JPH0730061A - Hybrid integrated circuit device - Google Patents
Hybrid integrated circuit deviceInfo
- Publication number
- JPH0730061A JPH0730061A JP15525193A JP15525193A JPH0730061A JP H0730061 A JPH0730061 A JP H0730061A JP 15525193 A JP15525193 A JP 15525193A JP 15525193 A JP15525193 A JP 15525193A JP H0730061 A JPH0730061 A JP H0730061A
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- circuit
- circuit board
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、混成集積回路装置に関
し、特にファストン端子が取付けられた混成集積回路と
プリント基板等の配線回路基板およびパワー外部回路と
を相互接続する混成集積回路装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid integrated circuit device, and more particularly to a hybrid integrated circuit device for interconnecting a hybrid integrated circuit having faston terminals attached thereto and a wiring circuit board such as a printed circuit board and a power external circuit.
【０００２】[0002]
【従来の技術】従来、例えば図３に示す如き、パワーイ
ンバータ回路等のパワー回路とコントロール回路をユニ
ット化する場合には、図４に示すような接続構造で対応
していた。すなわち、混成集積回路（５０）内にはイン
バータ回路の主要回路（８０）が集積化され、配線回路
基板（６０）上にはインバータ回路をコントロールする
コントロール回路（９０）およびそのコントロール回路
（９０）に電源を供給するレギュレータ（１００）が実
装され、さらに、外部パワー基板（図示しない）上には
ブリッジ接続された整流素子および平滑コンデンサから
なる整流回路（１１０）が実装されている。2. Description of the Related Art Conventionally, when a power circuit such as a power inverter circuit and a control circuit are unitized as shown in FIG. 3, a connection structure as shown in FIG. 4 has been used. That is, a main circuit (80) of an inverter circuit is integrated in the hybrid integrated circuit (50), and a control circuit (90) for controlling the inverter circuit on the printed circuit board (60) and its control circuit (90). A regulator (100) for supplying electric power is mounted on the board, and a rectifier circuit (110) including a bridge-connected rectifying element and a smoothing capacitor is mounted on an external power board (not shown).
【０００３】かかる、混成集積回路（５０）と配線回路
基板（６０）および外部パワー基板を相互接続する場合
には、混成集積回路（５０）に固着された信号用端子
（５１）およびパワー用のファストン端子（５２）と配
線回路基板（６０）を半田付けし、配線回路基板（６
０）上に実装されたコネクタ（１２０）等の接続手段を
介して外部パワー基板から延在されたリード配線（７
０）と配線回路基板（６０）を接続してユニット化する
ものであった。When the hybrid integrated circuit (50), the printed circuit board (60) and the external power board are interconnected, signal terminals (51) and power terminals fixed to the hybrid integrated circuit (50) are used. The faston terminal (52) and the wiring circuit board (60) are soldered to each other, and the wiring circuit board (6
0) lead wires (7) extended from the external power board through connecting means such as a connector (120) mounted on
0) and the printed circuit board (60) were connected to form a unit.
【０００４】[0004]
【発明が解決しようとする課題】図４で示した従来の混
成集積回路装置では、外部パワー基板から延在されたリ
ード配線（７０）と配線回路基板（６０）とを接続する
場合に、配線回路基板（６０）上にあらかじめ実装した
コネクタ（１２０）を介して接続する構造であるため
に、以下の問題があった。すなわち、両者を接続する
専用のコネクタ（１２０）が必要でありコスト高とな
る。配線回路基板上にコネクタを実装する専用のスペ
ースが必要となり配線回路基板が大型化になりシステム
全体の小型化に寄与することができない。コネクタと
配線回路基板を接続する半田付点数が増加し接続信頼性
面での問題がある。In the conventional hybrid integrated circuit device shown in FIG. 4, when the lead wiring (70) extending from the external power board and the wiring circuit board (60) are connected, wiring is provided. Since the structure is such that the connector (120) is mounted on the circuit board (60) in advance, the following problems occur. That is, a dedicated connector (120) for connecting the two is required, resulting in high cost. A dedicated space for mounting the connector on the printed circuit board is required, and the printed circuit board becomes large, which cannot contribute to downsizing of the entire system. The number of soldering points for connecting the connector and the printed circuit board increases, and there is a problem in connection reliability.
【０００５】かかる、不具合を解消するためには、図示
しないが、配線回路基板上にコネクタを実装せずに、そ
の回路基板を短かくして混成集積回路のパワー用のファ
ストン端子に直接、外部パワー基板から延在されるリー
ド配線を接続する構造で解消することができる。しかし
ながら、かかる接続構造では、上述した不具合は解消で
きるものの、配線回路基板を保持する保持部を設ける必
要があり、作業性が低下するという問題がある。In order to solve such a problem, although not shown in the figure, without mounting the connector on the wiring circuit board, the circuit board is shortened and directly connected to the faston terminal for power of the hybrid integrated circuit, and the external power board is used. This can be solved by the structure in which the lead wiring extending from is connected. However, in such a connection structure, although the above-mentioned problems can be solved, it is necessary to provide a holding portion for holding the printed circuit board, which causes a problem that workability is deteriorated.
【０００６】本発明は上述した課題に鑑みて為されたも
のであり、この発明の目的は、混成集積回路と配線回路
基板との保持を容易にし、且つ、ユニット全体を小型化
した混成集積回路装置を提供する事である。The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to facilitate holding of a hybrid integrated circuit and a wiring circuit board and to downsize the entire unit. It is to provide a device.
【０００７】[0007]
【課題を解決するための手段】上述した課題を解決し、
目的を達成するため、この発明に係わる混成集積回路装
置は、絶縁性基板の一主面上に形成された所望形状の導
電路を介して複数の回路素子が固着され、導電路が延在
される所定位置に信号用およびパワー用の外部リード端
子が接続され、両リード端子の先端部が基板の一主面側
に導出配置された混成集積回路に、少なくとも一主面上
に複数の回路素子が実装され、両外部リード端子を挿入
する孔を介して配線回路基板が接続され、混成集積回路
および配線回路基板と相互接続される外部回路から延在
されたリード配線が配線回路基板より突出したパワー用
外部リード端子と直接接続する。[Means for Solving the Problems]
To achieve the object, a hybrid integrated circuit device according to the present invention has a plurality of circuit elements fixed to each other through a conductive path of a desired shape formed on one main surface of an insulating substrate, and the conductive path is extended. A plurality of circuit elements on at least one main surface of the hybrid integrated circuit in which external lead terminals for signals and power are connected to predetermined positions Is mounted, the wiring circuit board is connected through the holes for inserting both external lead terminals, and the lead wiring extended from the external circuit interconnected with the hybrid integrated circuit and the wiring circuit board protrudes from the wiring circuit board. Connect directly to the external power lead terminal.
【０００８】[0008]
【作用】以上のように構成される混成集積回路装置にお
いては、混成集積回路のパワー用リード端子を配線回路
基板より突出させ、その突出されたパワー用リード端子
と外部回路のリード配線を直接接続することにより、配
線回路基板のサイズを大型化にすることなく相互接続す
ることが可能となる。In the hybrid integrated circuit device configured as described above, the power lead terminal of the hybrid integrated circuit is projected from the printed circuit board, and the projected power lead terminal is directly connected to the lead wiring of the external circuit. By doing so, it becomes possible to interconnect without increasing the size of the printed circuit board.
【０００９】また、配線回路基板は混成集積回路の両リ
ード端子の接続によって保持されるために、専用の保持
部は不用である。Further, since the printed circuit board is held by connecting both lead terminals of the hybrid integrated circuit, a dedicated holding portion is unnecessary.
【００１０】[0010]
【実施例】以下に、図１〜図２に示した実施例に基づい
て、本発明の混成集積回路装置を説明する。本発明の混
成集積回路装置は、図１に示す如き、混成集積回路（１
０）と、その混成集積回路（１０）と接続される配線回
路基板（２０）と、混成集積回路（１０）のパワー端子
（１４）と接続される外部回路（図示しない）より延在
されるリード配線（３０）とから構成される。DESCRIPTION OF THE PREFERRED EMBODIMENTS A hybrid integrated circuit device of the present invention will be described below based on the embodiments shown in FIGS. A hybrid integrated circuit device according to the present invention includes a hybrid integrated circuit (1
0), a printed circuit board (20) connected to the hybrid integrated circuit (10), and an external circuit (not shown) connected to the power terminal (14) of the hybrid integrated circuit (10). It is composed of a lead wire (30).
【００１１】本発明に用いられる混成集積回路（１０）
は、金属基板（１１）とその基板（１１）上に固着され
る複数の回路素子（１２）および信号用リード端子（１
３）、パワー用リード端子（１４）とケース材（１５）
とから構成される。金属基板（１１）上には図示されな
いが絶縁樹脂層を介して所望形状の導電路が形成されて
おり、その導電路上に、例えば図３のインバータの主回
路（８０）を構成する複数のスイッチング素子、ドライ
ブ回路および保護回路を構成する複数の回路素子が固着
されている。そして、導電路上の所定位置には、後述す
る配線回路基板（２０）と接続するための複数の信号用
リード端子（１３）およびパワー用リード端子（１４）
が半田付け等の手段によって固着されている。Hybrid integrated circuit (10) used in the present invention
Is a metal substrate (11), a plurality of circuit elements (12) fixed on the substrate (11), and a signal lead terminal (1).
3), power lead terminal (14) and case material (15)
Composed of and. Although not shown, a conductive path having a desired shape is formed on the metal substrate (11) through an insulating resin layer, and on the conductive path, for example, a plurality of switching elements constituting the main circuit (80) of the inverter of FIG. 3 are formed. A plurality of circuit elements forming the element, the drive circuit and the protection circuit are fixed. A plurality of signal lead terminals (13) and power lead terminals (14) for connecting to a printed circuit board (20) described later are provided at predetermined positions on the conductive path.
Are fixed by means such as soldering.
【００１２】本実施例では信号用リード端子（１３）お
よびパワー用リード端子（１４）の両端子の先端部は基
板（１１）の一主面側、すなわち、天面リード出し構造
となるように導出されている。パワー用リート端子（１
４）はファストン・ピンと呼ばれる規格製品が用いら
れ、使用に応じてその形状が選択される。また、パワー
用リード端子（１４）は信号用リード端子（１３）より
も長く形成されている。具体的には、配線回路基板（２
０）と接続した際、リード端子（１４）に外部コネクタ
が直接接続できる分だけ突出するように形成されてい
る。In the present embodiment, the tips of both the signal lead terminal (13) and the power lead terminal (14) are arranged so as to have a top surface lead-out structure on the one main surface side of the substrate (11). It has been derived. REIT terminal for power (1
For 4), a standard product called Faston Pin is used, and its shape is selected according to the use. The power lead terminal (14) is formed longer than the signal lead terminal (13). Specifically, the printed circuit board (2
0), the lead terminal (14) is formed so as to protrude by an amount to which the external connector can be directly connected.
【００１３】混成集積回路（１０）と接続される配線回
路基板（２０）は、プリント基板等のＰＣＢが用いら
れ、少なくともその一主面には所望形状の導電パターン
が形成され、その導電パターン上に複数の回路素子（２
１）が実装される。本実施例の配線回路基板（２０）上
には、図３に示したインバータ回路のコントロール（９
０）およびレギュレータ（１００）を構成するための回
路素子（２１）が実装されている。配線回路基板（２
０）には両リード端子（１３）（１４）を挿入接続する
ためのスルーホールが設けられており、そのスルーホー
ルに両リード端子（１３）（１４）が挿入されて、配線
回路基板（２０）上に形成された導電パターンと半田固
着され電気的接続が行われる。A printed circuit board or the like is used as the printed circuit board (20) connected to the hybrid integrated circuit (10), and a conductive pattern of a desired shape is formed on at least one main surface thereof, and the conductive pattern is formed on the conductive pattern. Multiple circuit elements (2
1) is implemented. On the printed circuit board (20) of this embodiment, the inverter circuit control (9) shown in FIG.
0) and the circuit element (21) for constituting the regulator (100) are mounted. Wiring circuit board (2
0) is provided with a through hole for inserting and connecting both lead terminals (13) and (14), and both lead terminals (13) and (14) are inserted into the through hole to form a wired circuit board (20). ) Soldering is fixed to the conductive pattern formed on the upper surface to make an electrical connection.
【００１４】パワー用リード端子（１４）は、上述した
ように配線回路基板（２０）よりも突出した構造となっ
ているために、配線回路基板（２０）とリード端子（１
４）とを半田付けした際、リード端子（１４）の中間
（腹部）部分と回路基板（２０）上の導電パターンとが
半田付けされることになり、半田付け時に溶融した半田
がリード端子（１４）の腹部をはい上り、リード端子
（１４）に後述するリード配線の先端部のコネクタが挿
入できなくなるという不具合がある。しかしながら、こ
の実施例では、図２に示す如く、パワーリード端子（１
４）の中間部分に半田のすい上りを防止するためのすい
上り防止手段（１４Ａ）が設けられるために半田付け時
の溶融半田がリード端子（１４）の先端部方向にすい上
ることはなく、リード端子（１４）にリード配線のコネ
クタを確実に挿入することができる。Since the power lead terminal (14) has a structure protruding from the printed circuit board (20) as described above, the printed circuit board (20) and the lead terminal (1).
4) is soldered, the intermediate (abdomen) part of the lead terminal (14) and the conductive pattern on the circuit board (20) are soldered, and the solder melted during the soldering is connected to the lead terminal ( There is a problem that the connector at the tip of the lead wiring, which will be described later, cannot be inserted into the lead terminal (14) by going up the abdomen of 14). However, in this embodiment, as shown in FIG.
Since the rising portion preventing means (14A) for preventing rising of the solder is provided in the intermediate portion of 4), the molten solder at the time of soldering does not rise toward the tip of the lead terminal (14). The lead wiring connector can be reliably inserted into the lead terminal (14).
【００１５】混成集積回路（１０）の両リード端子（１
３）（１４）と配線回路基板（２０）を半田接続した
後、パワーリード端子（１４）に外部回路から延在され
るリード配線（３０）のコネクタ（３１）が挿入接続さ
れる。図示されないが外部回路には、図３に示すパワー
インバータ回路のパワー段の整流回路が構成されてお
り、その外部回路と混成集積回路（１０）はリード配線
（３０）によって接続される。リード配線（３０）の先
端部はメス型のコネクタ構造を有しており、配線回路基
板（２０）より突出したパワーリード端子（１４）にそ
のメス型のコネクタが挿入されて相互接続が行われる。Both lead terminals (1) of the hybrid integrated circuit (10)
3) After soldering the (14) and the printed circuit board (20), the connector (31) of the lead wiring (30) extending from the external circuit is inserted and connected to the power lead terminal (14). Although not shown, a rectifier circuit of the power stage of the power inverter circuit shown in FIG. 3 is configured in the external circuit, and the external circuit and the hybrid integrated circuit (10) are connected by the lead wiring (30). The tip portion of the lead wire (30) has a female connector structure, and the female connector is inserted into the power lead terminal (14) protruding from the printed circuit board (20) for mutual connection. .
【００１６】[0016]
【発明の効果】以上に詳述した如き、本発明の混成集積
回路装置においては、混成集積回路のパワー用リード端
子を配線回路基板より突出させ、その突出されたパワー
用リード端子と外部回路のリード配線を直接接続するこ
とにより、配線回路基板のサイズを大型化にすることな
く相互接続することが可能となる。その結果、混成集積
回路装置全体の小型化を図ることができる。As described above in detail, in the hybrid integrated circuit device of the present invention, the power lead terminal of the hybrid integrated circuit is projected from the printed circuit board, and the projected power lead terminal and the external circuit are connected. By directly connecting the lead wirings, it is possible to connect the wirings without increasing the size of the printed circuit board. As a result, the size of the entire hybrid integrated circuit device can be reduced.
【００１７】また、本発明に依れば、配線回路基板は混
成集積回路から導出された両リード端子の接続と同時に
保持することができる。その結果、配線回路基板を保持
するための専用の保持部は不用とすることができ作業性
を向上させることができる。Further, according to the present invention, the printed circuit board can be held simultaneously with the connection of both lead terminals derived from the hybrid integrated circuit. As a result, the dedicated holding portion for holding the printed circuit board can be dispensed with, and the workability can be improved.
【図１】本発明の混成集積回路装置を示す断面図であ
る。FIG. 1 is a cross-sectional view showing a hybrid integrated circuit device of the present invention.
【図２】本発明の実施例で用いられるリード端子を示す
図である。FIG. 2 is a diagram showing a lead terminal used in an embodiment of the present invention.
【図３】インバータ回路を示す回路図である。FIG. 3 is a circuit diagram showing an inverter circuit.
【図４】従来の混成集積回路装置を示す断面図である。FIG. 4 is a cross-sectional view showing a conventional hybrid integrated circuit device.
（１０） 混成集積回路 （１１） 金属基板 （１２） 回路素子 （１３） 信号用リード端子 （１４） パワーリード端子 （１５） ケース材 （２０） 配線回路基板 （２１） 回路素子 （３０） リード配線 (10) Hybrid integrated circuit (11) Metal substrate (12) Circuit element (13) Signal lead terminal (14) Power lead terminal (15) Case material (20) Wiring circuit board (21) Circuit element (30) Lead wiring
Claims (3)
電路を介して複数の回路素子が固着され、前記導電路が
延在される所定位置に信号用およびパワー用の外部リー
ド端子が接続された混成集積回路と、 少なくとも一主面上に複数の回路素子が実装され、前記
両外部リード端子と接続された配線回路基板とを備え、 前記混成集積回路および前記配線回路基板と相互接続さ
れる外部回路から延在されたリード配線が前記パワー用
外部リード端子と直接接続されたことを特徴とする混成
集積回路装置。1. A plurality of circuit elements are fixed via conductive paths of a desired shape formed on an insulating substrate, and external lead terminals for signals and power are provided at predetermined positions where the conductive paths extend. A hybrid integrated circuit connected thereto, and a wiring circuit board having a plurality of circuit elements mounted on at least one main surface and connected to the both external lead terminals, and the interconnection integrated circuit and the wiring circuit board. A hybrid integrated circuit device in which lead wires extending from the external circuit are directly connected to the power external lead terminals.
電路を介して複数の回路素子が固着され、前記導電路が
延在される所定位置に信号用およびパワー用の外部リー
ド端子が接続された混成集積回路と、 少なくとも一主面上に複数の回路素子が実装され、前記
両外部リード端子と接続された配線回路基板とを備え、 前記混成集積回路および前記配線回路基板と相互接続さ
れる外部回路から延在されたリード配線が前記配線回路
基板を挾持するように前記パワー用外部リード端子と直
接接続されたことを特徴とする混成集積回路装置。2. A plurality of circuit elements are fixed through a conductive path of a desired shape formed on an insulating substrate, and external lead terminals for signals and power are provided at predetermined positions where the conductive paths extend. A hybrid integrated circuit connected thereto, and a wiring circuit board having a plurality of circuit elements mounted on at least one main surface and connected to the both external lead terminals, and the interconnection integrated circuit and the wiring circuit board. A hybrid integrated circuit device, wherein lead wires extending from the external circuit are directly connected to the power external lead terminals so as to hold the wired circuit board.
形状の導電路を介して複数の回路素子が固着され、前記
導電路が延在される所定位置に信号用およびパワー用の
外部リード端子が接続され、前記両リード端子の先端部
が前記基板の一主面側に導出配置された混成集積回路
と、 少なくとも一主面上に複数の回路素子が実装され、前記
両外部リード端子を挿入する孔を介して半田接続された
配線回路基板とを備え、 前記混成集積回路および前記配線回路基板と相互接続さ
れる外部回路から延在されたリード配線が前記配線回路
基板より突出した前記パワー用外部リード端子と直接接
続されたことを特徴とする混成集積回路装置。3. A plurality of circuit elements are fixed through a conductive path of a desired shape formed on one main surface of an insulating substrate, and a signal and power are provided at a predetermined position where the conductive path extends. External lead terminals are connected, and a hybrid integrated circuit in which the leading end portions of both lead terminals are led out to one main surface side of the substrate, and a plurality of circuit elements are mounted on at least one main surface, A wiring circuit board solder-connected through holes for inserting terminals, and lead wires extending from an external circuit interconnected with the hybrid integrated circuit and the wiring circuit board protruded from the wiring circuit board. A hybrid integrated circuit device, which is directly connected to the power external lead terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15525193A JPH0730061A (en) | 1993-06-25 | 1993-06-25 | Hybrid integrated circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15525193A JPH0730061A (en) | 1993-06-25 | 1993-06-25 | Hybrid integrated circuit device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0730061A true JPH0730061A (en) | 1995-01-31 |
Family
ID=15601843
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15525193A Pending JPH0730061A (en) | 1993-06-25 | 1993-06-25 | Hybrid integrated circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0730061A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000074445A1 (en) * | 1999-05-31 | 2000-12-07 | Tyco Electronics Logistics Ag | Sandwich-structured intelligent power module |
| KR100719923B1 (en) * | 2005-03-10 | 2007-05-18 | 비오이 하이디스 테크놀로지 주식회사 | Liquid crystal display module |
| JP2008035591A (en) * | 2006-07-27 | 2008-02-14 | Meidensha Corp | Structure of ac controller |
-
1993
- 1993-06-25 JP JP15525193A patent/JPH0730061A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000074445A1 (en) * | 1999-05-31 | 2000-12-07 | Tyco Electronics Logistics Ag | Sandwich-structured intelligent power module |
| US6646884B1 (en) | 1999-05-31 | 2003-11-11 | Tyco Electronics Logistics Ag | Sandwich-structured intelligent power module |
| KR100719923B1 (en) * | 2005-03-10 | 2007-05-18 | 비오이 하이디스 테크놀로지 주식회사 | Liquid crystal display module |
| JP2008035591A (en) * | 2006-07-27 | 2008-02-14 | Meidensha Corp | Structure of ac controller |
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