JPS63246887A - Surface mount component package - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to an electronic component package, in particular, a surface mounting component is mounted on the top side of the package, and other components are connected to each other by conductor pins protruding from the bottom side. The present invention relates to a package for surface mount components for mounting on a board or the like.

(Prior Art) With the recent development of electronic technology, the degree of integration of electronic components such as so-called semiconductor devices has become considerably high. - On the other hand, it is natural that there is an increasing demand for high-density mounting of such electronic components as the density of electronic components increases. In order to cope with the high-density mounting of electronic components, which are becoming increasingly integrated, we have developed a new technology called Seed! Although various mounting technologies have been developed,
However, the reality is that packaging technology that can adequately cope with the increasing density of electronic components is still in the development stage. In other words, while the densification of electronic components is taking the lead, the densification of packaging technology is currently catching up. In particular, electronic components in recent years have become equipped with a large number of connection terminals as their density has increased (
Surface mounting technology and mounting technology using conductor pins have been developed as mounting technologies to deal with this problem.

As surface mounting technology, for example, Japanese Patent Application Laid-Open No. 59-19585
As seen in Publication No. 0, etc., electronic components are housed in a cap and their connection terminals are made to protrude from the side of the cap.
The positions of these connection terminals were made to correspond to the patterns on the printed wiring board. Then, the connection terminals of this electronic component are placed on the connection portions formed on the board and are directly connected to the pattern using solder or the like. As a result, this surface mount technology has advantages such as being able to flatten the electronic component itself and eliminating the need for processing that requires complicated processes such as forming connection holes for the electronic component on the board. It is something. On the other hand, as a mounting technique using conductor pins, for example, Japanese Patent Application Laid-Open No. 60-2412
It is similar to that seen in Publication No. 44, etc., and the patterns electrically connected to each conductor pin are formed so as to concentrate on the electronic components to be mounted, and are small and require protection such as resin sealing. It is suitable for mounting necessary electronic components.

However, although the surface mount technology has the above-mentioned advantages, it is usually difficult to form an external connection part on the straight part of a surface mount component.

The reason is that a surface mount board requires a two-dimensional conductor circuit to electrically connect each connection part formed on its surface, but this conductor circuit is covered by the surface mount component. This is because it becomes difficult to use the lower side of the surface mount component. Therefore, it is difficult to achieve the above-mentioned high-density mounting using only this surface mounting technology.

In addition, regarding mounting technology using conductor pins, this technology is usually achieved as a so-called pin grid array, but
It is necessary to prepare conductor pins equal to the number of terminals of electronic components mounted on this pin grid array, and although there are the advantages mentioned above, it is difficult to use multiple electronic components on the same pin grid array at the same time. . In particular, in conventional pin grid arrays, conductor circuits and conductor pins suitable for one electronic component mounted thereon are usually formed, and the mounting aspect of that one electronic component is Although it is sufficient from the above, it is easy to understand that the versatility is not sufficient because it is such a specific thing.

In other words, conventional pin grid arrays are designed and manufactured for each electronic component to be mounted, and the manufacturing thereof requires a large amount of time and cost.

Furthermore, in recent years, so-called programmable ICs have been developed as surface-mount components that can be programmed after mounting, but these programmable ICs have great utility because circuits can be freely formed inside them. It's expensive.

However, in order to use this programmable IC, a mounting circuit is required, but if this mounting circuit is fixed, the manner in which the programmable IC is used will also be fixed. Therefore, it would be very convenient if the mounted circuit could be freely converted even after the programmable IC has been mounted.

In view of the above-mentioned actual situation in mounting technology, the inventors of the present invention have realized that high-density mounting is possible for this type of electronic component package, and that it is possible to achieve high-density mounting on the electronic component side and change the circuit after mounting. As a result of various studies in order to develop a packaging technology that can not only fully respond to the high density of electronic components, but also be able to precede the high density of electronic components, we have developed a packaging technology that uses the surface mount technology and conductor pins mentioned above. The present invention was completed based on the new finding that even higher density packaging can be achieved by effectively utilizing the advantages of technology.

(Problems to be Solved by the Invention) The present invention was made due to one or more reasons, and the problems to be solved are the lack of high density and versatility in the conventional technology for mounting electronic components. It is.

It is an object of the present invention to provide a package for surface mount components that has a simple configuration, allows sufficient use and development of the prior art, and allows for the necessary high-density mounting. A more specific object of the present invention is to make the package for surface mount components highly versatile by allowing circuit changes even after the components are mounted.

(Means for solving the problems) The means taken by the present invention to solve the above problems are as follows:
Referring to FIGS. 1 to 3, which correspond to the embodiment, it will be explained as follows: ``A connection part (11) formed on the front side for mounting a surface mount component (40), and this connection part ( 11) and a first substrate (lO) having a first through hole (I2) electrically connected to the first through hole (I2).

A conductor pin (23) provided on the back side for establishing electrical continuity with another board, etc., and a first varnish through which electrically conducts with the electrical conductor pin (23) and corresponds one-to-one with the connecting portion (11). The second board (20) is integral with the first board (10) and has a hole (22). ) are inserted through the third through holes (31), and a conductor layer (32) selectively connects these third through holes (31). ) on each connection part (11) and each conductor pin (Z
3) The third substrate (
30) is a package for surface mount components (100) J.

(Actions of the Invention) By adopting the above-described measures, the present invention has the following effects.

First, the package for surface mount components according to the present invention (100
), the first board that enables surface mounting (]0)
and a second board (20) having a large number of conductor pins (23).
At the same time, each conductor pin (23) is inserted into each third through hole (31) and fixed, so it embodies surface mount technology and mounting technology using conductor pins in one package. It becomes.

That is, the plurality of connection parts (11) formed on the front side of the first substrate (lO) are connected to the lower side of the second substrate (20) via the first through hole (12) and the second varnished through hole (22). Since each conductor pin (23) protruding from
There are no external connection parts for each surface mounting component (40) on the front side of the board, and the board is very flat. In addition, the connection part (10) on the first board (10) side and the conductor pin (23) on the second board (20) side are electrically connected to the first through hole (12) and the second through hole (23). Since the connection terminals (41) of each surface mount component (40) are connected to each other through the holes (22), the connection terminals (41) of each surface mount component (40) meet the general standards (standards such as arranging a plurality of external connection terminals in a lattice shape with predetermined intervals). ) Even if each surface mount component (23) is formed according to a standard outside the standard, it is possible to mount it within the standard by arranging each conductor pin (23) according to a general standard.In other words, each surface mount component (40 ) connection terminals (41)
Even if the component is formed in a format other than the standard, this package (100) for surface-mounted components will fit each conductor pin (2).
By setting the arrangement of 3) to a standard arrangement, for example, a pitch of 2.54 mm, the versatility of mounting each surface mount component (40) is increased.

Expressing the fact that this surface mount component package (+00) increases the versatility of mounting each surface mount component (40), for example, it is located at the upper side of the diagram in FIG. Like the surface mount component (40), the connection terminal (41)
) can also be formed on the lower surface of the surface mounting component (40) itself.

In other words, it is not necessary to form a conductive circuit for the connection terminal (41) formed on the lower side of this surface mount component (40) on the front side of the first substrate (lO) as in conventional surface mount technology. The connection terminal (41) formed on the lower side of the surface mount component (40) is connected to the conductor pin (23) via the first through hole (12) and the second varnished through hole (22). Because you just have to.

In addition, among the surface mount components (40), the connection terminals (41) connected to a common part such as a power supply terminal,
Connect this to the common conductor pin (23) through the first through hole (1
2) By connecting through the second varnished through hole (22), it is possible to effectively utilize the space of the surface mount component package (100), which also serves to increase mounting efficiency. It is.

In addition, this surface mount component package (100) can use conventional surface mount technology on the first board (10) 1111, while on the second board (20) side, conductor pins are used. Since it is possible to utilize mounting technology using the conventional technology, its manufacture is fully possible by utilizing and developing the conventional technology. In other words, this surface mount component package (100) is extremely easy to manufacture.

Furthermore, in this surface mount component package (100), a third board (30) is connected to the lower side of each conductor pin (23) via each third through hole (31). This third substrate (30) is completely independent of the first substrate (lO) and second substrate (20) described above. In other words, this third board (30) is integrated with both the second board (10) and the second board (20) via each conductor pin (23), and only this third board (0) It is now possible to exchange. Therefore.

In this surface mount component package (100),
Even after the first substrate (lO) and the second substrate (20) are integrated, by replacing only the third substrate (30), the third substrate can maintain continuity between each conductor pin (Z3). (30
) can be converted by changing the shape of the conductor layer (32) formed thereon.

In addition, each surface mount component (40) mounted on the first substrate (10) side of this surface mount component package (10Q)
If a so-called programmable electronic component that stores and retains a logic circuit, etc. therein using external information is used, each conductor pin will be By inputting necessary external information from (23), it is possible to create a package that stores necessary logic circuits and the like.

By appropriately changing the necessary logic circuits, etc., it is possible to create a highly versatile package without changing the configuration of the surface mount component package (100) itself.

(Example) Next, the present invention will be described in detail based on an example shown in the drawings.

FIG. 1 shows a surface mount component package (+
00) is shown, and this surface mount component package (100) includes a first substrate (10) on which four surface mount components (40) are mounted on the surface, and this first substrate (lO).
A number of conductor pins (23
) a second substrate (20) having a second substrate (20);
It has a third substrate (30) on the lower side of the substrate and supported by each conductor pin (23). That is, in the first substrate (10) and the second substrate (20), as shown in FIG. ) side varnish through hole (2
2) by electrically connecting each connection part (11) with
and each conductor pin (23) correspond one-to-one, and each conductor pin (23) is electrically independent or connected by the conductor layer (32) on the third substrate (30). .

In this embodiment, the first substrate (lO) is made of a resin material, and as shown in FIG. A plurality of connecting portions (11) are formed for the purpose of connection. These connecting portions (1]) are electrically connected to a plurality of first through holes (12) formed at appropriate locations on the first substrate (lO), and are either continuous with each other or insulated spaces ( 13), they are formed as two types of mutually independent things. Among these connection parts (11), there is a connection end (42) located below the surface mount component (40) located on the upper side of FIG.
The connecting end portion (42) corresponds to the connecting terminal (41) formed on the lower side of the surface mount component (40). These surface mount parts (40)
The connecting terminal (41) or the connecting end (42) is simply placed on each connecting portion (11) and then electrically connected to each connecting portion (11) by solder (43) or the like.

In this embodiment, the second substrate (20) is made of a resin material, and is attached to the first substrate (1) using an adhesive or the like.
0) is integrally fixed to the lower surface of the Further, as shown in FIG. 2, this second board (20) has a land portion (21) formed on its lower surface for the conductor pin (23), and this land portion (21) has a land portion (21) for the conductor pin (23). A second varnish through hole (22) is formed. In this case, each varnish through hole (22) is connected to each connection portion (11) on the first substrate (10).
This is to ensure one-on-one correspondence. Note that each conductor pin (23) is integrally attached within each varnished through hole (22) by means such as solder (24) or forced fitting.

Third substrate (30) placed below the second substrate (20)
In this case, each third through hole (31) is formed at a position corresponding to each conductor pin (23), and a conductor layer (32) is formed on one or both surfaces. Of course, through-hole plating is applied inside each third through hole (31), and when the lower end of each conductor pin (23) is inserted into each third through hole (31), each conductor pin (23) ) are electrically connected to each third through hole (31). The conductor layer (32) has each conductor pin (23
) That is, it is not formed in the parts corresponding to the parts where there is no need to electrically connect each connection part (11),
In addition, if it is necessary to establish continuity between each conductor pin (23), as shown in Figure 3, each third through hole (31
) are formed in a continuous manner so that they are electrically conductive to each other.

(Effects of the Invention) As detailed above, in the surface mount component package (100) according to the present invention, as exemplified in the above embodiment, "the surface mount component (40) formed on the surface side ); a first substrate (10) having a first through hole (12) electrically connected to the connecting portion (11); conductor pins (23) for establishing continuity with the board, etc., and a first varnished through hole (22) that is electrically conductive with the conductor pins (2) and corresponds one-to-one with the connection portion (11). A second board (20) is provided which is integral with the first board (10), and is arranged below the second board (20), through which each conductor pin (23) is inserted. a third through hole (31);
A conductor layer (32) selectively connects these third through holes (31), and this conductor layer (32) connects each connection portion (11) of the first substrate (10) l to each conductor pin ( 2
3) The third substrate (
The feature of its structure is that it has a simple structure, can fully utilize and develop conventional technology, and is capable of high-density mounting as required. It is possible to provide a package (100) for

That is, the package for surface mount components according to the present invention (1
00), it is possible to use a flat electronic component to be mounted, and there is no need to perform processing that requires complicated processes such as forming connection holes for electronic components on the board. With the advantages of surface mount technology,
It is possible to efficiently realize the advantage of mounting technology using conductor pins, which is that there is no need to form external connection terminals for each surface mount component (40) on the surface side, and the surface side can be made smoother. It will come.

In addition, in this surface mount component package (1011), it is sufficient to use each conductor pin (23) in common, and it is possible to replace the third board (30). Because we were able to make it possible, its versatility is extremely high.

[Brief explanation of drawings]

FIG. 1 is a perspective view of a package for surface mount components according to the present invention in which surface mount components are mounted, FIG. 2 is a partially enlarged sectional view schematically showing the structure of this package for surface mount components, and FIG. The figure is a partially enlarged sectional view schematically showing the structure of a package for surface mount components showing another embodiment. Explanation of symbols 100... Surface mount component package, 10-... First board, 11... Connection portion, 12... First through hole, 13... Insulating space, 20-... second substrate, 21
-... Land part, 22... No. varnish through hole, 23.
...Conductor pin, 24...Solder, 30...Third substrate, 31...Third through hole, 32...Conductor layer, 4
0...Surface mounting component, 41...Connection terminal, 42.
...Connection end, 43...Solder. More L

Claims (1)

[Scope of Claims] 1) A first substrate having a connection portion formed on the front side for mounting a surface mount component, and a first through hole electrically connected to the connection portion, and a back surface thereof. A conductor pin provided on the side for establishing conduction to another substrate, etc., and a second through hole that is electrically conductive to the conductor pin and corresponds one-to-one with the connection portion, and is connected to the first substrate. an integral second board; third through holes arranged under the second board through which the conductor pins are inserted; and a conductor selectively connecting the third through holes. A package for surface mount components, characterized in that the third substrate is provided with a conductor layer, and the conductor layer enables selective conduction between each connection portion on the first substrate and each of the conductor pins. . 2) The surface mount component package according to claim 1, wherein the surface mount component is a programmable IC.