JPH021920Y2 - - Google Patents
Info
- Publication number
- JPH021920Y2 JPH021920Y2 JP7153284U JP7153284U JPH021920Y2 JP H021920 Y2 JPH021920 Y2 JP H021920Y2 JP 7153284 U JP7153284 U JP 7153284U JP 7153284 U JP7153284 U JP 7153284U JP H021920 Y2 JPH021920 Y2 JP H021920Y2
- Authority
- JP
- Japan
- Prior art keywords
- shielding plate
- printed wiring
- wiring board
- metal plate
- electromagnetic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002184 metal Substances 0.000 claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000011810 insulating material Substances 0.000 claims description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
【考案の詳細な説明】
本考案は遮蔽板に係り、とくに印刷配線板の回
路部品或いは信号パターン上などに容易に取付け
可能で接地が強化できる遮蔽板に関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a shielding plate, and more particularly to a shielding plate that can be easily attached to circuit components or signal patterns of a printed wiring board and can strengthen grounding.
(a) 産業上の利用分野
近年電子機器は小形化の要望が強く、したがつ
て印刷配線板への部品実装は高密度化の一途をた
どつており、当然印刷配線パターンが輻輳して接
地パターンが少なくなるとともに、電磁波ノイズ
を発生する部品の他の部分への影響もあるので、
電磁波ノイズの遮蔽および接地強化の対策が強く
要望されている。なお本考案の電磁波ノイズとは
輻射される電界、磁界或いは電磁界ノイズをい
う。(a) Industrial fields of use In recent years, there has been a strong demand for smaller electronic devices, and as a result, the mounting density of components on printed wiring boards has continued to increase, which naturally leads to congested printed wiring patterns and grounding problems. As the number of patterns decreases, it also affects other parts of the component that generate electromagnetic noise.
There is a strong demand for measures to shield electromagnetic noise and strengthen grounding. Note that electromagnetic wave noise in the present invention refers to radiated electric field, magnetic field, or electromagnetic field noise.
(b) 従来の技術
従来印刷配線板に実装され電磁波ノイズを発生
する部品或いは電磁波ノイズによつて影響を受け
る部品、たとえばIC，LSI等の電磁遮蔽対策、お
よび高密度実装による信号パターンの輻輳によつ
て接地パターンの容量減少による電源インピーダ
ンスの低減対策は一般の印刷配線板では不可能の
ため、多層印刷配線板に依存しなければならなか
つた。ところが多層印刷配線板は高価なためコス
ト高になるという問題点があつた。(b) Conventional technology Measures for electromagnetic shielding of components conventionally mounted on printed wiring boards that generate electromagnetic noise or are affected by electromagnetic noise, such as ICs and LSIs, and for signal pattern congestion due to high-density mounting. Therefore, it is impossible to reduce the power source impedance by reducing the capacitance of the ground pattern using a general printed wiring board, and therefore it is necessary to rely on a multilayer printed wiring board. However, since multilayer printed wiring boards are expensive, there has been a problem in that the cost is high.
(c) 考案が解決しようとする問題点
本考案は上記従来の問題点を解決するためにな
されたもので、印刷配線板に接続が可能な複数の
端子を周縁に選択的に或いは全周に設けた導電性
金属板の、端子を除く金属板に絶縁被覆を施し、
電磁遮蔽、接地強化を図つた新規なる遮蔽板を提
供することを目的とするものである。(c) Problems to be solved by the invention This invention was made to solve the above-mentioned conventional problems, and includes a plurality of terminals that can be connected to a printed wiring board selectively or all around the periphery. Apply an insulating coating to the provided conductive metal plate, excluding the terminals,
The purpose of this invention is to provide a new shielding plate that enhances electromagnetic shielding and grounding.
(d) 問題点を解決するための手段
その目的を達成するために本考案は、印刷配線
板に実装された部品の遮蔽板であつて、前記遮蔽
板はその周縁に複数のリード端子を突出した金属
薄板で形成するとともに、前記リード端子を除く
金属板を軟質の絶縁体部材で被覆したことによつ
て達成される。(d) Means for solving the problem In order to achieve the object, the present invention provides a shielding plate for components mounted on a printed wiring board, the shielding plate having a plurality of lead terminals protruding from its periphery. This is achieved by forming the metal plate from a thin metal plate and covering the metal plate except for the lead terminal with a soft insulating material.
(e) 作用
即ち本考案においては、印刷配線板に接続が可
能な複数の端子を周縁に設けた導電性金属板の、
端子を除く金属板に絶縁被覆を施した電磁遮蔽板
を電磁波ノイズを発生し或いは影響される部品を
遮蔽する形に取付けて電磁遮蔽を行なうか、信号
パターン上に積重ねて接地強化を行なつて電源イ
ンピーダンスの低減を図つた構造としたものであ
る。(e) Effect In other words, in the present invention, a conductive metal plate is provided with a plurality of terminals on its periphery that can be connected to a printed wiring board.
Install an electromagnetic shielding plate, which is a metal plate with an insulating coating on the metal plate excluding the terminals, to shield parts that generate or are affected by electromagnetic noise, or stack it on the signal pattern to strengthen the grounding. The structure is designed to reduce power supply impedance.
(f) 実施例
以下図面を参照しながら本考案に係る遮蔽板の
実施例について詳細に説明する。(f) Examples Examples of the shielding plate according to the present invention will be described in detail below with reference to the drawings.
第１図は、本考案に係る遮蔽板の一実施例を説
明するためのａは外観斜視図、ｂは側断面図であ
る。 In FIG. 1, a is an external perspective view and b is a side sectional view for explaining one embodiment of a shielding plate according to the present invention.
導電性の良好な金属たとえば銅等からなる遮蔽
板１はブランク加工等により金属板部１１とリー
ド端子１２が形成されており、リード端子１２は
金属板部１１の両端に複数本づつ形成して、図示
しない印刷配線板に接続するようになつており、
金属板部１１には柔軟性のあるたとえばビニール
等の絶縁部材２で被覆を施した構成である。 A shielding plate 1 made of a metal with good conductivity, such as copper, has a metal plate portion 11 and lead terminals 12 formed by blanking or the like, and a plurality of lead terminals 12 are formed at both ends of the metal plate portion 11. , is designed to be connected to a printed wiring board (not shown),
The metal plate portion 11 is coated with a flexible insulating member 2 such as vinyl.
第２図は、本考案に係る電磁遮蔽板の構造の実
装例を説明するためのａは電磁遮蔽板として用い
た場合の側面図、ｂは接地強化として用いた場合
の側面図で、第１図と同等の部分については同一
符号を付している。 Figure 2 is for explaining an example of implementation of the structure of the electromagnetic shielding plate according to the present invention, where a is a side view when used as an electromagnetic shielding plate, and b is a side view when used as a grounding reinforcement. Parts that are equivalent to those in the figure are given the same reference numerals.
第２図ａは印刷配線板３に実装された電磁波ノ
イズを発生する部品４の、他への電磁妨害を防止
するために部品４を覆うように、電磁遮蔽板５を
を折り曲げてリード端子１２を印刷配線板３に半
田等で接着した構造である。第２図ｂは印刷配線
板３に形成されている接地パターンの容量が小さ
くて、電源インピーダンスが高くなることを防止
する対策として、信号パターンに積重ねる形で電
磁遮蔽板５を搭載して印刷配線板３に半田等で接
着して電源インピーダンスを低減した構造であ
る。 In FIG. 2a, an electromagnetic shielding plate 5 is bent to cover a component 4 that generates electromagnetic noise mounted on a printed wiring board 3 in order to prevent electromagnetic interference to other components. It has a structure in which it is bonded to a printed wiring board 3 with solder or the like. In Figure 2b, the capacitance of the grounding pattern formed on the printed wiring board 3 is small, and as a measure to prevent the power supply impedance from becoming high, an electromagnetic shielding plate 5 is mounted on the signal pattern and printed. It has a structure in which the power supply impedance is reduced by bonding it to the wiring board 3 with solder or the like.
なお、本実施例では絶縁部材２をビニールにつ
いて説明したが、ビニールに限らず他のであつて
も構わない。またリード端子１２は金属板部１１
の２方向に設けた説明をしたが、３方向あるいは
全周即ち４方向に形成しても構わない。 In this embodiment, the insulating member 2 is made of vinyl, but it is not limited to vinyl and may be made of other materials. Further, the lead terminal 12 is connected to the metal plate portion 11.
Although the explanation has been given in which they are provided in two directions, they may be formed in three directions or all around the circumference, that is, in four directions.
(g) 考案の効果
以上の説明から明らかなように本考案に係る遮
蔽板によれば、電磁波ノイズの外部への流失が防
止できるとともに、電源インピーダンスの低減で
き、信号パターン化率が向上してコストダウンが
期待できる。(g) Effects of the invention As is clear from the above explanation, the shielding plate according to the invention can prevent electromagnetic noise from flowing outside, reduce power source impedance, and improve the signal patterning rate. Cost reduction can be expected.
第１図は、本考案に係る遮蔽板の一実施例を説
明するためのａは外観斜視図、ｂは側断面図、第
２図は、本考案に係る遮蔽板の実装例を説明する
ためのａは電磁遮蔽板として用いた場合の側面
図、ｂは接地強化として用いた場合の側面図であ
る。
図において、１は遮蔽板、２は絶縁部材、３は
印刷配線板、４は部品、５は電磁遮蔽板、１１は
金属板部、１２はリード端子をそれぞれ示す。
FIG. 1 is a perspective view of an external appearance, b is a side sectional view, and FIG. 2 is a diagram illustrating an example of implementation of a shielding plate according to the present invention. Fig. 2a is a side view when used as an electromagnetic shielding plate, and b is a side view when used as ground reinforcement. In the figure, 1 is a shielding plate, 2 is an insulating member, 3 is a printed wiring board, 4 is a component, 5 is an electromagnetic shielding plate, 11 is a metal plate portion, and 12 is a lead terminal.
Claims (1)
て、前記遮蔽板はその周縁に複数のリード端子を
突出した金属薄板で形成するとともに、前記リー
ド端子を除く金属板を軟質の絶縁体部材で被覆し
たことを特徴とする遮蔽板。 A shielding plate for components mounted on a printed wiring board, wherein the shielding plate is formed of a thin metal plate with a plurality of lead terminals protruding from its periphery, and the metal plate other than the lead terminals is made of a soft insulating material. A shielding plate characterized by being coated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7153284U JPS60183498U (en) | 1984-05-15 | 1984-05-15 | Shield |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7153284U JPS60183498U (en) | 1984-05-15 | 1984-05-15 | Shield |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60183498U JPS60183498U (en) | 1985-12-05 |
| JPH021920Y2 true JPH021920Y2 (en) | 1990-01-17 |
Family
ID=30609117
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7153284U Granted JPS60183498U (en) | 1984-05-15 | 1984-05-15 | Shield |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60183498U (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3497114B2 (en) * | 2000-04-24 | 2004-02-16 | 北川工業株式会社 | Electronic component coating structure and electronic component coating method |
-
1984
- 1984-05-15 JP JP7153284U patent/JPS60183498U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60183498U (en) | 1985-12-05 |
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