JPH054295Y2 - - Google Patents

Description

[Detailed description of the invention] (a) Industrial application field This invention relates to an improvement of an electronic component in which an electronic component body having lead wires on only one side is housed in a resin case.

(b) Prior Art Some electronic component bodies, such as ceramic filters, have lead wires formed only on one side. For example, a ceramic filter is a piezoelectric element (electronic component body) with lead wires conductively connected.
is housed in a resin case with an opening on one side, the lead wire is pulled out from the opening, and the opening is sealed.

(c) Problems to be solved by the invention When mounting an electronic component such as a ceramic filter as described above on a printed circuit board, as shown in FIG. The lead wires 2 provided on one side of the board must be mounted on the board 4 using solder 3. However, as described above, since the lead wire 2 is provided only on one side of the filter body 1, the lead wire 2 is unbalanced when fixed to the substrate 4, and has the disadvantage that it cannot be fixed completely.

Furthermore, in recent years, soldering of such electronic components to the board 4 has often been automated, and as mentioned above, if the stability of the electronic component is poor, the fixed position may shift, reducing the reliability of the board. There were times when I would put it away.

Therefore, as shown in FIG. 2 or 4, for example, when molding the resin case 11, a dummy terminal 13 is provided on the surface opposite to the drawing surface of the lead wire 2, and the dummy terminal 13 is fixed to the board 4 with solder 3. By doing so, it is possible to fix the filter body 1 to the substrate 4 in a well-balanced manner.

However, in electronic components having such a structure, the provision of dummy terminals increases the external size, and as a result, there is a problem in that the mounting density on the printed wiring board must be reduced.

In view of the above problems, the object of this invention is to provide an electronic component that can improve stability when mounted on a board without substantially changing the shape and size of the electronic component.

(d) Means for solving the problem This invention provides an electronic component in which an electronic component body having a lead wire on one side is housed in a resin case, and a surface of the resin case opposite to the surface on which the lead wire is located. It is characterized by having a solderable plating part.

(e) Effect When mounting the electronic component of this invention on a board,
By soldering the lead wires provided on one side onto the board, the electronic component main body is electrically connected, and this one side is fixed onto the board. Further, by means of a plating portion provided on the surface opposite to the surface on which the lead wire is located, this surface can also be fixed to the substrate by soldering. In this case, the plated part is electrically floating because it is provided in the resin case, which is an insulator, and there is no problem even if the board part to be soldered is part of the circuit. That is, the electronic component of the present invention can be completely mounted on the board by soldering the two opposing sides onto the board.

(f) Embodiment FIG. 1 is a perspective view showing the external appearance of a ceramic filter that is an embodiment of this invention, and FIG. 3 is a side view thereof.

The filter body 1 includes a piezoelectric element that utilizes a length vibration mode and a resin case 11 that houses the piezoelectric element.
It consists of The resin case 11 is a rectangular box-shaped molded product with an opening 12 formed on one side. In addition, the top surface side of the resin case 11 (opening 12
A plating section 15 is provided on the surface facing the surface. Since this plating portion 15 is not for electrical connection but merely for fixing the filter body 1 onto the substrate, it may be made of an inexpensive plating film that can be soldered.

Lead wires 2, 2, 2 used as input, output, and ground terminals are conductively connected to the piezoelectric element. The piezoelectric element is inserted into the resin case 1 from the opening 12.
1 , and one end of the lead wires 2 , 2 , 2 is pulled out to the outside of the resin case 11 . In this way, the resin case 11 houses the piezoelectric element inside.
The opening 12 is sealed with a sealing material 14 made of an insulating material such as resin.

When the ceramic filter body 1 configured as described above is automatically mounted on the substrate 4, it is mounted by a reflow soldering method. Specifically, on the substrate 4 on which the conductive circuit is printed, the positions where the lead wires 2, 2, 2 are connected and the plating portion 15 of the conductive circuit 41 are formed.
Solder paste is applied to the position where the filter body 1 will be connected, and adhesive is applied to the area where the filter body 1 will be placed. Then, by placing the filter body 1 on the adhesive, the filter body 1 is temporarily fixed, and the lead wires 2, 2 are placed in the position where the solder paste is applied.
2 and a plating section 15 are installed. The substrate 4 to which the filter body 1 is temporarily fixed in this way is heated to scatter the solvent of the solder paste and melt the solder. With this, the filter body 1 is connected to the substrate 4.
fixed on top. At this time, the filter body 1 is
As shown in the figure, since it is fixed onto the substrate 4 in two directions, ie, on the opening 12 side and on the top surface side, by the solder 3, it will not lose its balance and shift.

Further, since the plating portion 15 is simply provided on the conventional resin case 11, there is an advantage that the conventional manufacturing equipment can be used without almost any modification.

Although this example shows an example of a ceramic filter using a piezoelectric element, it can also be applied to other electronic components where lead wires are provided on one side, for example, when the lead wires are drawn out from the bottom of the resin case of the electronic component. However, by providing the plated portion, the stability of the electronic component to the board can be improved.

(g) Effect of the invention The electronic component of this invention allows electronic components to be mounted on a board with good stability simply by providing a solderable plated part on the surface opposite to the surface where the lead wire is provided. In addition, it is possible to improve workability during mounting on a board, and to reduce the number of defective products due to misalignment of electronic components.

Furthermore, since the electronic component of this invention does not have a dummy terminal, its outer shape and size hardly change. As a result, the mounting density on the printed wiring board is not reduced.

Furthermore, according to the reflow soldering method generally used for surface mounting, the resin case (especially the part where soldering is performed) is exposed to quite high temperatures;
In the electronic component of this invention, the heat resistance and mechanical strength of the resin case are improved by providing a solderable plating portion on the surface opposite to the surface on which the lead wire is provided. Therefore, the reliability of soldering increases.

[Brief explanation of drawings]

1 and 3 are perspective and side views showing the external appearance of a ceramic filter that is an embodiment of this invention, FIGS. 2 and 4 are side views of a conventional electronic component, and FIG. 5 is a conventional electronic component. FIG. 3 is a side view of a ceramic filter. 1... Filter body, 2... Lead wire, 11...
...resin case, 13...dummy terminal, 15...metallic part.

Claims (1)

[Scope of Claim for Utility Model Registration] In an electronic component in which an electronic component body with a lead wire on one side is housed in a resin case, a plated part that can be soldered to the surface of the resin case opposite to the surface on which the lead wire is located. An electronic component characterized by being provided with.