JPH07221419A - Hybrid integrated circuit device - Google Patents

Abstract

PURPOSE:To provide a structure of hybrid with connectors not suited for surface mount wherein the connections of the connectors cannot be peeled by external forces exerted thereon. CONSTITUTION:A hybrid IC 10 is mounted on a printed circuit board 21 to form a hierarchical structure; leads 24 of a connector 22 are inserted in small holes 21 of the circuit board; the top ends of them appearing on the back side of the board are fixed by solder; and a resin is poured into a case to integrate them.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid integrated circuit device, and more particularly to a hybrid integrated circuit device in which an element suitable for surface mounting and an unsuitable connector are integrated.

[0002]

2. Description of the Related Art Generally, a general hybrid integrated circuit mounted on a computer, an audio device, an automobile, etc. has a plurality of leads, and these leads are inserted into the pores of the printed circuit board to form a printed circuit board. Implemented directly. Moreover, this printed circuit board is provided with, for example, a connector for connection with other printed circuit boards, and electrically connects these printed circuit boards.

However, this method has a problem that the cost increases due to an increase in the number of parts, an increase in the number of assembling steps, and the like. For example, Japanese Patent Application No. 5-74218 discloses a hybrid integrated circuit substrate, for example, a connector formed on a ceramic substrate or an aluminum substrate. This utilizes the board itself as one element of the connector, but is a general connector in which leads are directly provided on the board due to cost reduction and user's request.

[0004]

Generally, when a connector is mounted on a ceramic substrate or a metallic substrate, the tips of the leads are bent into an L shape, and the tip surface of the L shape is brought into surface contact with the board for surface mounting. There is. However, the connector is unsuitable for mounting on a hybrid IC substrate or the like because a pulling force acts on the connector to attach or detach the mating connector, resulting in peeling of the connection portion.

Aluminum electrolytic capacitors, AC transformers, switches, etc. are hybrid ICs as well as connectors.
It was not suitable for wearing.

[0006]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and firstly, an electrical treatment is performed via an insulating-treated metallic substrate and a conductive path provided on the metallic substrate. A semiconductor element connected to the printed circuit board, a printed circuit board layered via a spacer provided to maintain a predetermined distance from the metal substrate, and the leads inserted into the pores of the printed circuit board. Except for one connector that is fixed to the conductive path around the hole via solder, a case that fits with the metal substrate and can encapsulate the insulating resin, and an insertion port of the other connector that forms a pair with the connector. The problem is to have at least the insulating resin encapsulated.

Secondly, an insulated aluminum substrate, semiconductor elements electrically connected through conductive paths provided on the aluminum substrate, and one side of the aluminum substrate are directed upward. A plurality of leads provided, a printed circuit board layered via a spacer provided to maintain a predetermined distance from the aluminum substrate, and a first board provided on the printed circuit board and into which the plurality of leads are inserted. One connector electrically connected to the pore group and the plurality of leads, inserted into the pores of the printed circuit board, and fixed to the conductive paths around the pores on the back surface of the board through solder. A case that is fitted with the aluminum substrate to allow the insulating resin to be sealed therein, and an insulating resin that is sealed except for the insertion port of the other connector that forms a pair with the connector. Solves by having even without.

[0008]

In both of these means, a connector is mounted on a printed circuit board having pores, the conductive paths arranged on the back surface of the printed circuit board are connected to the inserted connector leads by soldering, and the printed circuit board and the metallic board are connected to each other. By layering and molding these two substrates, the strength against the tensile force generated in the connector was enhanced.

[0009]

Embodiments of the present invention will be described below with reference to the drawings. In this embodiment, as described above, the unsuitable connector and the like are mounted on the hybrid IC to realize miniaturization, high functionality, reduction of external parts, and the like, and the installation location of the device. The present invention relates to a hybrid integrated circuit which has a higher degree of freedom, can be mounted near a load, etc., and has no wiring through a connector.

The substrate hatched in FIG. 1 is a first substrate (10) having at least a surface subjected to insulation treatment,
For example, a ceramic substrate or a metal substrate. In particular, both substrates generally do not have through holes. The reason is that in the case of a metal substrate, it is a process for preventing a short circuit between the conductive pores and the metal substrate, and in the case of a ceramic, it is necessary to form a conductive film in the pores, which is costly. Therefore, semiconductor devices and components are surface-mounted on the first substrate (10).

Here, an aluminum substrate is used as an example, and a conductive path made of copper having a predetermined pattern is provided in a resin having adhesiveness, and the semiconductor device (1
1) and parts (12) are mounted. The substrate shown at the bottom of FIG. 6 corresponds to this, and a plurality of conductive pads (13) are arranged on the diagonally lower left side, and a plurality of conductive pads (13) are arranged on the pad (13). Book leads (14) are fixed, for example, via solder. Here, (15) is a thin metal wire that electrically connects the electrode pad on the surface of the semiconductor element and the pad arranged on the first substrate (10).

Next, in FIG. 1, the unhatched substrate (20) is the second substrate, which is, for example, a printed circuit board in which pores (21) are easily formed.
The printed circuit board (20) has a conductive path formed on its back surface. A connector (22), an aluminum electrolytic capacitor (23) and a lead (24) such as an AC transformer are inserted into the pores (21) from the front side, and although not shown in the drawing, the back side of the second substrate (20). The lead (24) exposed to the solder and the conductive path provided around the pores are soldered (2).
5) and is electrically connected.

A spacer (30) for holding the first substrate (10) and the second substrate (20) at a predetermined interval is provided, and there is a case (31) for accommodating them. Figure 1
As can be seen from the area indicated by X, the spacer (30) and the case (31) are integrally formed in this embodiment, but there is no problem even if they are separate. FIG. 3 shows a state where both substrates (10) and (20) are set in the case (31). As can be seen from this figure, the side edges (32) of the spacer (30) and the printed circuit board (20) are formed to be slightly shorter in length so that the leads (14) can be exposed upward. The case (31) has an opening (33), and the bottom surface of the case (31) has a first substrate (1) as shown in FIGS. 1 and 2.
0) is fitted.

Here, the first substrate (10) is the same as that shown in FIG.
As described above, it is completely surrounded by the spacer (30) and the case (31) and has a hollow structure portion (34). This hollow portion is formed so that, for example, a power element is mounted on the first substrate (10) and no smoke or flame is generated even if the power element is burst by a large current. Further, the resin is injected into the area indicated by the circle in FIG. 1 and FIG. The arrow (33) in FIG. 1 is the opening and the resin injection port, and the printed circuit board (20) is from the surface of the first substrate (10) corresponding to the arrow.
Resin is also injected into the area between the front surface and the back surface of the printed board and the spacer (30) through the injection hole. Here, the injection height of the resin is such that the connecting portion of the connector can be exposed. Further, if a switch is mounted, the height needs to be such that the switch can be operated.

The first feature of the present invention is that the second substrate (2
The lead (24) is inserted into the pore (21) of 0),
The leads (24) and the conductive paths formed on the back surface of the second substrate (20) are present in the connector (22) fixed via the solder (25). As described in the section of the problem to be solved by the invention, when the first substrate (10) and the leads of the connector are fixed by surface contact, the external force acting in the direction of arrow A in FIG. 1, that is, the connector ( 22), the fixing portion is peeled off by the force when attaching or detaching another connector which is paired with 22). However, as is clear from FIGS. 1 and 2, the solder (25) is the printed circuit board (20). Since the conductive paths on the back surface of the and the leads (24) are fixed to each other, it becomes very strong against an external force against the arrow A.

Next, a method of connecting the first substrate (10) and the second substrate (20) will be described. In this example,
The printed circuit board (20), which is the second substrate, will be described assuming that the conductive paths are formed on one side, that is, on the lower side of the printed circuit board in FIG. That is, on both sides, if the circuit on the back surface of the printed circuit board is electrically connected to the conductive path D2 that has been extended to the front surface of the printed circuit board through the through hole or the conductive path D1 in advance, as shown in FIG. Although it is possible to solder the path D2 and the lead (14) on the surface of the printed circuit board, the installation of the printed circuit board having the through hole and the double-sided conductive path has a problem of increasing cost.

One side, ie, the printed circuit board (10) of FIG.
Consider a case where a conductive path is formed on the back surface of the. If the size of the opening (33) is large enough to allow passage of either the first substrate (10) or the second substrate (20) through the opening, the first substrate is
The second substrate and the leads (14) can be integrated by soldering and then set in the case through this opening. However, in this case, there is a problem that the opening becomes very large and the size of the apparatus is increased.

Therefore, the first substrate (10) is mounted with semiconductor elements and the leads (14) are soldered, and the printed circuit board (20) is shown with the connector (22) and the like in FIG. As described above, the lead (24) is inserted into the pores and soldered and the electrical connection is not achieved, and the case is set in the case. As shown in FIG. 6, the printed circuit board (20) is provided with a notch (41) in front of the pore (40) so that the lead (14) can be easily inserted into the pore. FIG. 3 shows a state in which the lead (14) is inserted into the pore through the notch (41). FIG. 1 is a cross-sectional view of this state, and as can be seen from this, since the conductive paths are provided only on the back surface of the printed circuit board (20), the back surface of the printed circuit board when set as shown in FIG. It is impossible to solder to
This problem is solved by the connection method shown in.

That is, the lead on the left side of FIG. 5 is the lead (14) extending from the first substrate, and the lead on the right side is electrically connected to the conductive path formed on the back surface of the printed circuit board (20). Is connected (soldered), and at least one of them is bent so that two leads can come into contact with each other, and the intersecting portion is fixed by soldering. Therefore, the substrates (10) and (20) can be attached to the resin frame in which the spacer (30) and the case (31) are integrated, and electrical connection can be easily performed.

[0020]

As is apparent from the above description, the second
When the leads are inserted into the pores of the board, and a connector fixed via the conductive path on the back surface via solder is provided, and the second board and the first board are molded, the removal of the paired connector is prevented. Also in this case, the connector attached to the printed board is firmly fixed, and peeling of the connection portion can be eliminated.

Further, since the printed circuit board for connecting the hybrid integrated circuit and the external device is integrated with this device, the printed circuit board can be eliminated, and the connector and the Al electrolytic capacitor which are not suitable for mounting in the hybrid IC. Since a transformer or the like can be mounted, the degree of freedom in the installation location of the device is increased, and the connection with the connector can eliminate the need and wiring.

By bending at least one of the lead attached to the side of the first substrate and the lead attached to the second substrate, it becomes possible to electrically connect both leads, which is inexpensive on one side. A printed wiring board can be used.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of a hybrid integrated circuit device that is an embodiment of the present invention.

FIG. 2 is a cross-sectional view of a hybrid integrated circuit device that is an embodiment of the present invention.

FIG. 3 is a perspective view of a hybrid integrated circuit device that is an embodiment of the present invention.

FIG. 4 is a diagram illustrating a method of connecting a first substrate and a second substrate.

FIG. 5 is a diagram illustrating a method of connecting a first substrate and a second substrate.

FIG. 6 is a diagram illustrating a relationship between a first substrate, a second substrate and a spacer.

[Explanation of symbols]

 10 First Substrate 14 Lead 20 Second Substrate 21 Pore 22 Connector 24 Lead

Claims (4)

[Claims] 1. A metallic substrate that has been subjected to an insulation treatment, a semiconductor element electrically connected to the metallic substrate through a conductive path provided on the metallic substrate, and a metal substrate for holding a predetermined distance from the metallic substrate. A printed circuit board that is layered via a spacer, a lead of which is inserted into a fine hole of the printed circuit board, and one connector that is fixed to a conductive path around the fine hole on the back surface of the printed circuit board by soldering; A hybrid integrated circuit device comprising at least a case fitted to a substrate and capable of encapsulating an insulating resin, and an encapsulating resin excluding an insertion port of the other connector forming a pair with the connector. 2. An insulated aluminum substrate, a semiconductor element electrically connected through a conductive path provided on the aluminum substrate, and an upwardly provided one side of the aluminum substrate. A plurality of leads, a printed circuit board that is layered via a spacer that is provided to maintain a predetermined distance from the aluminum substrate, and a first fine hole that is provided in the printed circuit board and has the plurality of leads inserted therein. Group and electrically connected to the plurality of leads, the leads are inserted into the pores of the printed circuit board,
One connector fixed to the conductive path around the pores on the back surface of the substrate through solder, a case that fits with the aluminum substrate to allow encapsulation of insulating resin, and the other connector that forms a pair with the connector. And an insulating resin sealed except for the insertion opening of the hybrid integrated circuit device. 3. The hybrid integrated circuit device according to claim 2, wherein conductive paths are formed on both surfaces of the printed circuit board, and the plurality of leads and the connector are electrically connected to each other through the conductive paths on the front surface. 4. A conductive path is formed only on the back surface of the printed circuit board, a plurality of leads connected to the conductive path of the printed circuit board and extending on the front surface, and a plurality of leads provided on the aluminum substrate. The hybrid integrated circuit device according to claim 2, wherein leads are connected on a surface of the printed circuit board.