JP3875463B2

JP3875463B2 - Electronic circuit unit frame mounting structure

Info

Publication number: JP3875463B2
Application number: JP2000226208A
Authority: JP
Inventors: 英樹渡辺
Original assignee: Alps Electric Co Ltd
Current assignee: Alps Alpine Co Ltd
Priority date: 2000-07-21
Filing date: 2000-07-21
Publication date: 2007-01-31
Anticipated expiration: 2020-07-21
Also published as: JP2002043773A

Description

【０００１】
【発明の属する技術分野】
本発明は、携帯電話機に使用される送受信ユニット等の電子回路ユニットに適用して好適な枠体取付構造に関する。
【０００２】
【従来の技術】
従来の電子回路ユニットの枠体取付構造を図４，図５に基づいて説明すると、金属板を折り曲げして形成された枠体２１は、箱形をなし、四方を囲むように形成された側壁２１ａと、この側壁２１ａの下端から下方に突出して形成された突片２１ｂとを有する。
プリント基板からなる矩形状の回路基板２２は、周辺部に孔２２ａが設けられると共に、その下面には、導電パターン２３が設けられている。
【０００３】
また、この回路基板２２の上面に種々の電気部品（図示せず）が配設された状態で、電気部品が下部の導電パターン２３に半田によって接続され、回路基板２２には、送受信回路等の所望の電気回路が形成されている。
【０００４】
このような回路基板２２上には、枠体２１の側壁２１ａを載置すると共に、突片２１ｂを孔２２ａに挿通し、回路基板２２の裏側で、突片２１ｂと導電パターン２３とを半田２４付けして、枠体２１が回路基板２２に取り付けられた構成となっている。
【０００５】
しかし、このように、孔２２ａから突出した突片２１ｂと導電パターン２３とが半田２４付けされるものにおいては、導電パターン２３に対して突片２１ｂの対向する面が極めて小さく、従って、両者間の半田強度が弱く、回路基板２２の環境下における捻れによって、半田２４の剥がれが生じるものであった。
【０００６】
また、突片２１ｂが回路基板２２の下面から突出しているため、電子回路ユニットが厚み方向に大型になるばかりか、マザー基板（図示せず）に対して回路基板２２が面実装できず、セット側への組込に自由度が得られないものであった。
【０００７】
【発明が解決しようとする課題】
従来の電子回路ユニットの枠体取付構造は、回路基板２２の孔２２ａから突出した枠体２１の突片２１ｂと導電パターン２３とが半田２４付けされため、導電パターン２３に対して突片２１ｂの対向する面が極めて小さく、従って、両者間の半田強度が弱く、回路基板２２の環境下における捻れによって、半田２４の剥がれが生じるという問題がある。
また、突片２１ｂが回路基板２２の下面から突出しているため、電子回路ユニットが厚み方向に大型になるばかりか、マザー基板（図示せず）に対して回路基板２２が面実装できず、セット側への組込に自由度が得られないという問題がある。
【０００８】
そこで、本発明は、枠体と回路基板との剥がれの無い半田付け強度が得られると共に、小型の電子回路ユニットの枠体取付構造を提供することを目的とする。
【０００９】
【課題を解決するための手段】
上記課題を解決するための第１の解決手段として、導電パターンが設けられ、所望の電気回路を形成した回路基板と、この回路基板に半田付けされ、側壁を有する枠体とを備え、前記側壁の下部には、前記回路基板の面方向に延びる第１折り曲げ片が設けられると共に、この第１折り曲げ片の先端部には、前記回路基板側に延びる第２折り曲げ片が設けられ、前記回路基板上に前記枠体を載置した時、前記第２折り曲げ片が前記回路基板に設けられた孔に挿入されて、前記第２折り曲げ片の先端部が前記孔内に位置すると共に、前記第１折り曲げ片の下面と前記回路基板上の前記導電パターンとの間に隙間を設け、この隙間に半田を介入させて、前記導電パターンと前記第１，第２折り曲げ片とが半田付けされた構成とした。
【００１０】
また、第２の解決手段として、前記第１折り曲げ片は、前記側壁の下端部よりも上方に位置すると共に、前記第２折り曲げ片の先端部は、前記側壁の下端部よりも下方に位置しており、前記第２折り曲げ片が前記孔に挿入された時、前記第２折り曲げ片の先端部は、前記孔内に位置して前記回路基板の裏面から突出しない構成とした。
また、第３の解決手段として、前記枠体は箱形をなし、前記第１，第２折り曲げ片が前記枠体内に位置して設けられた構成とした。
【００１１】
【発明の実施の形態】
本発明の電子回路ユニットの枠体取付構造の図面を説明すると、図１は本発明の電子回路ユニットの枠体取付構造に係る分解斜視図、図２は本発明の電子回路ユニットの枠体取付構造に係り、枠体の要部の拡大斜視図、図３は本発明の電子回路ユニットの枠体取付構造に係る要部の拡大断面図である。
【００１２】
本発明の電子回路ユニットの枠体取付構造の構成を図１〜図３に基づいて説明すると、金属板を折り曲げして形成された枠体１は、箱形をなし、四方を囲むように形成された側壁１ａと、この側壁１ａの下部に設けられ、側壁１ａに対して直角方向に延びるように折り曲げられた第１折り曲げ片１ｂと、この第１折り曲げ片１ｂの先端部から下方に折り曲げられた第２折り曲げ片１ｃとを有する。
【００１３】
そして、第１折り曲げ片１ｂは、側壁１ａの下端部１ｄよりも上方に位置すると共に、第２折り曲げ片１ｃの先端部は、側壁１ａの下端部よりも若干下方に位置している。
更に、この第１，第２折り曲げ片１ｂ、１ｃは、枠体１内に位置して設けられている。
なお、この第１，第２折り曲げ片１ｂ、１ｃは、枠体１外に位置して設けられてもよい。
【００１４】
プリント基板からなる矩形状の回路基板２は、周辺部に孔２ａが設けられると共に、回路基板２の上面には導電パターン３が設けられ、この導電パターン３は、孔２ａの周辺に跨って形成されている。
また、この回路基板２の上面に種々の電気部品（図示せず）が配設された状態で、電気部品が導電パターン３に半田によって面実装され、回路基板２には、送受信回路等の所望の電気回路が形成されている。
【００１５】
このような回路基板２上には、枠体１の側壁１ａを載置して、下端部１ｄを回路基板２の上面に当接すると共に、第２折り曲げ片１ｃを孔２ａに挿入する。
すると、図３に示すように、第１折り曲げ片１ｂは、回路基板２の面方向に延びた状態で位置すると共に、第１折り曲げ片１ｂの下面と導電パターン３との間には、隙間Ｓが設けられた状態で、第１折り曲げ片１ｂの下面と導電パターン３の上面が互いに面対向した状態となる。
【００１６】
また、第２折り曲げ片１ｃが孔２ａに挿入された時、第２折り曲げ片１ｃの先端部は、孔２ａ内に位置して、回路基板２の裏面から突出しないようにしてなっている。
そして、孔２ａの周辺に位置する導電パターン３上に塗布されたクリーム半田によって、第１，第２折り曲げ片１ｂ、１ｃと導電パターン３とが半田４付けされて、枠体１が回路基板２に取り付けられた構成となっている。
この時、半田４は、第１折り曲げ片１ｂと導電パターン３の面対向部分である隙間Ｓ内に介在して、第１折り曲げ片１ｂと導電パターン３とが強固に半田４付けされている。
【００１７】
このように、第１折り曲げ片１ｂと導電パターン３の面対向部分である隙間Ｓ内に半田４が介在して、第１折り曲げ片１ｂと導電パターン３とが強固に半田４付けされているため、両者間の半田強度が強く、回路基板２の環境下における捻れによっても、半田４の剥がれの無いものが提供できる。
【００１８】
また、第２折り曲げ片１ｃは、孔２ａ内に位置して、回路基板２の下面から突出しないため、電子回路ユニットが厚み方向に小型なるばかりか、マザー基板（図示せず）に対して回路基板２の面実装が可能となり、セット側への組込に自由度が得られる。
【００１９】
【発明の効果】
本発明の電子回路ユニットの枠体取付構造は、側壁１ａに設けた第１折り曲げ片１ｂと導電パターン３の面対向部分である隙間Ｓ内に半田４が介在して、第１折り曲げ片１ｂと導電パターン３とが強固に半田４付けされているため、両者間の半田強度が強く、回路基板２の環境下における捻れによっても、半田４の剥がれの無い電子回路ユニットの枠体取付構造が提供できる。
【００２０】
また、第１折り曲げ片１ｂの先端に設けた第２折り曲げ片１ｃの先端部は、孔２ａ内に位置して、回路基板２の下面から突出しないため、電子回路ユニットが厚み方向に小型なるばかりか、マザー基板（図示せず）に対して回路基板２の面実装が可能となり、セット側への組込に自由度の得られる電子回路ユニットの枠体取付構造が提供できる。
【００２１】
また、枠体１は箱形をなし、第１，第２折り曲げ片１ｂ、１ｃが枠体１内に位置して設けられたため、第１，第２折り曲げ片１ｂ、１ｃが枠体１外に出っ張ることが無く、小型の電子回路ユニットの枠体取付構造が提供できる。
【図面の簡単な説明】
【図１】本発明の電子回路ユニットの枠体取付構造に係る分解斜視図。
【図２】本発明の電子回路ユニットの枠体取付構造に係り、枠体の要部の拡大斜視図。
【図３】本発明の電子回路ユニットの枠体取付構造に係る要部の拡大断面図。
【図４】従来の電子回路ユニットの枠体取付構造に係る分解斜視図。
【図５】従来の電子回路ユニットの枠体取付構造に係る要部の拡大断面図。
【符号の説明】
１枠体
１ａ側壁
１ｂ第１折り曲げ片
１ｃ第２折り曲げ片
１ｄ下端部
２回路基板
２ａ孔
３導電パターン
４半田
Ｓ隙間[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a frame mounting structure suitable for application to an electronic circuit unit such as a transmission / reception unit used in a mobile phone.
[0002]
[Prior art]
The frame mounting structure of a conventional electronic circuit unit will be described with reference to FIGS. 4 and 5. A frame 21 formed by bending a metal plate has a box shape and side walls formed so as to surround four sides. 21a and a projecting piece 21b formed to project downward from the lower end of the side wall 21a.
A rectangular circuit board 22 made of a printed circuit board is provided with a hole 22a in the periphery and a conductive pattern 23 on the lower surface thereof.
[0003]
In addition, with various electrical components (not shown) arranged on the upper surface of the circuit board 22, the electrical components are connected to the lower conductive pattern 23 by soldering, and the circuit board 22 has a transmission / reception circuit and the like. A desired electrical circuit is formed.
[0004]
On such a circuit board 22, the side wall 21 a of the frame body 21 is placed, and the protruding piece 21 b is inserted into the hole 22 a, and the protruding piece 21 b and the conductive pattern 23 are soldered 24 on the back side of the circuit board 22. In addition, the frame body 21 is attached to the circuit board 22.
[0005]
However, in the case where the protruding piece 21b protruding from the hole 22a and the conductive pattern 23 are soldered in this way, the surface of the protruding piece 21b facing the conductive pattern 23 is extremely small. The soldering strength of the circuit board 22 was weak, and the solder 24 peeled off due to the twisting of the circuit board 22 in the environment.
[0006]
Further, since the protruding piece 21b protrudes from the lower surface of the circuit board 22, the electronic circuit unit is not only large in the thickness direction, but the circuit board 22 cannot be surface-mounted on the mother board (not shown). The degree of freedom was not obtained for incorporation into the side.
[0007]
[Problems to be solved by the invention]
In the conventional frame mounting structure of the electronic circuit unit, the protruding piece 21b of the frame body 21 protruding from the hole 22a of the circuit board 22 and the conductive pattern 23 are soldered 24, so that the protruding piece 21b is attached to the conductive pattern 23. There is a problem that the opposing surfaces are extremely small, the solder strength between them is weak, and the solder 24 peels off due to the twisting of the circuit board 22 in the environment.
Further, since the protruding piece 21b protrudes from the lower surface of the circuit board 22, the electronic circuit unit is not only large in the thickness direction, but the circuit board 22 cannot be surface-mounted on the mother board (not shown). There is a problem that the degree of freedom cannot be obtained in the incorporation into the side.
[0008]
SUMMARY OF THE INVENTION An object of the present invention is to provide a frame mounting structure for a small electronic circuit unit as well as to obtain a soldering strength without peeling between the frame and a circuit board.
[0009]
[Means for Solving the Problems]
As a first means for solving the above-mentioned problems, a circuit board provided with a conductive pattern and formed with a desired electric circuit, and a frame body soldered to the circuit board and having a side wall, the side wall is provided. At the bottom of the first bending piece provided Rutotomoni extending in the surface direction of the circuit board, the distal end portion of the first bending piece, a second bent pieces extending in the circuit board side is provided, the circuit When the frame is placed on the substrate, the second bent piece is inserted into a hole provided in the circuit board, and a tip portion of the second bent piece is positioned in the hole, and the second bent piece is positioned in the hole . A configuration in which a gap is provided between the lower surface of one bent piece and the conductive pattern on the circuit board, and the conductive pattern and the first and second bent pieces are soldered by interposing solder in the gap. It was.
[0010]
As a second solution, the first bent piece is positioned above the lower end portion of the side wall, and the tip end portion of the second bent piece is positioned lower than the lower end portion of the side wall. When the second bent piece is inserted into the hole, the tip of the second bent piece is located in the hole and does not protrude from the back surface of the circuit board .
Further, as a third solving means, the frame body has a box shape, and the first and second bent pieces are disposed in the frame body.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 1 is an exploded perspective view of a frame mounting structure for an electronic circuit unit according to the present invention, and FIG. 2 is a frame mounting for the electronic circuit unit according to the present invention. FIG. 3 is an enlarged cross-sectional view of an essential part of a frame body mounting structure for an electronic circuit unit according to the present invention.
[0012]
The structure of the frame mounting structure of the electronic circuit unit according to the present invention will be described with reference to FIGS. 1 to 3. A frame 1 formed by bending a metal plate has a box shape and is formed to surround four sides. Side wall 1a, a first bent piece 1b provided at a lower portion of the side wall 1a and bent so as to extend in a direction perpendicular to the side wall 1a, and bent downward from a front end portion of the first bent piece 1b. And a second bent piece 1c.
[0013]
And the 1st bending piece 1b is located above the lower end part 1d of the side wall 1a, and the front-end | tip part of the 2nd bending piece 1c is located slightly lower than the lower end part of the side wall 1a.
Further, the first and second bent pieces 1 b and 1 c are provided in the frame 1.
The first and second bent pieces 1b and 1c may be provided outside the frame body 1.
[0014]
A rectangular circuit board 2 made of a printed circuit board is provided with a hole 2a in the peripheral portion, and a conductive pattern 3 is provided on the upper surface of the circuit board 2. The conductive pattern 3 is formed across the periphery of the hole 2a. Has been.
In addition, in the state where various electrical components (not shown) are disposed on the upper surface of the circuit board 2, the electrical components are surface-mounted by solder on the conductive pattern 3, and the circuit board 2 has a desired transmission / reception circuit or the like. The electric circuit is formed.
[0015]
On such a circuit board 2, the side wall 1a of the frame 1 is placed, the lower end 1d is brought into contact with the upper surface of the circuit board 2, and the second bent piece 1c is inserted into the hole 2a.
Then, as shown in FIG. 3, the first bent piece 1 b is positioned in a state extending in the surface direction of the circuit board 2, and a gap S is formed between the lower surface of the first bent piece 1 b and the conductive pattern 3. Is provided, the lower surface of the first bent piece 1b and the upper surface of the conductive pattern 3 face each other.
[0016]
When the second bent piece 1c is inserted into the hole 2a, the tip of the second bent piece 1c is located in the hole 2a so as not to protrude from the back surface of the circuit board 2.
The first and second bent pieces 1b and 1c and the conductive pattern 3 are soldered 4 with cream solder applied on the conductive pattern 3 positioned around the hole 2a, and the frame 1 is connected to the circuit board 2. It becomes the structure attached to.
At this time, the solder 4 is interposed in the gap S which is a surface facing portion between the first bent piece 1b and the conductive pattern 3, and the first bent piece 1b and the conductive pattern 3 are firmly attached to the solder 4.
[0017]
As described above, the solder 4 is interposed in the gap S which is the surface facing portion between the first bent piece 1b and the conductive pattern 3, and the first bent piece 1b and the conductive pattern 3 are firmly attached to the solder 4. Also, the solder strength between the two is strong, and it is possible to provide a device in which the solder 4 does not peel off even when the circuit board 2 is twisted in the environment.
[0018]
Further, since the second bent piece 1c is located in the hole 2a and does not protrude from the lower surface of the circuit board 2, not only the electronic circuit unit becomes smaller in the thickness direction but also the circuit with respect to the mother board (not shown). The surface mounting of the substrate 2 becomes possible, and a degree of freedom in assembling into the set side is obtained.
[0019]
【The invention's effect】
The frame mounting structure of the electronic circuit unit of the present invention includes a first bent piece 1b provided on the side wall 1a and a gap 4 which is a surface facing portion of the conductive pattern 3 with solder 4 interposed between the first bent piece 1b and the first bent piece 1b. Since the solder 4 is firmly attached to the conductive pattern 3, the strength of the solder between the two is strong, and the frame mounting structure of the electronic circuit unit is provided in which the solder 4 does not peel off even when the circuit board 2 is twisted in the environment. it can.
[0020]
In addition, since the tip of the second bent piece 1c provided at the tip of the first bent piece 1b is located in the hole 2a and does not protrude from the lower surface of the circuit board 2, the electronic circuit unit is only reduced in the thickness direction. Alternatively, the circuit board 2 can be surface-mounted with respect to a mother board (not shown), and a frame body mounting structure for an electronic circuit unit can be provided that allows a degree of freedom for assembly on the set side.
[0021]
Further, the frame body 1 has a box shape, and the first and second bent pieces 1b and 1c are located in the frame body 1, so that the first and second bent pieces 1b and 1c are outside the frame body 1. There is no protrusion and a frame mounting structure for a small electronic circuit unit can be provided.
[Brief description of the drawings]
FIG. 1 is an exploded perspective view according to a frame body mounting structure of an electronic circuit unit of the present invention.
FIG. 2 is an enlarged perspective view of the main part of the frame body in the electronic circuit unit frame mounting structure of the present invention.
FIG. 3 is an enlarged cross-sectional view of a main part according to the frame mounting structure of the electronic circuit unit of the present invention.
FIG. 4 is an exploded perspective view according to a frame mounting structure of a conventional electronic circuit unit.
FIG. 5 is an enlarged cross-sectional view of a main part relating to a frame mounting structure of a conventional electronic circuit unit.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Frame 1a Side wall 1b 1st bending piece 1c 2nd bending piece 1d Lower end part 2 Circuit board 2a Hole 3 Conductive pattern 4 Solder S Gap

Claims

A circuit board provided with a conductive pattern and forming a desired electric circuit, and a frame body soldered to the circuit board and having a side wall, and a lower portion of the side wall extending in a plane direction of the circuit board. 1 bent piece is provided Rutotomoni, the distal end portion of the first bending piece, when the second bent piece extending on the circuit board side is provided, and placing the frame body on the circuit board, the first Two folded pieces are inserted into holes provided in the circuit board, the tip of the second folded piece is positioned in the hole, and the lower surface of the first folded piece and the conductive pattern on the circuit board A frame body mounting structure for an electronic circuit unit, wherein a gap is provided between the conductive pattern and the first and second bent pieces soldered by interposing solder in the gap.

The first bent piece is positioned above the lower end portion of the side wall, and the tip end portion of the second bent piece is positioned lower than the lower end portion of the side wall, and the second bent piece is 2. The electronic circuit unit frame attachment according to claim 1 , wherein when inserted into the hole, the tip of the second bent piece is located in the hole and does not protrude from the back surface of the circuit board. Construction.

3. The frame mounting structure for an electronic circuit unit according to claim 1, wherein the frame has a box shape, and the first and second bent pieces are provided in the frame.