JPS62208691A - Double-sided mounting hybrid integrated circuit - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a hybrid integrated circuit, and more particularly to a double-sided mounting type hybrid integrated circuit that enables connection of double-sided circuit patterns suitable for high density.

[Prior art] In conventional double-sided mounting type hybrid integrated circuits, when connecting double-sided patterns, for example, Japanese Patent Laid-Open No. 60-11
Predetermined conductor circuits by screen printing on a ceramic substrate as described in No. 01.90.

A hybrid integrated circuit element having a resistance circuit formed thereon and predetermined components mounted on the substrate, and a flexible printed circuit board having a predetermined conductor circuit and through holes formed on a flexible double-sided copper-clad laminate, The edges of the flexible printed circuit board are bonded to the surface of the hybrid integrated circuit element and the surface opposite thereto, and the edges of the flexible printed circuit board are folded back to the surface side of the hybrid integrated circuit to be combined with the flexible printed circuit board. It has been proposed that the external connection conductor part of the flexible printed circuit board and the external connection part conductor of the hybrid integrated circuit element are overlapped and electrically connected so that the integrated circuit element and the integrated circuit element form an integral structure.

Also, as described in Japanese Patent Application Laid-Open No. 60-77489,
Two ceramic substrates each having a circuit pattern formed only on one side are provided corresponding to the two divided electronic circuits.
It has been proposed that these two substrates are bonded and electrically connected using a connecting member such as an insertion pin.

Furthermore, as described in Japanese Patent Application Laid-open No. 60-31291, circuit components such as IC chips and multilayer ceramic capacitors are mounted on both sides of an insulating substrate, and external lead-out terminals are taken out from only one side of the substrate and placed near the terminals. Opposing sides are made into an uneven shape, and electrode bats for connecting the front and back sides are arranged on both sides of the unevenness, and the convex part of the substrate on which the electrode bats are arranged is immersed in a conductive resin reservoir, thereby forming a gap between the front and back electrode bats. Proposals have been made to make electrical connections.

These conventional examples are used when the number of connection points is not very large.

[Problems to be Solved by the Invention] The above-mentioned conventional technology did not give consideration to reducing the area required for each connection point, so there was a problem that the area required for each connection point became large. .

That is, in the conventional technology, the through hole, the insertion pin, the conductive frame and the external lead terminal 1
Since each connection point is one, each connection point requires an area of about 3 to 5 m, which increases the overall area and makes it difficult to achieve high density.

An object of the present invention is to solve the problems of the prior art as described above, and to provide a double-sided mounting type hybrid integrated circuit which can reduce the area required per connection point, downsize the overall area, and enable higher density. It is about providing.

[Means for Solving the Problems] The above object is to provide a through hole connecting both sides of an insulating substrate having circuit patterns on both sides, and to insert wiring into the through hole and connecting to the circuit pattern on the peripheral surface. This is achieved by providing a connecting member with a pattern.

[Operations] By configuring as described above, it becomes possible to connect multiple connection points at once, so the area per connection point becomes smaller, resulting in a smaller overall area and higher density. be able to.

[Example] Hereinafter, FIGS. 1 to 5 showing examples of the present invention will be described. FIG. 1 is a perspective view showing the gist of the double-sided mount type hybrid integrated circuit according to the present invention, FIG. 2 is a vertical sectional view of FIG. 1, and FIGS. 3 to 5 are pins shown in FIGS. 1 and 2. FIG.

1 and 2, reference numeral 1 denotes an insulating substrate, with a through hole 4 connecting both the front and back surfaces of the insulating substrate 1, and a plurality of circuits radially extending on both the front and back surfaces of the insulating substrate 1 so as to be connected to the through hole 4. Patterns 2 and 3 are formed. Reference numeral 5 denotes a connecting member made of a cylindrical insulator, and is constructed as shown in FIGS. 3 to 5, for example. That is, as shown in FIG. 3, a flexible printed circuit board 6 made of a thin plate-like insulator has a plurality of wiring patterns 7 formed in parallel on its surface for connecting the front side circuit pattern 2 and the back side circuit pattern 3. A plurality of wiring patterns 8 may be formed by wrapping the conductive paste around the outer circumferential surface of the pin 5a, or by printing and baking a conductive paste on the outer circumferential surface of the pin 5b, which is made of cylindrical ceramic, as shown in FIG. , or the fifth
As shown in the figure, a plurality of wiring patterns 9 are formed by embedding conductor wires in the outer peripheral surface of a pin 5c made of cylindrical resin. Reference numeral 10 uses solder to connect electrically between the plurality of wiring patterns 7.8.9 on the outer circumferential surface of the pins 5a, 5b, 5c and the plurality of front side circuit patterns 2 and the plurality of back side circuit patterns 3. It is attached so that it can be connected.

Since the double-sided mount type hybrid integrated circuit according to the present invention is constructed as described above, the case where a flexible printed circuit board 6 as shown in FIG. 3 is used as the connection member 5 will now be described. is 1.5m, and the pitch of the wiring pattern 7 of the flexible printed circuit board 6 is 0.
．． 5+nm, the number of wiring patterns 7 formed on the flexible printed circuit board 6, that is, the wiring patterns 7, the front side circuit pattern 2 and the back side circuit pattern 3.
The number of connection points with is 2×1.5×π÷0.5=18. Also, the required area for each connection point is 1. Considering that Xo, 3mm” and this soldering bat will be installed on both sides of the insulating board 1, (1,5” X 7C/ 18+0.3) X 2
=1. ．． It becomes 4mn2.

On the other hand, the required area per connection point in the conventional through-hole printing method is (0,752
X 7C)

As described in "Effects of the Invention" 2, according to the present invention, the area required for each connection point is smaller than that of the conventional method, so the overall shape is smaller and higher density is achieved. be able to.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing the main parts of a double-sided mount type hybrid integrated circuit according to the present invention, FIG. 2 is a vertical sectional view of FIG. 1, and FIGS. 3 to 5 are shown in FIGS. 1 and 2. It is a perspective view of a pin. 1... Insulating board, 2, 3... Circuit pattern, 4...
・Through hole, 5... Connection member, 5a, 5b, 5c...
Pin, 6...Flexible printed circuit board, 7, 8.9
...Wiring pattern, 10...Solder.

Claims (1)

[Claims] 1. A through hole is provided to connect both sides of an insulating substrate having circuit patterns on both sides, and a connecting member is provided on the circumferential surface of the insulating substrate to be fitted into the through hole and has a wiring pattern connected to the circuit pattern. A double-sided mounting type hybrid integrated circuit. 2. The connecting member is comprised of a pin made of an insulator and a flexible printed circuit board that is wrapped around the circumferential surface of the pin and has a wiring pattern on its surface. double-sided mounted hybrid integrated circuit. 3. The connecting member includes a pin made of ceramic;
The double-sided mounting type hybrid integrated circuit according to claim 1, further comprising a wiring pattern formed by printing and baking a conductive paste on the circumferential surface of the pin. 4. The connection member is comprised of a pin made of resin and a wiring pattern formed by embedding a conductor wire in the circumferential surface of the pin. Double-sided mounted hybrid integrated circuit as described.