JPS6041744Y2 - Circuit board for leadless electronic components - Google Patents

Circuit board for leadless electronic components

Info

Publication number
JPS6041744Y2
JPS6041744Y2 JP3580184U JP3580184U JPS6041744Y2 JP S6041744 Y2 JPS6041744 Y2 JP S6041744Y2 JP 3580184 U JP3580184 U JP 3580184U JP 3580184 U JP3580184 U JP 3580184U JP S6041744 Y2 JPS6041744 Y2 JP S6041744Y2
Authority
JP
Japan
Prior art keywords
leadless electronic
electronic component
insertion hole
leadless
wiring conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP3580184U
Other languages
Japanese (ja)
Other versions
JPS609256U (en
Inventor
廉 今村
Original Assignee
日本ケミコン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本ケミコン株式会社 filed Critical 日本ケミコン株式会社
Priority to JP3580184U priority Critical patent/JPS6041744Y2/en
Publication of JPS609256U publication Critical patent/JPS609256U/en
Application granted granted Critical
Publication of JPS6041744Y2 publication Critical patent/JPS6041744Y2/en
Expired legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【考案の詳細な説明】 この考案は、リードレス電子部品を挿入配置して電気的
接続をするリードレス電子部品用回路基板に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a circuit board for leadless electronic components on which leadless electronic components are inserted and arranged for electrical connection.

一般に、リードレス電子部品は、コンデンサ、抵抗器等
の素子で構成される部品本体上にリードワイヤに代えて
接続用端子部を形威したものであり、その接続用端子部
でプリント基板の配線導体(パターン)に電気的接続を
可能にしたものである。
In general, leadless electronic components have connection terminals instead of lead wires on the main body of the component, which consists of elements such as capacitors and resistors.The connection terminals are used to connect printed circuit board wiring. It enables electrical connection to conductors (patterns).

このような電子部品をプリント基板に実装する場合、予
めプリント基板に形威した挿入孔に挿入して配置した後
、半田付けしている。
When such electronic components are mounted on a printed circuit board, they are inserted into insertion holes formed in the printed circuit board in advance, placed, and then soldered.

このような半田付は工程を経る場合、接続前の電子部品
の搬入、配置が容易に行えるとともに、部品本体を基板
上に確実に係止でき、自動半田付槽へ移送中の振動等で
基板より落下したり、変位したりしないことが作業能率
、接続の信頼性を高める上から必要である。
When this type of soldering goes through a process, it is easy to carry in and place electronic components before connection, and the component body can be securely latched onto the board. In order to improve work efficiency and connection reliability, it is necessary to prevent the device from falling or being displaced.

また、このような電子部品を多く使用する場合、プリン
ト基板に多くの挿入孔を形威し、且つ、その小型化等の
要求からその機械的強度を低下させることは、電子装置
の信頼性を低下させる原因になるので、接続に際しては
、プリント基板と電子部品との一体化が必要である。
In addition, when many such electronic components are used, the reliability of the electronic device is affected by forming many insertion holes on the printed circuit board and reducing its mechanical strength due to the demand for miniaturization. When connecting, it is necessary to integrate the printed circuit board and electronic components.

そこで、この考案は、基板の挿入孔への挿入を容易化す
るとともに、接続前の係止状態を確実なものとし、接続
後は電子部品との一体化を図って機械的強度の低下防止
を図ることを目的としている。
Therefore, this idea not only makes it easier to insert the board into the insertion hole, but also ensures a secure locking state before connection, and after connection, integrates it with the electronic components to prevent a decrease in mechanical strength. The purpose is to

すなわち、この考案は、基板にリードレス電子部品に応
じて形威された挿入孔の対向する内壁面部に前記リード
レス電子部品を支持する支持段部を形威し、前記挿入孔
の周囲部に選択的に配設された配線導体の一部から成る
配線導体片を前記挿入孔の内部に対向して配置するとと
もに前記支持段部と分離状態で臨ませ、前記リードレス
電子部品の挿入に従って前記配線導体片を前記リードレ
スミ子部品と前記支持段部に沿って変形させ、前記配線
導体片の弾性で前記挿入孔内に前記リードレス電子部品
を保持させかつ前記配線導体片に電気的に接続可能にし
たものである。
That is, this invention forms a support step for supporting the leadless electronic component on the opposing inner wall surface of an insertion hole formed in the board according to the leadless electronic component, and a supporting step part for supporting the leadless electronic component is formed in the peripheral part of the insertion hole. A wiring conductor piece consisting of a part of the selectively arranged wiring conductor is arranged inside the insertion hole to face the support step part in a separated state, and as the leadless electronic component is inserted, the wiring conductor piece is A wiring conductor piece is deformed along the leadless terminal component and the support step, and the elasticity of the wiring conductor piece allows the leadless electronic component to be held in the insertion hole and electrically connected to the wiring conductor piece. This is what I did.

以下、本考案を図面に示した実施例に基づき詳細に説明
する。
Hereinafter, the present invention will be described in detail based on embodiments shown in the drawings.

第1図はこの考案のリードレス電子部品用回路基板の実
施例を示している。
FIG. 1 shows an embodiment of the circuit board for leadless electronic components of this invention.

第1図において、基板2は、ベークライト等の絶縁性合
成樹脂で形成され、この基板2には、リードレスコンデ
ンサ等のリードレス電子部品4を挿入する長方形状の挿
入孔6がそのリードレス電子部品4に応じて形成され、
この挿入孔6の対向する内壁面部には、リードレス電子
部品4が支持する水平の支持面を持つ支持段部8A、8
Bが形成されている。
In FIG. 1, a substrate 2 is made of insulating synthetic resin such as Bakelite, and has a rectangular insertion hole 6 into which a leadless electronic component 4 such as a leadless capacitor is inserted. formed according to part 4,
Support step portions 8A and 8 having horizontal support surfaces on which the leadless electronic component 4 is supported are provided on opposing inner wall surfaces of the insertion hole 6.
B is formed.

基板2の表面には、挿入孔6の周囲部には対向する縁部
に配線導体10A、IOBが選択的に配設され、この配
線導体10A、IOBの一部で形成された配線導体片1
2A、12Bは、挿入孔6の支持段部8A、8Bの上面
部にその支持段部8A、8Bと分離した状態で折り曲げ
可能に対向して挿入孔6の内部に臨ませられている。
On the surface of the substrate 2, wiring conductors 10A and IOB are selectively disposed on opposing edges around the insertion hole 6, and a wiring conductor piece 1 formed of a part of the wiring conductor 10A and IOB
2A and 12B are arranged on the upper surface of the support step portions 8A and 8B of the insertion hole 6 so as to face the inside of the insertion hole 6 so as to be bendable and separate from the support step portions 8A and 8B.

リードレス電子部品4の部品本体14は、絶縁性合成樹
脂等のケースで被覆されるとともに、この部品本体14
の両端部には接続用端子部16A、16Bが形成されて
いる。
The component body 14 of the leadless electronic component 4 is covered with a case made of insulating synthetic resin, etc.
Connecting terminal portions 16A and 16B are formed at both ends.

以上のように構成したので、第2図に示すように、挿入
孔6に矢印方向にリードレス電子部品4を挿入すると、
第3図に示すように、配線導体片12A、12Bは、リ
ードレス電子部品4及び支持段部8A、8Bに沿って変
形する。
With the above configuration, as shown in FIG. 2, when the leadless electronic component 4 is inserted into the insertion hole 6 in the direction of the arrow,
As shown in FIG. 3, the wiring conductor pieces 12A, 12B are deformed along the leadless electronic component 4 and the support steps 8A, 8B.

この結果、リードレス電子部品4の接続用端子部16A
、16Bは配線導体片12A、12Bに接触するととも
に、折り曲げられた配線導体片12A、12Bの持つ弾
力性でリードレス電子部品4は挿入孔6の内部に把持さ
れ、半田付は前の移送中の振動等でその脱落や変位が防
止できる。
As a result, the connection terminal portion 16A of the leadless electronic component 4
, 16B contact the wiring conductor pieces 12A, 12B, and the leadless electronic component 4 is held inside the insertion hole 6 by the elasticity of the bent wiring conductor pieces 12A, 12B, and the soldering is performed during the previous transfer. This prevents it from falling off or being displaced due to vibration, etc.

また、このような把持状態で半田付けを行うことによっ
て、基板2とリードレス電子部品4とを一体化すること
ができ、接続の信頼性を高めることができるとともに、
基板2の機械的強度の低下をも防止できる。
In addition, by performing soldering in such a gripping state, the board 2 and the leadless electronic component 4 can be integrated, and the reliability of the connection can be improved.
It is also possible to prevent a decrease in the mechanical strength of the substrate 2.

しかも、配線に際し、リードレス電子部品4を基板2の
挿入孔6に極めて容易に挿入でき、特に電気的接触のた
めに位置決めについて考慮する面倒さが全くなく、また
、基板2の内部に電子部品4を設置することも可能であ
る。
Moreover, during wiring, the leadless electronic component 4 can be inserted into the insertion hole 6 of the board 2 extremely easily, and there is no need to worry about positioning for electrical contact. It is also possible to install 4.

また、第4図に破線で示すように、リードレス電子部品
4′の形状に合致する挿入孔6を形成して嵌入すれば、
配線導体片12A、12Bを強固に把持させ、接続前の
脱落や変位防止は勿論のこと、半田付けによる接続の信
頼性を高め、基板2の強度低下をも防止できる。
Moreover, as shown by the broken line in FIG. 4, if an insertion hole 6 that matches the shape of the leadless electronic component 4' is formed and inserted,
By firmly gripping the wiring conductor pieces 12A and 12B, it is possible not only to prevent them from falling off or being displaced before connection, but also to improve the reliability of the connection by soldering and to prevent a decrease in the strength of the board 2.

なお、実施例において、リードレス電子部品の形状を直
方体又は円柱状としたが、本考案は、立方体、円板形等
各種の形状の電子部品に適用できるものである。
In the embodiments, the shape of the leadless electronic component is a rectangular parallelepiped or a cylinder, but the present invention can be applied to electronic components of various shapes such as a cube and a disc.

以上説明したように、本考案によれば、基板上へのリー
ドレス電子部品の挿入配置が容易になるので配線作業が
能率化するとともに、接続前の保持固定が確実になるの
で移送中の落下や変位等を防止でき、接続前の取扱いを
能率化し、しかも、リードレス電子部品と基板とを一体
化できるので、接続の信頼性を向上させ、基板の機械的
強度の低下を防止できる。
As explained above, according to the present invention, leadless electronic components can be easily inserted and arranged on the board, making wiring work more efficient, and since they are securely held and fixed before connection, they will not fall during transportation. It is possible to prevent wires and displacements, streamline handling before connection, and integrate leadless electronic components and the board, improving connection reliability and preventing a decrease in the mechanical strength of the board.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの考案のリードレス電子部品用回路基板の実
施例を示す説明図、第2図はその基板に対するリードレ
ス電子部品の挿入を示す説明図、第3図はリードレス電
子部品を取付けた基板を示す断面図、第4図はこの考案
のリードレス電子部品用回路基板の他の実施例を示す断
面図である。 2・・・・・・基板、4,4′・・・・・・リードレス
電子部品、6・・・・・・挿入孔、8A、8B・・・・
・・支持段部、IOA、IOB・・・・・・配線導体、
12A、12B・・・・・・配線導体片。
Figure 1 is an explanatory diagram showing an embodiment of the circuit board for leadless electronic components of this invention, Figure 2 is an explanatory diagram showing the insertion of leadless electronic components into the board, and Figure 3 is an explanatory diagram showing the installation of leadless electronic components. FIG. 4 is a sectional view showing another embodiment of the circuit board for leadless electronic components of this invention. 2... Board, 4, 4'... Leadless electronic component, 6... Insertion hole, 8A, 8B...
...Support step, IOA, IOB...Wiring conductor,
12A, 12B...Wiring conductor pieces.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 基板にリードレス電子部品に応じて形威された挿入孔の
対向する内壁面部に前記リードレス電子部品に支持する
支持段部を形威し、前記挿入孔の周囲部に選択的に配設
された配線導体の一部から成る配線導体片を前記挿入孔
の内部に対向して配置するとともに前記支持段部と分離
状態で臨ませ、前記リードレス電子部品の挿入に従って
前記配線導体片を前記リードレス電子部品と前記支持段
部に沿って変形させ、前記配線導体片の弾性で前記挿入
孔内に前記リードレス電子部品を保持させかつ前記配線
導体片に電気的に接続可能にしたことを特徴とするリー
ドレス電子部品用回路基板。
An insertion hole formed in the board according to the leadless electronic component is formed with a support step portion supporting the leadless electronic component on an opposing inner wall surface thereof, and the supporting step portion is selectively disposed around the insertion hole. A wiring conductor piece made of a part of the leadless electronic component is arranged to face the inside of the insertion hole and face the supporting step part in a separated state, and as the leadless electronic component is inserted, the wiring conductor piece is connected to the lead. The leadless electronic component is deformed along the support step, and the elasticity of the wiring conductor piece allows the leadless electronic component to be held in the insertion hole and electrically connected to the wiring conductor piece. Circuit board for leadless electronic components.
JP3580184U 1984-03-12 1984-03-12 Circuit board for leadless electronic components Expired JPS6041744Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3580184U JPS6041744Y2 (en) 1984-03-12 1984-03-12 Circuit board for leadless electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3580184U JPS6041744Y2 (en) 1984-03-12 1984-03-12 Circuit board for leadless electronic components

Publications (2)

Publication Number Publication Date
JPS609256U JPS609256U (en) 1985-01-22
JPS6041744Y2 true JPS6041744Y2 (en) 1985-12-19

Family

ID=30166487

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3580184U Expired JPS6041744Y2 (en) 1984-03-12 1984-03-12 Circuit board for leadless electronic components

Country Status (1)

Country Link
JP (1) JPS6041744Y2 (en)

Also Published As

Publication number Publication date
JPS609256U (en) 1985-01-22

Similar Documents

Publication Publication Date Title
JPH06302950A (en) Method for mounting hybrid circuit on printed wiring board
JPS6041744Y2 (en) Circuit board for leadless electronic components
JPS5934111Y2 (en) Connection structure of leadless electronic components
JPH0110942Y2 (en)
JPH0593075U (en) Mounting structure for electrical components
JPS6133613Y2 (en)
JPH07221419A (en) Hybrid integrated circuit device
JP2552970Y2 (en) Mounting structure of electrical components on printed circuit boards
JPH037938Y2 (en)
JP2858252B2 (en) Electrode structure of electronic components for surface mounting
JPH0448124Y2 (en)
JPH0412665Y2 (en)
JPS6013184Y2 (en) Connector-junction on printed circuit board
JPH0132377Y2 (en)
JPS62179794A (en) Electric circuit wiring board
JPS6334264Y2 (en)
JPS6010275Y2 (en) insulated terminal
JPS58131638U (en) Hybrid integrated circuit device
JPH0353516Y2 (en)
JPH0755013Y2 (en) Mounting structure of hybrid integrated circuit device
JPH0745977Y2 (en) Board connection structure
JPS58148964U (en) Electrical component mounting structure
JPH0119415Y2 (en)
JPS5817337Y2 (en) Terminal device for printed circuit board
JPS59158359U (en) Lead pattern for external terminal connection