JPH0519974Y2 - - Google Patents

Description

[Detailed Description of the Invention] (a) Field of Industrial Application The present invention relates to a hybrid integrated circuit, and particularly to an improvement in the connection structure between a hybrid integrated circuit consisting of two metal substrates and an external circuit, that is, a printed wiring board.

(b) Conventional technology A conventional hybrid integrated circuit is shown in Figure 3 (1983-8316).
As shown in (see Japanese Patent Publication), two metal substrates 21,
22, circuit elements 23, 24 provided on the metal substrates 21, 22, external leads 25, 26 led out from one side of the metal substrates 21, 22, and a frame body that separates the metal substrates 21, 22. It consists of 27.

Aluminum is used for the metal substrates 21 and 22, and the surfaces thereof are subjected to insulation treatment to form desired conductive paths 2.
After 8, 29 are formed, a plurality of circuit elements 23, 24 are fixed on the conductive paths 28, 29. A plurality of external leads 25 and 26 are fixed to the conductive pads provided at one peripheral end of the metal substrates 21 and 22 where the conductive paths 23 and 24 extend so as to protrude horizontally from the metal substrates 21 and 22. be done. The two metal substrates 21, 21 formed in this way are fixed apart by the frame 27, and a resin such as epoxy resin is filled in the space formed by the peripheral ends of the metal substrates 21, 22 and the frame 27. 30 to protect and integrate the connecting parts of the external leads 25 and 26. When such a hybrid integrated circuit is mounted on a mounting board such as a printed circuit board, it is usually provided on the mounting board 31 as shown in Fig. 4. External leads 25 and 26 are inserted into the holes and connected to electrodes 32 and 33 provided on the lower surface of the mounting board 31 using solder 34 to integrate with an external circuit.

(c) Problems that the invention aims to solve However, as shown in Figure 4, when a hybrid integrated circuit consisting of two substrates is mounted on a mounting board, the external leads and the electrodes of the mounting board are firmly connected by solder. Therefore, there was a problem that once it was attached to the mounting board, it could not be easily removed.

(d) Means for solving the problem The present invention was made in view of the above-mentioned problem, and as shown in Fig. 1, two metal substrates 1,
2, an insulating film provided on the two metal substrates 1 and 2, a desired conductive path 6 formed on the insulating film, a plurality of circuit elements 9 fixed on the conductive path 6, and a conductive path. a conductive pad 7 formed at one peripheral end of each of the extending metal substrates 1 and 2 for connection to an external circuit; and a frame-shaped frame portion 3 that separates the two metal substrates 1 and 2. In the hybrid integrated circuit, a groove 5 into which a printed wiring board 8 is inserted is provided approximately at the center of the frame 3, and the groove 5 is inserted into the side surface of the printed wiring board 8 to be integrated. and solve it.

(E) Effect As described above, according to the present invention, by providing the groove portion 5 in the frame portion 3 of the case material 4, the hybrid integrated circuit is supported by the groove portion 5 when the printed wiring board 8 is mounted.
The surface of the hybrid integrated circuit having the groove 5 can be used as a connector.

(F) Embodiment The present invention will be explained in detail below based on the embodiment shown in FIG.

First, as shown in FIG. 1, the hybrid integrated circuit of the present invention has two metal substrates 1 and 2, and a case in which the two metal substrates 1 and 2 are spaced apart and has a groove 5 approximately in the center of a frame 3. It is composed of material 4.

The two metal substrates 1 and 2 are aluminum substrates, the surfaces of which are provided with an aluminum oxide film by anodic oxidation. An insulating resin layer such as epoxy or polyimide resin is provided on the metal substrates 1 and 2 in order to prevent the conductive path 6 and the metal substrates 1 and 2 from being shot. A copper foil is pasted on the insulating resin layer in advance, and the copper foil is etched into a desired pattern to form a conductive path 6. The conductive path 6 is formed over substantially the entire area of each of the metal substrates 1 and 2, and a plurality of conductive pads 7 are formed at the peripheral edge of one side of the substrates 1 and 2 for connection with an external circuit. A plurality of circuit elements 9, 9 such as semiconductor integrated circuits, transistors, chip parts, etc. are fixed at predetermined positions on the conductive path 6, and external leads 10 are fixed on the conductive pad 7.

The external leads 10 are led out from the sides of the metal substrates 1 and 2, and the tip of each external lead 10 is smaller than the thickness of the printed wiring board 8 in order to make good contact with the conductor 11 on the printed wiring board 8. Preferably, they are arranged at intervals.

The case material 4 is formed into a frame shape in order to separate the two metal substrates 1 and 2 and seal the circuit element 9. Frame portion 3 of case material 4 formed in a frame shape
A groove portion 5 parallel to the metal substrates 1 and 2 is provided approximately at the center of the substrate. The width of the groove 5 is formed to be the same as the thickness of the printed wiring board 8, and its depth is arbitrary as long as the hybrid integrated circuit is supported when the groove 5 is inserted into the printed wiring board 8. For example 5mm
A range of ~10 mm is preferred.

After the two metal substrates 1 and 2 are fixed and integrated on the case material 4 to form a hybrid integrated circuit, the groove portion 5 of the case material 4 is inserted into the side surface of the printed wiring board 8 to connect the hybrid integrated circuit and the printed wiring board 8. Unify. At this time, a desired circuit conductor 11 is formed on the printed wiring board 8, and the external lead 10 and the circuit conductor 11 are connected. At this time, since the external leads 10 sandwich the printed wiring board 8, they can be reliably connected to the circuit conductors 11. Furthermore, if connection strength is required, it is also possible to connect by soldering.

As described above, according to the present invention, by providing the groove 5 in the case material 4 into which the printed wiring board 8 is inserted, the hybrid integrated circuit is supported when the printed wiring board 8 is installed, and the groove 5 surface of the case material 4 can be used as a connector. Can be used.

Another embodiment is shown in FIG. In this embodiment, a connection is made to a printed wiring board 8 without using an external lead, and a terminal 12 of a predetermined thickness is fixed on the conductive pad 7, that is, on the peripheral edge of the metal substrates 1 and 2 with adhesive or the like. Insert into printed wiring board 8.

The terminal 12 is formed of an insulating material, and the terminal 12
A plurality of electrodes 13 corresponding to the conductive pads 7 are provided. If the width between the terminals 12 is made approximately the same size as the groove portion 5 of the case material 4, stable attachment to the printed wiring board can be achieved.

(g) Effects of the invention As detailed above, according to the invention, by providing a groove in the case material into which the printed wiring board is inserted, the side surface of the hybrid integrated circuit provided with the groove can be connected to the connector part. It can be easily attached to and connected to a printed wiring board.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing an embodiment of the present invention, FIG. 2 is a sectional view showing another embodiment, and FIGS. 3 and 4 are sectional views showing a conventional example. 1 and 2 are metal substrates, 4 is a case material, 5 is a groove part,
6 is a conductive path, 8 is a printed wiring board, 9 is a circuit element, 10 is an external lead, and 12 is a terminal.

Claims (1)

[Scope of utility model registration request] two metal substrates, an insulating film provided on the two metal substrates, a desired conductive path formed on the insulating film, a plurality of circuit elements fixed on the conductive path, and the A conductive pad formed for connection to an external circuit at the peripheral edge of at least one side of each of the metal substrates on which a conductive path extends, and a frame-shaped frame portion separating the two metal substrates. A hybrid integrated circuit comprising a case material having a case material, wherein a groove portion into which a printed wiring board is inserted is provided approximately at the center of the frame portion, and the groove portion is inserted and integrated into a side surface of the printed wiring board. hybrid integrated circuit.