41, which is the substrate, is made by using the solder 45. Therefore, the number of components is small and the mounting is easy.

Moreover, a low power consumption type may be used for soldering, and the skill is not required for the work. Further, by conducting soldering, it is possible to sufficiently obtain conduction between the FPC 44 for shielding and the FPC 41 which is the substrate. Further, since the FPC 44 is covered with a protective layer of polyimide, which is an insulator, except for the portion to be soldered, it does not come into contact with the terminals of the circuit to be shielded like a conductive sheet.

Next, the second embodiment of the present invention will be described with reference to FIGS.
An example will be described. The same parts as those in the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.

The difference between this embodiment and the first embodiment is that
The printed circuit board 51 having a three-layer structure is used instead of the FPC 41. As shown in FIG.
The conductor exposed portion 44a of the shielding FPC 44 is provided at the edge of the
The protective layer is removed, and a conductor exposed portion 51a is formed so that the conductor portion is exposed to the outside.

Then, the protection plate 43 is set on the FPC 41, and the shield FPC 41 is placed on the protection plate 43.
The conductor-exposed portion 44a and the conductor-exposed portion 51a are connected by the solder 45 and are electrically connected.

According to the above configuration, the terminal 4 of the connector 42
6 Exposed part is protective plate 43 and FPC44 for shield
Since it is covered with and the connection with the printed circuit board 51 is made by using the solder 45, the number of components is small and the mounting is easy.

Moreover, a low power consumption type may be used for soldering, and the skill is not required for the work. Further, by conducting soldering, it is possible to sufficiently obtain conduction between the shield FPC 44 and the printed circuit board 51. Further, since the FPC 44 is covered with a protective layer of polyimide, which is an insulator, except for the portion to be soldered, it does not come into contact with the terminals of the circuit to be shielded like a conductive sheet. Next, a third embodiment of the present invention will be described with reference to FIGS. 7 and 8
In the figure, 61 is a printed circuit board (or FPC), and 62 is a connector surface-mounted on the printed circuit board 61.
The terminal 63 of the connector 62 is covered with a shield FPC 64, and the peripheral portion of the printed circuit board 61 is made of solder 65.
Is attached to.

Next, the attachment of the FPC 64 and the printed circuit board 61 will be described with reference to FIG. FPC for shield
A conductor exposed portion 64a is formed on the peripheral portion of 64 as in the first and second embodiments. On the other hand, the printed circuit board 6
1 also has a solid pattern 66 facing the conductor exposed portion 64a of the FPC 64, both of which are connected by using a solder 65 so that electrical continuity is established.

According to the above configuration, the terminal 6 of the connector 62
(3) Since the exposed portion is covered with the FPC 64 for shielding and the connection with the printed circuit board 61 is made by using the solder 65, the number of components is small and the mounting is easy.

In addition, a low power consumption type may be used for soldering, so that no skill is required for the work. Furthermore, by conducting soldering, it is possible to sufficiently obtain conduction between the shield FPC 64 and the printed circuit board 61. Further, since the FPC 64 is covered with a protective layer of polyimide, which is an insulator, except for the portion to be soldered, it does not come into contact with the terminals of the circuit to be shielded like a conductive sheet.

[0037]

As described above, according to the present invention, it is possible to realize a shield structure which has a small number of constituent parts, saves space, and is easily mounted.

[Brief description of drawings]

FIG. 1 is a first principle diagram of the present invention.

FIG. 2 is a second principle diagram of the present invention.

FIG. 3 is a diagram showing a first embodiment of the present invention.

FIG. 4 is an enlarged exploded view of a main part in FIG.

FIG. 5 is a diagram showing a second embodiment of the present invention.

FIG. 6 is an enlarged exploded view of a main part in FIG.

FIG. 7 is a perspective view showing a third embodiment of the present invention.

FIG. 8 is a front cross-sectional configuration diagram in FIG.

FIG. 9 is an enlarged view of a main part in FIG.

FIG. 10 is a diagram illustrating a first example of a conventional shield structure.

11 is a cross-sectional view of the main parts in FIG.

FIG. 12 is a diagram illustrating a second example of a conventional shield structure.

13 is a cross-sectional view of the main parts in FIG.

FIG. 14 is a diagram illustrating a third example of a conventional shield structure.

15 is an enlarged cross-sectional view of the main parts in FIG.

[Explanation of symbols]

 31 substrate 32 connector 33 FPC 34 terminal 35 solder

Claims (3)

[Claims] 1. A shield structure of a terminal (34) exposed portion of a connector (32) attached to a substrate (31) such as a printed board unit or a flexible printed circuit, wherein the terminal (34) of the connector (32) is exposed. FPC part
A shield structure covered with (33) and using solder (35) for connection to the substrate (31). 2. The shield structure according to claim 1, wherein the board and the FPC are connected by using a solid pattern formed on the board. 3. The shield structure according to claim 2, wherein the substrate and the FPC are connected by using a through hole formed in the substrate.