JPH0448124Y2 - - Google Patents
Info
- Publication number
- JPH0448124Y2 JPH0448124Y2 JP1984200526U JP20052684U JPH0448124Y2 JP H0448124 Y2 JPH0448124 Y2 JP H0448124Y2 JP 1984200526 U JP1984200526 U JP 1984200526U JP 20052684 U JP20052684 U JP 20052684U JP H0448124 Y2 JPH0448124 Y2 JP H0448124Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- terminal
- lead wire
- component mounting
- attachment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 19
- 238000005476 soldering Methods 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 229920003002 synthetic resin Polymers 0.000 claims description 4
- 239000000057 synthetic resin Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- NJFMNPFATSYWHB-UHFFFAOYSA-N ac1l9hgr Chemical compound [Fe].[Fe] NJFMNPFATSYWHB-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- MOFOBJHOKRNACT-UHFFFAOYSA-N nickel silver Chemical compound [Ni].[Ag] MOFOBJHOKRNACT-UHFFFAOYSA-N 0.000 description 1
- 239000010956 nickel silver Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Description
【考案の詳細な説明】
産業上の利用分野
本考案は、金属をベースとする電子部品実装基
板にモータ本体外に突出する端子部を設けたDC
小型モータに用いられるリード線接続装置に関す
るものである。[Detailed description of the invention] Industrial application field This invention is a DC motor in which terminals protruding outside the motor body are provided on a metal-based electronic component mounting board.
This invention relates to a lead wire connection device used in a small motor.
従来の技術
従来、合成樹脂をベースとする電子部品実装基
板においては、基本的には抵抗、IC等の部品実
装面とパターン面とは実装の為の挿入穴を介して
表裏一体の関係にある。Conventional technology Conventionally, in electronic component mounting boards based on synthetic resin, the surface on which components such as resistors and ICs are mounted and the pattern surface are basically two sides of the same coin through insertion holes for mounting. .
一方、パワートランジスタ等の放熱特性を向上
させるなどの目的で最近、金属（アルミニウム、
鉄）をベースとする電子部品実装基板が多く用い
られているが、この金属ベース基板の場合は、ま
ず金属板表面上に絶縁層を形成し、その上に導電
性パターンの引き回しを行ない、電子部品を実装
するもので、パターン面と電子部品実装面とは同
方向となり、樹脂ベース基板の場合とは異なる。 On the other hand, metals (aluminum,
Electronic component mounting boards based on iron (iron) are often used, but in the case of this metal-based board, an insulating layer is first formed on the surface of the metal plate, and a conductive pattern is routed on top of it. It is used to mount components, and the pattern surface and the electronic component mounting surface are in the same direction, which is different from the case of resin-based substrates.
第４図は上記金属ベース基板を用いたDC小型
モータを示すものである。図において、１はモー
タ本体、２は出力軸、３は金属をベースとする電
子部品実装基板に一体に形成した端子部で、モー
タ本体外に突出して設けてあり、この端子部３に
は外部リード線４が接続される複数の半田付け部
５が設けられている。 FIG. 4 shows a small DC motor using the metal base substrate described above. In the figure, 1 is a motor body, 2 is an output shaft, and 3 is a terminal part integrally formed on a metal-based electronic component mounting board, which is provided to protrude outside the motor body. A plurality of soldering portions 5 to which lead wires 4 are connected are provided.
以上の構成において、端子部３の半田付け部５
は、出力軸側に面しており、第５図に示す如く、
例えば上記モータをカセツトメカニズム６の取付
けた場合、端子部３とカセツトメカニズム６間の
空間が極くわずかであるため、外部リード線４の
半田付け作業が行ない難いものであつた。又、端
子部３に設ける半田付け部間のピツチが狭く、こ
の点からも半田付け作業性が悪いものであつた。 In the above configuration, the soldering portion 5 of the terminal portion 3
faces the output shaft side, as shown in Figure 5.
For example, when the motor is attached to the cassette mechanism 6, the space between the terminal portion 3 and the cassette mechanism 6 is extremely small, making it difficult to solder the external lead wire 4. Further, the pitch between the soldering parts provided on the terminal part 3 was narrow, and from this point as well, the soldering workability was poor.
このため第６図に示す如く、端子部３に別の端
子板７を電気的に接続した状態で取付け、この端
子板７に外部リード線４を半田接続している。 For this reason, as shown in FIG. 6, another terminal board 7 is attached to the terminal portion 3 in an electrically connected state, and the external lead wire 4 is connected to this terminal board 7 by soldering.
考案が解決しようとする問題点
しかしながら、上記構成においては、特別な端
子板７が必要であり、端子板７と電子部品実装基
板の端子部３との電気的、機械的結合が複雑で組
立作業性が悪い欠点があつた。Problems to be Solved by the Invention However, in the above configuration, a special terminal board 7 is required, and the electrical and mechanical connection between the terminal board 7 and the terminal portion 3 of the electronic component mounting board is complicated and the assembly process is complicated. It had a bad flaw.
本考案は上記従来の欠点に鑑みてなされたもの
で、外部リード線の接続を容易に行なえるように
することを目的とするものである。 The present invention was devised in view of the above-mentioned drawbacks of the prior art, and an object of the present invention is to facilitate the connection of external lead wires.
問題点を解決するための手段
上記目的を達成するため本考案は、一端にリー
ド線接続部を有し、他端に端子部の半田付け部に
接続される端子接続部を有する複数のリードフレ
ームと、このリードフレームと一体成形され、前
記端子部に嵌合する嵌合部を有する合成樹脂製の
フレームホルダーとより成るリードアタツチメン
トを設け、このリードアタツチメントを金属をベ
ースとする電子部品実装基板の端子部に取付けた
ものである。Means for Solving the Problems In order to achieve the above object, the present invention provides a plurality of lead frames having a lead wire connection part at one end and a terminal connection part connected to the soldering part of the terminal part at the other end. and a frame holder made of synthetic resin that is integrally molded with the lead frame and has a fitting part that fits into the terminal part, and the lead attachment is made of a metal-based electronic device. It is attached to the terminal section of the component mounting board.
作 用
上記構成すれば、外部リード線は電子部品実装
基板のパターン面とは逆の面に位置するリードフ
レームのリード線接続部に接続されるため、モー
タ出力軸側を他の機器に取付けた場合において
も、極めて容易に外部リード線の接続を行なうこ
とができる。またリードアタツチメントは、ワン
タツチで電子部品実装基板の端子部に取付けられ
るものであり、組立ても容易となる。Effect With the above configuration, the external lead wires are connected to the lead wire connection part of the lead frame located on the opposite side to the pattern surface of the electronic component mounting board, so the motor output shaft side can be attached to other equipment. Even in such cases, external lead wires can be connected very easily. Furthermore, the lead attachment can be attached to the terminal portion of the electronic component mounting board with a single touch, making it easy to assemble.
実施例
以下、本考案の一実施例を第１図〜第３図を参
照して説明する。図において、８は複数個のリー
ドフレーム９と耐熱性合成樹脂のフレームホルダ
ー１０よりなるリードアタツチメントで、リード
フレーム９とフレームホルダー１０は一体成形し
ている。前記リードフレーム９は、銅板に錫メツ
キした材料、洋白等の材料を打ち抜いて形成さ
れ、フレームホルダー１０との一体成形後、その
両端面が折り曲げられ、一端に電子部品実装基板
の端子部３に形成した半田付け部５に接続される
端子接続部９ａが設けられ、他端の外部リード線
４が接続されるリード線接続部９ｂが設けられて
いる。一方、フレームホルダー１０には、端子部
３に嵌合する凹状の嵌合部１０ａが設けられてい
る。Embodiment An embodiment of the present invention will be described below with reference to FIGS. 1 to 3. In the figure, 8 is a lead attachment consisting of a plurality of lead frames 9 and a frame holder 10 made of heat-resistant synthetic resin, and the lead frames 9 and frame holder 10 are integrally molded. The lead frame 9 is formed by punching out a material such as a tin-plated copper plate or nickel silver, and after integrally molding with the frame holder 10, both end surfaces thereof are bent, and one end is provided with a terminal portion 3 of an electronic component mounting board. A terminal connecting portion 9a is provided to be connected to the soldering portion 5 formed at the top, and a lead wire connecting portion 9b to which the external lead wire 4 at the other end is connected is provided. On the other hand, the frame holder 10 is provided with a concave fitting portion 10a that fits into the terminal portion 3.
以上の構成において、フレームホルダー１０の
嵌合部１０ａを端子部３に嵌合させ、リードアタ
ツチメント８を端子部３に取付けると、リードフ
レーム９に設けた端子接続部９ａはリードフレー
ム自身のバネ性により端子部３の半田付け部５に
圧接され、電気的接続がなされると、そのバネ性
によりフレームホルダー１０の嵌合部１０ａの作
用と相まつてリードアタツチメント８を端子部３
に保持する。この結果、リードフレーム９のリー
ド線接続部９ｂは、端子部３の半田付け部５とは
逆の面側（モータ本体の底蓋側）に位置すること
になり、外部リード線４の接続を容易に行なうこ
とができる。 In the above configuration, when the fitting part 10a of the frame holder 10 is fitted to the terminal part 3 and the lead attachment 8 is attached to the terminal part 3, the terminal connecting part 9a provided on the lead frame 9 is connected to the lead frame itself. When the lead attachment 8 is pressed against the soldering part 5 of the terminal part 3 due to its spring property and an electrical connection is made, the lead attachment 8 is pressed onto the terminal part 3 due to its spring property and combined with the action of the fitting part 10a of the frame holder 10.
to hold. As a result, the lead wire connection portion 9b of the lead frame 9 is located on the side opposite to the soldering portion 5 of the terminal portion 3 (on the bottom cover side of the motor body), making it difficult to connect the external lead wire 4. It can be done easily.
なお、リードフレーム９の端子接続部９ａの先
端は、ある角度を持つて外側に傾斜させており、
フレームホルダー１０を端子部３に挿入するとき
に、この端子接続部９ａが引掛かるのを防止し、
リードアタツチメント８の装着を容易にしてい
る。また、リードフレーム９のリード線接続部９
ｂには、リード線をから揚げできるように接続穴
が設けられている。 Note that the tip of the terminal connection portion 9a of the lead frame 9 is inclined outward at a certain angle.
When inserting the frame holder 10 into the terminal portion 3, this terminal connecting portion 9a is prevented from being caught.
This makes it easy to attach the lead attachment 8. In addition, the lead wire connection portion 9 of the lead frame 9
A connection hole is provided in b so that the lead wire can be connected.
考案の効果
以上の説明から明らかなように本考案によれ
ば、リードアタツチメントにより、外部リード線
の接続部を電子部品実装基板のパターン面とは逆
の面にすることができ、外部リード線の接続作業
性が大幅に向上すると共に、リードアタツチメン
トはワンタツチで電子部品実装基板の端子部に取
付けることができ、その実用的価値は極めて大な
るものがある。Effects of the Invention As is clear from the above explanation, according to the present invention, the lead attachment allows the connecting portion of the external lead wire to be placed on the opposite side of the pattern surface of the electronic component mounting board. The workability of connecting wires is greatly improved, and the lead attachment can be attached to the terminal portion of an electronic component mounting board with one touch, and its practical value is extremely large.
第１図は本考案の一実施例にかかるリードアタ
ツチメントを電子部品実装基板の端子部に装着し
た際の断面図、第２図ａ，ｂは同リードアタツチ
メントの正面図および上面図、第３図ａ，ｂは同
リードアタツチメントをモータに装備した際の出
力側から見た上面図および底蓋側から見た下面
図、第４図は従来のリード線接続構造を示すモー
タの上面図、第５図は同モータをカセツトメカニ
ズムに取付けた際の正面図、第６図は他の従来例
を示すモータの正面図である。
１……モータ本体、２……出力軸、３……端子
部、４……外部リード線、５……半田付け部、８
……リードアタツチメント、９……リードフレー
ム、９ａ……端子接続部、９ｂ……リード線接続
部、１０……フレームホルダー、１０ａ……嵌合
部。
Fig. 1 is a sectional view of a lead attachment according to an embodiment of the present invention attached to a terminal portion of an electronic component mounting board, and Fig. 2 a and b are a front view and a top view of the same lead attachment. , Figures 3a and b are a top view as seen from the output side and a bottom view as seen from the bottom cover side when the same lead attachment is installed on the motor, and Figure 4 is a motor showing the conventional lead wire connection structure. FIG. 5 is a front view of the same motor when it is attached to a cassette mechanism, and FIG. 6 is a front view of another conventional motor. 1... Motor body, 2... Output shaft, 3... Terminal section, 4... External lead wire, 5... Soldering section, 8
... Lead attachment, 9 ... Lead frame, 9a ... Terminal connection section, 9b ... Lead wire connection section, 10 ... Frame holder, 10a ... Fitting section.
Claims (1)
設けられたモータ本体外に突出する端子部と、こ
の端子部に取付けられるリードアタツチメントと
を備え、前記リードアタツチメントは、一端にリ
ード線接続部を有し、他端に前記端子部の半田付
け部に当接して電気的接続がなされる端子接続部
を有する複数のリードフレームと、このリードフ
レームと一体に成形され、前記端子部に嵌合する
嵌合部を有する合成樹脂製のフレームホルダーに
て構成し、前記リードフレームのリード線接続部
に外部リード線を接続してなる小型モータのリー
ド線接続装置。 A terminal part protruding outside the motor body is integrally provided on a metal-based electronic component mounting board, and a lead attachment is attached to this terminal part, and the lead attachment has a lead wire at one end. a plurality of lead frames each having a terminal connection portion at the other end that contacts the soldering portion of the terminal portion to establish an electrical connection; A lead wire connection device for a small motor, comprising a frame holder made of synthetic resin having a fitting portion to be fitted, and an external lead wire is connected to the lead wire connection portion of the lead frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984200526U JPH0448124Y2 (en) | 1984-12-28 | 1984-12-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984200526U JPH0448124Y2 (en) | 1984-12-28 | 1984-12-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61117565U JPS61117565U (en) | 1986-07-24 |
| JPH0448124Y2 true JPH0448124Y2 (en) | 1992-11-12 |
Family
ID=30761457
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984200526U Expired JPH0448124Y2 (en) | 1984-12-28 | 1984-12-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0448124Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2586955Y2 (en) * | 1990-03-05 | 1998-12-14 | 富士電気化学 株式会社 | Terminal structure of small motor |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS616889U (en) * | 1984-06-18 | 1986-01-16 | 積水化学工業株式会社 | article retention panel |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55181472U (en) * | 1979-06-15 | 1980-12-26 |
-
1984
- 1984-12-28 JP JP1984200526U patent/JPH0448124Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS616889U (en) * | 1984-06-18 | 1986-01-16 | 積水化学工業株式会社 | article retention panel |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61117565U (en) | 1986-07-24 |
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