JPH0672249U - Integrated circuit device - Google Patents

Abstract

(57) [Summary] [Purpose] The density of the boards is further increased by connecting a plurality of boards with one lead. [Structure] The opposing surfaces 1a of the plurality of substrates 1 are adhered to each other using the adhesive 3 with the substrate holding material 2 formed of an insulating material. The plurality of substrates 1 are sandwiched between the end portions 4a of the leads 4, each end portion 4a and the other surface 1b of each substrate 1 are soldered with solder 5, and the leads 4 are soldered to the mother substrate 6 with the solder 5. Implement.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to an integrated circuit device including a plurality of substrates.

[0002]

[Prior art]

 Conventionally, the following ideas have been disclosed as integrated circuit devices. For example, in the device described in Japanese Utility Model Laid-Open No. 64-5456, as shown in FIG. 8, an electric circuit device formed on a substrate 51 and at least one pair of independent leads 52 are integrally formed via an insulator 53. Formed lead structure 54, and the lead structure 54 sandwiches the substrate 51 between the ends of the pair of leads 52, and the corresponding lead connection portion of the wiring pattern provided on both surfaces of the substrate 51. Is electrically connected to each of the leads 52.

The lead structure 54 holds the substrate 51 from the mother substrate 55 at regular intervals, and electrically connects the leads 52 to corresponding lead connecting portions of the wiring patterns provided on both surfaces of the substrate 51. .

[0004]

[Problems to be solved by the device]

 However, in the above-mentioned conventional technique, the lead structure can connect only one substrate, and it is difficult to increase the density of the substrate.

Therefore, the present invention was developed in view of the drawbacks of the prior art described above, and by connecting a plurality of substrates with one lead, it is possible to further increase the density of the substrates. It is intended to provide a circuit device.

[0006]

[Means for Solving the Problems]

 The present invention relates to a plurality of substrates on which wiring patterns for electric circuits are formed, a mother substrate on which wiring patterns for electric circuits are formed, and a wiring pattern for the substrates and a mother substrate by sandwiching the plurality of substrates. It is composed of a lead that electrically connects to the wiring pattern and a board holding member that is provided between a plurality of boards to hold the space between the boards.

[0007]

[Action]

 In the present invention, the lead holds a plurality of substrates and electrically connects the wiring pattern provided on the plurality of substrates to the wiring pattern provided on the mother substrate. It has the function of keeping the distance.

[0008]

Embodiment 1 FIG. 1 is a partial sectional view showing this embodiment.

The facing surfaces 1 a of the plurality of substrates 1 are adhered to each other using the adhesive 3 with the substrate holding material 2 formed of an insulating material. The plurality of substrates 1 are sandwiched between the end portions 4a of the leads 4, each end portion 4a and the other surface 1b of each substrate 1 are soldered with solder 5, and the leads 4 are soldered to the mother substrate 6 with the solder 5. Implement.

According to the present embodiment, a plurality of substrates can be connected with one lead, and the substrates can be densified. In addition, the spacing between the plurality of substrates can be properly maintained, and insulation between the substrates can be obtained.

[0011]

Second Embodiment FIG. 2 is a partial sectional view showing the present embodiment.

The present embodiment is different in that instead of the insulating substrate holding material 2 adhered by the adhesive 3 in the first embodiment, a substrate holding material 7 formed of a conductive material is soldered with solder 5, Since other configurations are composed of the same components, the same components are designated by the same reference numerals and the description thereof will be omitted.

According to the present embodiment, by using a conductive material as the substrate holding material, it is possible to electrically connect a plurality of substrates in addition to the connection by the leads.

[0014]

Third Embodiment FIG. 3 is a partial sectional view showing the present embodiment.

The present embodiment is different in that the lead 4 in the first embodiment is replaced by a lead 8 having a substantially T-shape, and the other structure is composed of the same constituent parts and has the same structure. The same numbers are given to the components and the description thereof is omitted.

According to this embodiment, by changing the shape of the lead, it is possible to deal with a so-called single in-line type in which the lead is emitted from one direction of the substrate.

[0172]

Fourth Embodiment FIGS. 4 and 5 show the present embodiment, FIG. 4 is a partial sectional view, and FIG. 5 is a side view of FIG.

The facing surfaces 1 a of the plurality of substrates 1 are adhered to each other using the adhesive 3 with the substrate holding material 2 formed of an insulating material. The plurality of substrates 1 are sandwiched by the end portions 11a and 12a of the leads 11 and 12, and the respective end portions 11a and 12a and the other surface 1b of each substrate 1 are soldered by the solder 5, and the leads 11 and 12 are further fixed. Mount to mother board 6 with solder 5.

In the apparatus having the above-described configuration, the lead 11 connects the other surface 1 b of the substrate 1 and the mother substrate 6, and the lead 12 connects the opposing surface 1 a of the substrate 1 and the mother substrate 6.

According to this embodiment, the facing surface and the other surface of the substrate can be independently connected to the mother substrate, and the substrate can be densified.

[0021]

Fifth Embodiment FIG. 6 is a partial sectional view showing the present embodiment.

In this embodiment, the sub leads 13 are soldered with the solder 5 between the lower substrate 1 (the mother substrate 6 side) and the mother substrate 6 in the first embodiment. Have the same configuration, the same numbers are given to the same components and the description thereof is omitted.

According to this embodiment, since the sub-leads are provided, it is possible to electrically connect between the plurality of substrates and the mother substrate in addition to the connection by the leads.

[0024]

Sixth Embodiment FIG. 7 is a partial sectional view showing the present embodiment.

Through holes 14 are formed in the lower substrate 1 (the mother substrate 6 side) of the plurality of substrates 1. A sub lead 15 as a substrate holding material is penetrated through the through hole 14, and the opposing surface 1a of the substrate 1 and the sub lead 15 are soldered with solder 5, and the other surface 1b of the lower substrate 1 and the mother substrate 6 and the sub lead The sub leads 15 are mounted on the mother board 6 by soldering 15 and 15 with the solder 5.

Further, the plurality of substrates 1 are sandwiched between the end portions 4 a of the leads 4, and the respective end portions 4 a and the other surface 1 b of each substrate 1 are soldered by the solder 5, and the leads 4 are connected to the mother board 6. Mount with solder 5.

According to the present embodiment, by providing the sub-leads, it is possible to electrically connect between the plurality of substrates and between the plurality of substrates and the mother substrate in addition to the connection by the leads.

[0028]

[Effect of device]

 As described above, according to the integrated circuit device of the present invention, the density of the substrates can be further increased by connecting the plurality of substrates with one lead.

[Brief description of drawings]

FIG. 1 is a partial cross-sectional view showing a first embodiment.

FIG. 2 is a partial cross-sectional view showing a second embodiment.

FIG. 3 is a partial sectional view showing a third embodiment.

FIG. 4 is a partial cross-sectional view showing a fourth embodiment.

FIG. 5 is a side view of FIG.

FIG. 6 is a partial cross-sectional view showing a fifth embodiment.

FIG. 7 is a partial cross-sectional view showing a sixth embodiment.

FIG. 8 is a partial cross-sectional view showing a conventional technique.

[Explanation of symbols]

 1 substrate 2 substrate holding material 3 adhesive 4 lead 5 solder 6 mother substrate

Claims (1)

[Scope of utility model registration request] 1. A plurality of substrates on which wiring patterns of electric circuits are formed on a substrate, a mother substrate on which wiring patterns of electric circuits are formed on a substrate, and wiring patterns and mothers of the substrates sandwiching the plurality of substrates. An integrated circuit device comprising: a lead for electrically connecting a wiring pattern of a substrate; and a substrate holding member provided between a plurality of substrates for holding a space between the substrates.