JP3497114B2 - Electronic component coating structure and electronic component coating method - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component coating structure for coating an electronic component and a method for coating an electronic component,
More specifically, the present invention relates to an electronic component coating structure for coating an electronic component for electromagnetic wave shielding and a method for coating an electronic component.

[0002]

2. Description of the Related Art Conventionally, it is prevented that an electromagnetic wave from the outside is superimposed as noise on a signal input to or output from an electronic component, or an electromagnetic wave generated by the electronic component itself is superimposed on another signal as noise. Therefore, it has been considered to cover the electronic component with a metal case and connect the case to a ground electrode to shield the electromagnetic wave.
Further, as this type of case, a box-shaped case having a rectangular parallelepiped shape whose lower surface is opened is generally considered.

[0003]

However, it is necessary for the case to cover the entire electronic components, and it is required that the case be as small as possible. For this reason, the cases are individually made, for example, in a size corresponding to the size of the electronic component. Therefore, a mold has to be prepared every time the case is prepared, and the cost required for the covering is high.

Therefore, the present invention provides a coating structure for an electronic component and a method for coating an electronic component, which can favorably reduce the cost required for coating even when the size of the electronic component to be coated varies. It was made for the purpose of provision.

[0005]

In order to achieve the above object, the invention according to claim 1 is directed to a covering portion for covering the electronic component from the surface side, and a direction opposite to each other from the covering portion. projecting, electronic components mounted on the printed circuit board by using the axial lead which is fixed to the distal end to the carrier tape, the child part of the covering casing electrodeposition having a
A covering structure for an electronic component, the electronic component comprising:
Use multiple covered cases and attach the above axial leads.
Bend at a position according to the size of the electronic component, and
The above-mentioned coating so that the projecting directions of the Charl leads are different from each other.
Place the parts on top of each other by stacking them on top of each other
With the above-mentioned axial lead on the periphery of the above electronic parts.
It is characterized in that it is connected to the printed wiring board .

According to the coating structure of the present invention thus constructed, the axial lead of the coating case is bent at a position corresponding to the size of the electronic component, and the coating portion is provided on the front surface side of the electronic component. And is used by connecting the axial lead to a printed wiring board (in most cases, its ground electrode) around the electronic component. That is, the coating case, since the projecting an axial lead in opposite directions to each other from the coating unit, various sizes of electronic by bending the axial lead at a position corresponding to the width and height of the electronic component The component can be coated well. When the electronic component is coated in this way, the coating portion is provided on the surface side of the electronic component, and the axial lead is provided around the electronic component, so that the electromagnetic waves entering and leaving the electronic component can be shielded by the cooperation of both. You can

Therefore, according to the coating structure of the electronic component of the present invention, the cost required for coating can be favorably reduced even when the size of the electronic component to be coated varies. Further, in the coated case of the present invention, the tip of the axial lead is fixed to the carrier tape, and therefore, a conventionally known insertion device for an axial type electronic component (see, for example, Japanese Patent Laid-Open No. 09-055600).
It becomes possible to automatically mount on the above-mentioned printed wiring board by using a configuration similar to. In this case, the cost required for the coating can be further reduced. Furthermore, the book
In the present invention, a plurality of covered cases for the above electronic components are used, and
Make sure that the protruding directions of the axial leads differ from each other.
The covers are stacked on top of each other and placed on the front side of the electronic component.
Therefore, the surroundings of electronic components can be axially read from various directions.
Can be coated with a cord. Therefore, better electromagnetic
Can shield waves.

According to a second aspect of the present invention, in addition to the structure of the first aspect, the covering portion is rectangular, and a plurality of the axial leads project from two opposite sides of the covering portion at equal intervals. I am trying. According to the present invention, the covering portion is rectangular and the axial leads are opposed to each other.
Since it has a simple structure in which a plurality of protrusions are provided at equal intervals from the side, manufacturing is easy. Further, by adopting such a simple configuration, the covering case of the present invention can satisfactorily cover a wider variety of electronic components and can easily set the bending position of the axial lead. Further, by adopting the above-mentioned simple structure, the covering case of the present invention can be automatically mounted on the printed wiring board by using the above-mentioned axial type electronic component inserting device as it is or by making a simple improvement. It will be possible.

Furthermore, in the present invention, since a plurality of axial leads are provided at equal intervals, it is possible to better prevent electromagnetic waves from entering and exiting through the gaps between the axial leads. In consideration of the electromagnetic wave shielding property and the ease of mounting, it is desirable that the distance be 1 mm to 2 mm (more preferably 1.5 mm). Therefore, in the present invention, in addition to the effect of the invention described in claim 1,
By further facilitating the manufacturing and mounting, the cost required for the coating can be further reduced, and the electromagnetic waves can be shielded better.

The invention according to claim 3 is the invention according to claim 1 or 2.
In addition to the described configuration, the axial lead is characterized by having a stopper that prevents the axial lead from being inserted into the printed wiring board by a predetermined amount or more. When covering an electronic component to perform electromagnetic wave shielding, it is required that the covering case does not directly contact the electronic component. Therefore, in the covered case of the present invention, a stopper is provided to prevent the axial lead from being inserted into the printed wiring board by a predetermined amount or more. Therefore, the portion of the axial lead closer to the covering portion than the bending position and the covering portion can be held in the hollow very easily, and the axial electronic component inserting device can be used more favorably. That is, this type of insertion device is premised on the mounting of electronic components such as resistors that do not need to be held in the hollow. However, the above-described configuration of the present invention enables coating without adjustment on the insertion device side. The part can be easily kept hollow. Therefore, in the present invention, in addition to the effect of the invention described in claim 1 or 2, there is an effect that the cost required for the coating can be further reduced by facilitating the mounting.

[0011]

According to a fourth aspect of the invention, the electronic component is provided on the front side.
From the coating part and the one facing each other from the coating part
The end of the space is fixed to the carrier tape
A method of coating an electronic component that covers the mounted electronic components on a printed circuit board with a covering case of an electronic component including a Shall lead, and covering case and the electronic component
The scan multiple use, bending the axial lead at a position corresponding to the magnitude of the electronic component, the axial Lee
Do not overlap the above coated parts so that the protruding
It is characterized in that they are aligned with each other and arranged on the surface side of the electronic component, and that the axial lead is connected to the printed wiring board around the electronic component.

According to the present invention, in the same covering case as in claim 1, the axial lead is bent at a position corresponding to the size of the electronic component, the covering portion is disposed on the front surface side of the electronic component, and the axial portion is formed. The leads are connected to a printed wiring board (often its ground electrode) around the electronic component. Therefore, as described in relation to claim 1, by bending the axial lead at a position corresponding to the width and height of the electronic component, it is possible to satisfactorily cover electronic components of various sizes, In addition, the cost required for coating the electronic components can be favorably reduced even when the electronic components have various sizes. Further, as described above, if the method of the present invention is carried out by using the same configuration as that of the insertion device for the axial type electronic component, the cost required for the coating can be further reduced.

Further, according to the present invention, since a plurality of covering cases for the electronic parts are used and the covering parts are overlapped with each other so that the protruding directions of the axial leads are different from each other, they are arranged on the front surface side of the electronic parts. The periphery of the electronic component can be covered with the axial leads from various directions. Accordingly, in the present invention, Ru can be shielded one layer satisfactorily waves.

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing the configuration of a covering case 1 to which the present invention is applied. As shown in FIG. 1, the covering case 1 includes a rectangular covering portion 5 and axial leads 7 protruding from two opposite sides of the covering portion 5 at equal intervals (1.5 mm intervals). The axial lead 7 is integrally formed by punching out a metal plate. In addition, a plurality of the covering cases 1 are arranged in a direction (hereinafter, referred to as a length direction) orthogonal to a protruding direction (hereinafter, referred to as a width direction) of the axial leads 7, and a tip end of each axial lead 7 is sandwiched by a carrier tape 11. It is fixed.

The coated case 1 thus constructed is used by separating it axially by cutting the axial leads 7 at a portion inside the carrier tape 11.
Further, since the covering case 1 is fixed to the carrier tape 11 in this way, a conventionally known insertion device for an axial electronic component (for example, Japanese Patent Laid-Open No. 09-0556).
It can be automatically mounted on the printed wiring board 13 (see FIG. 2) by using a configuration similar to that of Japanese Patent Laid-Open No. 00).
Next, electronic parts (for example, IC
A method for coating the chip 15 (see FIG. 2) will be described.

FIG. 2 shows one cover case 1 as described above.
Is separated from the carrier tape 11 and the covering portion 5 is held by the chuck 17 of the insertion device. After sandwiching in this manner, the chuck 17 covers the covering case 1
Is arranged right above the IC chip 15, and the printed wiring board 1
Holes 13a provided on both sides of the IC chip 15 in FIG.
Bend the axial lead 7 according to (conduction to the ground electrode). Then, the chuck 17 is lowered, the tip of the axial lead 7 is fitted into the hole 13a, and reflow soldering is performed from the lower surface.

Here, as shown in FIG. 3, stoppers 7a project in the front-rear direction in the vicinity of the tips of the respective axial leads 7, and when the chuck 17 is lowered, the stoppers 7a are engaged with the outer periphery of the hole 13a. By being stopped, the descent of the covering case 1 stops. At this time, the printed wiring board 1
A position of the stopper 7a is set below 3 so that the axial lead 7 projects as much as necessary for the reflow soldering, and the cover case 1 is fixed by spraying the solder 19 from the lower surface of the printed wiring board 13. It Then, as schematically shown in FIG. 4, the IC chip 1
The coating portion 5 is provided on the surface side of the IC chip 5, and the axial lead 7 is provided around the IC chip 15, so that the electromagnetic waves entering and exiting the IC chip 15 can be shielded by the cooperation of both.

Further, in the embodiment of the present invention, as shown schematically in FIG. 5, two covering cases 1 are used, and the covering portions 5 are arranged so that the protruding directions of the axial leads 7 are different from each other by 90 °. superposition that. In this case, IC chip 1
The circumference of 5 can be covered with the axial lead 7 from all directions, and the electromagnetic wave can be shielded more satisfactorily. In FIG. 5, the covering portion 5 is drawn in a square shape (obviously, one rectangular shape). However, even when the covering portion 5 is a rectangle having different lengths in the length direction and the width direction, By appropriately setting the bending position of the axial lead 7, the overlapping as shown in FIG. 5 becomes possible.

The covering case 1 described above covers the electronic components of various sizes by bending the axial lead 7 at a bending position corresponding to the width and height of the electronic component (IC chip 15 etc.). You can shield electromagnetic waves like. Therefore, even when the electronic components to be coated have various sizes, the cost required for the coating can be favorably reduced.

Further, in the covering case 1, since the tips of the axial leads 7 are fixed to the carrier tape 11,
As described above, it is possible to automatically mount on the printed wiring board 13 by using the same configuration as the known insertion device, and it is possible to further reduce the cost required for the covering. Moreover, the covering case 1 has the axial lead 7
Since the stopper 7a is provided in the vicinity of the tip, the covering portion 5 can be easily held in the hollow without adjustment on the insertion device side. Therefore, the mounting can be further facilitated, and the cost can be further reduced.

The covering case 1 can also function as a heat radiating member by adhering the heat conducting sheet 21 to the lower surface of the covering portion 5 as shown in FIG. In this case, if the axial lead 7 is too long, the heat conductive sheet 21 may not come into contact with the surface of the IC chip 15 as shown in FIG. 6A, but the covering portion 5 and the axial lead 7 can be deformed. If the thickness is set, it can be adjusted as follows.

That is, as shown in FIG.
In the case of using the heat sink 23 having 3a, the protrusion 23a presses a part of the covering portion 5 to bend the covering portion 5 and the axial lead 7, and bring the heat conductive sheet 21 into contact with the surface of the IC chip 15. be able to. Further, when the flat plate-shaped heat sink 25 is used as shown in FIG. 6C, the entire lower surface of the heat sink 25 is pressed against the entire covering portion 5 so that the axial lead 7 is removed.
The heat conductive sheet 21 can be brought into contact with the surface of the IC chip 15 by bending. In any case, the heat generated in the IC chip 15 is radiated favorably to the heat sink 23 or the heat sink 25 via the heat conductive sheet 21 and the covering portion 5.

In each of the above embodiments, the case where only one IC chip 15 as an electronic component is coated has been described, but a plurality of electronic components may be coated at the same time. Further, the shape of the covering portion 5 may be various shapes other than the rectangular shape, and may be matched with the shape of a unit including a plurality of electronic components, for example.

However, like the covering case 1, the covering portion 5 has a rectangular shape, and the axial leads 7 are opposite to each other in the covering portion 5.
When they are projected at equal intervals from the sides, the structure is simple and the manufacturing is easy. Moreover, if the covering portion 5 and the axial lead 7 have the same thickness as in the covering case 1, it can be easily manufactured by punching the metal plate as described above. Therefore, the manufacturing cost can be further reduced.

Further, by adopting a simple structure in which the covering portion 5 has a rectangular shape and the axial leads 7 are projected from two opposite sides of the covering portion 5 at equal intervals, the covering case 1 is suitable for various electronic parts. And the bending position of the axial lead 7 can be easily set. Furthermore, by adopting the above simple structure, the covering case 1
Can be automatically mounted on the printed wiring board 13 by using the above-mentioned insertion device as it is or by making a simple improvement. Therefore, the cost required for the coating can be further reduced.

Furthermore, in the covering case 1, since the axial leads 7 are projected at equal intervals of 1.5 mm,
It is possible to better prevent the electromagnetic waves from entering and exiting through the gap of the axial lead 7. For this reason,
The electromagnetic waves can be shielded even better.

In each of the above embodiments, the axial lead 7 is penetrated through the printed wiring board 13 for reflow soldering. However, solder cream is applied to the printed wiring board 13 and placed on it. But it's okay. In this case, it is not necessary to provide the axial lead 7 with the stopper 7a. Further, even when the axial lead 7 is penetrated, various forms of the stopper can be considered, such as using the carrier tape 11 as a stopper by projecting the tip of the axial lead 7 to the outside of the carrier tape 11. . Further, the stoppers may be provided only on some of the axial leads 7 such as the four corners.

Furthermore, the present invention is not limited to the above-described embodiments, and can be implemented in various forms without departing from the scope of the present invention. The following examples represent the invention
Although it is a reference example outside the range, it is also possible to configure so as to be connectable in the length direction like the covering case 31 shown in FIGS. 7 and 8.

As shown in FIG. 7, this covering case 31
Is provided with a flat plate portion 35a forming a series of flat plates with the axial lead 37 between a pair of axial leads 37 arranged opposite to each other. From the flat plate portion 35a, one of the lengthwise directions (hereinafter referred to as front). Toward the flat plate portion 3
Three upper pieces 35b bent above 5a project. Further, the flat plate portion 3 is provided behind the flat plate portion 35a.
Two lower pieces 35c bent below 5a are projected, and the flat plate portion 35a, the upper piece 35b, and the lower piece 35 are formed.
The c covers the covering portion 35 of the covering case 31.

A plurality of covering cases 31 having the above-described structure are arranged adjacent to each other in the length direction, and as shown in FIG.
On the flat plate portion 35a of the covering case 31 to which 5b is adjacent,
Flat plate portion 35a of the covering case 31 adjacent to the lower piece 35c
If they are arranged below each other, the adjacent covering portions 35 partially overlap with each other to form a series of covering portions. Therefore, in the covering case 31, it is possible to form a covering case having an apparently large covering portion by arranging the covering cases adjacent to each other as described above, even if a covering case having a large covering portion is not manufactured in advance. Therefore, it is possible to satisfactorily coat a wider variety of electronic components,
The cost required for the coating can be further reduced.

The flat plate portion 35a is connected to the axial lead 3
It goes without saying that it may be configured to be larger than 7 in the length direction. In this case, it is also possible to project a plurality of axial leads 37 from the flat plate portion 35a in opposite directions. When a plurality of axial leads are provided so as to project from the covering portion in the directions opposite to each other as in the above-described form or the covering case 1, the individual covering portions are stably arranged on the front surface side of the electronic component. be able to.
On the other hand, when a pair of axial leads are provided so as to project from the covering portion in a direction opposite to each other like the covering case 31, the conventional axial type electronic component insertion device can be used more favorably.

[Brief description of drawings]

FIG. 1 is a perspective view showing a configuration of a cover case to which the present invention is applied.

FIG. 2 is an explanatory diagram showing a method of coating an electronic component using the coating case.

FIG. 3 is an explanatory view showing a structure of a tip of an axial lead of the covering case.

FIG. 4 is an explanatory view showing a covering state of an electronic component using the covering case.

FIG. 5 is an explanatory diagram showing a covered state of the electronic component as an embodiment of the present invention .

FIG. 6 is an explanatory diagram showing the covering case to which a heat dissipation effect is added.

FIG. 7 is a perspective view showing a configuration of a coated case according to a reference example of the present invention.

FIG. 8 is a cross-sectional view showing a usage state of the covering case.

[Explanation of symbols]

1, 31 ... Covering case 5, 35 ... Covering section 7,
37 ... Axial lead 7a ... Stopper 11 ... Carrier tape 1
3 ... Printed wiring board 15 ... IC chip 17 ... Chuck 2
1 ... Heat conduction sheet 35a ... Flat plate portion 35b ... Upper piece 3
5c ... Lower piece

Continuation of the front page (56) Reference JP-A-9-55600 (JP, A) JP-A-4-170099 (JP, A) JP-A-2001-244687 (JP, A) JP-A-2001-7233 (JP, A) ) JP 61-242053 (JP, A) JP 6-326151 (JP, A) JP 11-289186 (JP, A) Actually open 60-183498 (JP, U) Actually open 58- 63799 (JP, U) Actually opened 61-285 (JP, U) Actually opened 63-98700 (JP, U) Actually opened 51-96364 (JP, U) Actually opened 62-44443 (JP, U) Actual development flat 4-134815 (JP, U) Actual development flat 5-11497 (JP, U) (58) Fields investigated (Int.Cl. ⁷ , DB name) H05K 9/00 H05K 1/18

Claims (4)

(57) [Claims] And 1. A covering portion for covering the electronic parts from the surface side, is projected in opposite directions to each other from the coating unit, the coating of electronic components comprising a axial lead which is fixed to the distal end to the carrier tape, the Printed wiring board with case
Covering structure of electronic parts covering electronic parts mounted on a board
Structure, using a plurality of covering cases of the electronic component, and the axial lead according to the size of the electronic component.
So that the axial lead-out directions are different from each other.
On the front side of the electronic component by overlapping the coating parts
The axial lead of the electronic component
It is characterized in that it is connected to the surrounding printed wiring board.
A coating structure for electronic components . 2. The covering structure for an electronic component according to claim 1, wherein the covering portion has a rectangular shape, and a plurality of the axial leads project from two opposite sides of the covering portion at equal intervals. Wherein said axial lead is coated structure of an electronic component of claim 1, wherein that the axial lead has a stopper to prevent from being inserted more than a predetermined amount in the printed wiring board. 4. A covering portion for covering an electronic component from the surface side.
And protruding from the covering part in the opposite direction to each other,
A method for coating an electronic component mounted on a printed wiring board by using an electronic component coating case including an axial lead fixed to a carrier tape, comprising a plurality of the electronic component coating cases. use, the axial lead bending at a position corresponding to the magnitude of the electronic component, as the projecting direction of the axial lead are different from each other
A method for coating an electronic component, characterized in that the coating portions are overlapped with each other and disposed on the front surface side of the electronic component, and the axial lead is connected to the printed wiring board around the electronic component.