JPH0710516Y2 - Hybrid integrated circuit board module - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial application] The present invention relates to improvement of a hybrid integrated circuit board module in which a child circuit board is mounted on a parent circuit board.

[Prior Art] A conventional hybrid integrated circuit board module in which a so-called single-in-line child circuit board is mounted on a parent circuit board will be described with reference to FIGS. 5 and 6. That is, as shown in FIG. 5, the terminal electrodes 7, 7 ... Are provided along the side edges of the subsidiary circuit board 4, and the lead terminals 9, 9 ... Are soldered to the terminal electrodes 7, 7 ,. The child circuit board 4 is provided so as to project from the side of the child circuit board 4 at regular intervals.

On the other hand, in the parent circuit board 1 on which the child circuit board 4 is mounted,
The through holes 8 and 8 according to the intervals of the lead terminals 9 and 9 ...
.. are perforated, and soldered electrodes 3, 3 ... With a conductor film are formed on the wall surface and around the opening. Then, as shown in FIG. 6, lead terminals 9, 9 are provided in the through holes 8, 8 ,.
... is inserted and the lead terminals 9 and 9 are soldered to the through-hole conductors formed on the periphery thereof and on the wall surfaces of the through holes 8, 8.

In FIGS. 5 and 6, reference numeral 5 denotes an electronic component mounted on the subsidiary circuit board 4.

[Problems to be Solved by the Invention] However, the conventional hybrid integrated circuit board module has the following problems. That is, since the lead terminals 9, 9 ... Are pierced through the through holes 8, 8 ... For soldering, the back surface of the parent circuit board 1 is also occupied by the mounting of the child circuit board 4, and the components on the back surface are correspondingly occupied. The mounting area is reduced, which is an obstacle to high-density mounting. Further, such mounting means has a problem that the mounting height of the child circuit board 4 from the board surface of the parent circuit board 1 becomes high, and it is difficult to downsize the hybrid integrated circuit board module.

In order to solve such a problem, there has been proposed a means for soldering the terminal electrode printed on the side surface or the end surface of the child circuit board to the solder electrode printed on the surface of the parent circuit board without using the lead terminal. However, in this case, the parent circuit board 1
However, it is unstable when the child circuit board 4 is mounted on the parent circuit board 1, the workability of soldering is poor, and the child circuit board is not easily mounted.

SUMMARY OF THE INVENTION It is therefore an object of the present invention to solve the above problems and provide a hybrid integrated circuit board module in which a child circuit board can be mounted without occupying the back surface of the parent circuit board and is easy to mount.

[Means for Solving the Problem] That is, the gist of the means adopted in the present invention to achieve the above-mentioned object is to mount the child circuit board 4 on the parent circuit board 1 and to provide a circuit configured on the child circuit board 4. , In the hybrid integrated circuit board module formed by connecting the circuits formed on the parent circuit board 1, the terminal electrodes 6, 6 ... Are arranged near the lower side of the side surface of the child circuit board 4, The soldering electrodes 3, 3 ... Are arranged at intervals corresponding to the terminal electrodes 6, 6.
And L-shaped terminals 2 and 2 are attached to at least one side of the child circuit board 4, and the lower surface of the child circuit board 4 is substantially in surface contact with the surface of the parent circuit board 1 by the L-shaped terminals 2 and 2. So that the terminal electrodes 6, 6 ...
It is a hybrid integrated circuit board module which is soldered directly to the above-mentioned soldering electrodes 3, 3, ... Or via the L-shaped terminals 2, 2.

[Operation] In the hybrid integrated circuit board module, the lower surface of the child circuit board 4 is substantially brought into surface contact with the surface of the parent circuit board 1 to directly or directly form the terminal electrodes 3, 3, ... Formed near the lower side of the side surface. Since the soldering electrodes 3, 3, ... Of the parent circuit board 1 are soldered via the L-shaped terminals 2, 2, the back side of the parent circuit board 1 on which the child circuit board 4 is mounted is occupied by the child circuit board 4. In addition, the mounting height from the board surface of the parent circuit board 1 can be suppressed low. Moreover, since the child circuit board 4 is self-standing on the parent circuit board 1 by the L-shaped terminals 2 and 2 attached thereto, the child circuit board 4 can be easily mounted and soldered on the parent circuit board 1. You can do it.

[Embodiment] Next, an embodiment of the present invention will be described in detail with reference to the drawings.

As shown in FIG. 1, the sub circuit board 4 has a circuit formed by forming an electric circuit pattern (not shown) on the surface or inside of the ceramic substrate and mounting the electronic parts 5, 5, ... On the electric circuit pattern. From the side near the bottom of the side,
Terminal electrodes 6, 6 ... Are formed over the lower surface. The terminal electrodes 6, 6 ... Are connected to an electric circuit formed on the sub circuit board 4 via a circuit pattern.

Furthermore, as shown in FIG. 3, on both side surfaces of the subsidiary circuit board 4,
Terminals 2 and 2 having L-shaped sides are attached. This L
The letter-shaped terminals 2 and 2 may be, for example, one piece made of resin and attached to the side surface of the child circuit board 4 with an adhesive or the like, but in the illustrated embodiment, copper or nickel having good solderability is used. One side of the L-shaped terminals 2, 2 ...
The terminal electrodes 6, 6 ... Formed on both sides of the subsidiary circuit board 4 are conductively fixed with solder 10. Since the child circuit board 4 has an elongated plate shape, it cannot be self-supported on the parent circuit board 1. However, by attaching the L-shaped terminals 2 and 2 to both ends of the child circuit board 4, the child circuit board 4 can be formed as a whole. As shown in FIG. 2, by simply placing the child circuit board 4 on the parent circuit board 1 held horizontally, the child circuit board 4 can be made to stand on the same parent circuit board 1. In this way, with the child circuit board 4 placed on the parent circuit board 1, the lower surface of the child circuit board 4 is brought into substantially surface contact with the surface of the parent circuit board 1.

In the embodiment shown in FIG. 1, the L-shaped terminals 2, 2, ... Are fixed to all the terminal electrodes 6, 6 ... Formed on the side surface of the child circuit board 4 seen in the figure. If it can be made to stand on the parent circuit board 1, only two L-shaped terminals 2 and 2 can be attached to both ends of the child circuit board 4 as shown in FIG. As shown in (b) of the figure, only one L-shaped terminal 2 is provided at the center of one side surface, and two L-shaped terminals 2 and 2 are provided at both ends of the other side surface.
One L-shaped terminal 2 is provided at one end of one side surface, and the other side surface is provided with two L-shaped terminals 2 and 2 separated from both ends as shown in FIG. Various mounting methods can be adopted, such as one mounting. Further, if the child circuit board 4 can be self-supporting, one or more L-shaped terminals 2 can be provided only on one side surface thereof.

The parent circuit board 1 is formed by forming a circuit pattern (not shown) on the surface or inside of a substrate made of ceramic or resin.
Here, the child circuit board 4 and other electronic components as described above are mounted. On the parent circuit board 1, terminal electrodes 6 formed on a portion near the lower side of the side surface of the child circuit board 4,
The soldering electrodes 3, 3, ... Are formed in accordance with the intervals of 6. The soldering electrodes 3, 3, ... Are formed by forming a circuit pattern on the surface of the parent circuit board 1 and, at the same time, printing a conductive paste, baking, forming a metal film, etching and the like.

As shown in FIG. 2, the child circuit board 4 on which the L-shaped terminals 2 and 2 are attached is made to stand on the parent circuit board 1 which is held horizontally, and the terminal electrodes 6, 6 ... The lower side of the open side is substantially brought into surface contact with the board surface of the parent circuit board 1. At this time, the child circuit board 4 is mounted so that the positions of the terminal electrodes 6, 6 ... And the soldering electrodes 3, 3, ... Are respectively aligned, and the terminal electrodes 6, 6 ... And the soldering electrodes 3, 3 ,. Conductively fixed with solder 10. Further, as shown in FIG. 3, the terminal electrodes 6, 6 ...
When the letter terminals 2, 2 ... Are attached, the terminal electrodes 6, 6 ... Are fixed to the soldering electrodes 3, 3 ,.

[Effects of the Invention] As described above, according to the present invention, the child circuit board 4 can be surface-mounted on the parent circuit board 1 without forming a through hole, and at the same time, the parent circuit of the child circuit board 4 can be mounted. A self-supporting on the board 1 can provide a hybrid integrated circuit board module in which the child circuit board 4 can be easily mounted and soldered. This allows
There is an effect that the high-density mounting and downsizing of the hybrid integrated circuit board module can be easily achieved.

[Brief description of drawings]

FIG. 1 is a perspective view of a hybrid integrated circuit board module before mounting a child circuit board according to an embodiment of the present invention, and FIG.
FIG. 3 is a perspective view of a hybrid integrated circuit board module in which a child circuit board according to an embodiment of the present invention is mounted. FIG. 3 shows a terminal electrode of the child circuit board soldered to a soldering electrode on a parent circuit board. FIGS. 4A to 4C are vertical cross-sectional views of essential parts, and FIG. 4A to FIG. 4C are plan views showing an example of mounting the L-shaped terminal on the child circuit board. FIG. FIG. 6 is a perspective view of the hybrid integrated circuit board module, and FIG. 6 is a perspective view of the hybrid integrated circuit board module in a state in which a child circuit board showing a conventional example is mounted. 1 ... Parent circuit board, 2 ... L-shaped terminal, 3 ... Solder electrode, 4 ...
Sub circuit board, 6 ... Terminal electrode

Claims (1)

[Scope of utility model registration request] 1. A hybrid integrated circuit board module in which a child circuit board (4) is mounted on a parent circuit board (1) and a circuit formed on the child circuit board (4) is connected to a circuit formed on the parent circuit board (1). , The terminal electrodes 6, 6 ... Are arranged near the lower side of the side surface of the child circuit board 4, and the soldering electrodes 3, 3, ... Are arranged on the parent circuit board 1 at intervals corresponding to the terminal electrodes 6, 6. The L-shaped terminals 2 and 2 are formed and fixed to at least one side of the child circuit board 4, and the L-shaped terminals 2 and 2 are used to form the child circuit board 4.
Are self-supported so that their lower surfaces are substantially in surface contact with the surface of the parent circuit board 1, and the terminal electrodes 6, 6, ... Are directly or directly connected to the solder electrodes 3, 3 ,. Two
A hybrid integrated circuit board module characterized by being soldered through.