JPS60218864A - Mounting method of electronic-parts package and structure of electronic-parts package - Google Patents

Abstract

PURPOSE:To reduce the pattern wiring density of a printed circuit board and to shorten the designing and manufacturing period, by connecting a part of a part lead to the printed circuit board directly under the lead, connecting the other part to the printed circuit board at a position, which is separated from a package. CONSTITUTION:An inner short lead part 2b of a part lead, which is protruded downward from an electronic-parts package 1 is connected and fixed to a through hole 5a of a flexible printed circuit board 5. A wiring pattern 5b, which is connected to the lead part 2b, is connected to a lead part 7 at the outer end of the circuit board 5. A long outer lead part 2a is inserted in a through hole in a printed circuit board 3 and fixed by a solder 4. Said part is further connected to the wiring pattern of the circuit board 3. The lead part 7 of the flexible circuit board 5 is inserted in a through hole at a position separated from the package main body 1, and fixed and connected to the wiring pattern of the circuit board 3. The wiring patterns of the printed circuit board, which are concentrated at the part directly under the package main body 1, are dispersed, and the low density can be implemented.

Description

[Detailed Description of the Invention] [Technical Field of the Invention] The invention relates to a method for mounting an electronic component package and a structure of an electronic component package, and particularly to a method for mounting an electronic component package having a large number of terminals, and an electronic component. Concerning the structure of the package.

[Technical background of the invention and its problems]

Highly integrated electronic components such as gate arrays and hybrid ICs are electronic components mounted on printed wiring boards, and the number of terminals has increased from several tens to several hundred, despite the fact that the package containing the semiconductor chip is small. It extends to The spacing between the terminals of these electronic components is 10 (hnil (
2.54 mm) and 3.5 mm (2.54 mm) are common. When designing a printed wiring board on which this multi-terminal electronic component is mounted, 2.
With a terminal spacing of 54 mm, normally only two to four wiring patterns can be provided. 1 and 2 show a perspective view and a side view of a high-density QUAD IN-LIN cage. In this high-density package, terminal pins 2 are arranged in similar rectangular shapes on the bottom surface of the package 1. If the connection wires are concentrated in the terminal bin on the inner circumference of this bin, due to the restriction on the number of wiring patterns that can be provided between the terminals, it is recommended to route the wiring patterns on the board or use a multilayer wiring board. There must be. As a result, the wiring density of the printed wiring board increases, the pattern becomes complicated, and when an automatic printed wiring board design device is used, the rate of unconnected lines increases and the design period becomes longer. Furthermore, the manufacturing period for printed boards becomes longer.

Furthermore, the number of steps required to mount the electronic component package is increased. Such problems cause a rise in manufacturing costs.

[Purpose of the invention]

The present invention has been made in view of the above-mentioned points, and is an electronic component package that can reduce the density of pattern wiring on a printed wiring board, and that can facilitate the design and manufacture of the printed wiring board and reduce the cost. A mounting method and a structure of an electronic component package are provided.

[Summary of the invention]

The present invention provides an electronic component package containing an electronic component having a large number of terminals, in which some of the leads of the electronic component are directly electrically connected directly under or near a printed wiring board, and other leads are connected to the electronic component. A method for mounting an electronic component package that is electrically connected to a wiring pattern on the printed wiring board at a location remote from a component bar and cage, and a structure of the electronic component package.

[Embodiments of the invention]

An embodiment of the structure and mounting method of an electronic component package according to the present invention will be described below with reference to the drawings. FIGS. 3 and 4 show the structure of an embodiment of the present invention. In this figure, parts that are the same as those of the conventional example shown in FIGS. 1 and 2 are designated by the same numbers. FIG. 3 is a perspective view showing the appearance of the external wiring cable, electronic component bar, and cage according to this embodiment, and FIG. 4 is a plan view seen from the bottom of FIG. 3. The package body 1 includes many electronic components (not shown).
The lead portions 2 of these electronic components protrude downward. Among these leads 's2, the outer lead part 2a is long enough to be inserted directly into a through hole formed in the printed wiring board 3, and the other inner lead part 2b is inserted directly into the printed wiring board 3. They are shortened to avoid contact. The package body 1
A cross-shaped flexible printed wiring board 5 having protrusions extending outward from each side is fixed to the lower surface of the board with an adhesive or the like. This flexible printed wiring board 5 has through holes 5 at positions corresponding to the lead portions 2.
& is formed, of which the inner short lead portion 2b and the through hole 5a into which this lead portion 2b is inserted are formed.
It is electrically connected and fixed with conductive paste 6. Further, a wiring pattern 5b connected to the lead portion 2b is printed on the flexible printed wiring board 5, and this wiring pattern 5b is connected to a lead portion 7 formed on the outer end of the flexible printed wiring board 5. ing.

An embodiment of a method for mounting the electronic component package 1 according to the present invention configured as described above on the printed wiring board 3 will be described below. Among the component leads 2 protruding from the bottom of the electronic component package 1, the long outer lead portions 2a are inserted into the through holes formed in the printed wiring board 3 at positions corresponding to the lead portions 2a, and the solder 4 is inserted into the through holes formed in the printed wiring board 3. and is electrically connected to the pattern wiring formed on the printed wiring board 3.

Next, bend the flexible printed wiring board 5 to form the lead portion 7.
Insert the solder 4 into a through hole formed at a position corresponding to this lead part 7 and away from the package body 1.
and is electrically connected to the pattern wiring formed on the printed wiring board 3. 8 is an adhesive for fixing the package body 1 and the flexible printed wiring board.

As mentioned above, according to the non-embodiment, the wiring pattern of the printed wiring board, which is concentrated directly under the electronic component package body 1, is dispersed.
It is sufficient to conduct only one or two pattern wiring between the leads of mm or square, and the number of laminated printed wiring boards is 2 to 4 m, making it possible to realize a low-density wiring pattern.

In this embodiment, an electronic component package has been described, but the same effect can be obtained even if the invention is applied to multi-pin lead components such as input/output connectors. Furthermore, in this embodiment, a case has been described where electrical connection is made by fixing the lead portion protruding from the bottom of the electronic component package and the through hole formed in the flexible wiring board. Instead, conductor terminals are provided on the package surface.
A 10-pad spacing may be provided to connect to a flexible printed wiring board and a pattern on a printed circuit board.

Furthermore, the package itself may have a structure formed to utilize the mounting method of the present invention.

〔Effect of the invention〕

As mentioned above, the invention is such that a part of the component leads of an electronic component package is connected to the printed wiring board directly below, and the other part is separated from the package and connected to the printed wiring board. As a result, the pattern wiring density of printed wiring boards decreases, and the design and manufacturing period for pattern wiring is shortened.
The effect is significant because manufacturing costs are reduced and parts replacement and repair become easier.

[Brief explanation of drawings]

Figure 1 is a perspective view of a conventional electronic component package;
The figure is a side view showing the state in which the electronic component package of FIG. 1 is mounted on a printed wiring board, FIG. 3 is a perspective view showing one embodiment of the structure of the electronic component package according to the present invention, and FIG.
FIG. 5 is a plan view seen from the back side of the figure, and FIG. 5 is a side view showing a method of mounting the electronic component package of FIG. 3 on a printed wiring board. 1...Electronic component package body 2.2a, 2b=-Component lead 3--Printed wiring board 4--Solder 5--Flexible printed wiring board 5a--Through hole 5b...Wiring pattern 6 ...Half a day or conductive paste 7...Lead part 8...Adhesive Agent Patent attorney Kensuke Chika (and 1 other person) Figure 1 Figure 2

Claims (1)

[Scope of Claims] (υ Out of a plurality of terminals that electrically connect an internal circuit installed in an electronic component package and an external circuit, some of the terminals are connected to signal lines formed on a printed wiring board, or In addition to directly electrically connecting and fixing the power supply/ground wire, the other terminals are drawn out around the electronic component package via conductor wires that are electrically connected to this terminal block, and each of the conductor wires is connected to the electronic component package. A method for mounting an electronic component package, comprising electrically connecting and fixing a signal line or a power supply line formed on the printed wiring board around the component package. (2) Each of the conductor lines is flexible printed. A method for mounting an electronic component package according to claim 1, characterized in that the wiring pattern is formed on a wiring board. (3) An internal circuit installed in an electronic component package and a printed wiring board A first line that electrically connects the formed signal line or power line directly under the package or near the package.
and a second terminal that electrically connects the internal circuit and the signal line, or the power/ground line and the package at a remote location. Structure of parts package.