JPH043431Y2 - - Google Patents

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Publication number
JPH043431Y2
JPH043431Y2 JP1986050244U JP5024486U JPH043431Y2 JP H043431 Y2 JPH043431 Y2 JP H043431Y2 JP 1986050244 U JP1986050244 U JP 1986050244U JP 5024486 U JP5024486 U JP 5024486U JP H043431 Y2 JPH043431 Y2 JP H043431Y2
Authority
JP
Japan
Prior art keywords
conductor pattern
connector
board
surface mount
mount board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1986050244U
Other languages
Japanese (ja)
Other versions
JPS62161778U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986050244U priority Critical patent/JPH043431Y2/ja
Publication of JPS62161778U publication Critical patent/JPS62161778U/ja
Application granted granted Critical
Publication of JPH043431Y2 publication Critical patent/JPH043431Y2/ja
Expired legal-status Critical Current

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Description

【考案の詳細な説明】 〔産業上の利用分野〕 本考案は、表面実装を行つた混成集積回路装置
等において、その表面の微細な導体パターンから
端子を取り出す為のコネクタに関する。
[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a connector for extracting terminals from fine conductor patterns on the surface of a surface-mounted hybrid integrated circuit device or the like.

〔従来の技術〕[Conventional technology]

マイクロコンピユータ(以下「マイコン」とい
う)等を搭載する電子回路装置においては、その
開発段階で、周辺のシステムと適合させる為にマ
イコン等のソフトの開発が必要であり、その為、
外部に設けたEPROM等と電気接続するのに基板
上のマイコンが搭載されるべき位置の導体パター
ンを外部に導き出す必要がある。
In the case of electronic circuit devices equipped with microcomputers (hereinafter referred to as "microcomputers"), it is necessary to develop software such as microcomputers during the development stage in order to make them compatible with surrounding systems.
In order to electrically connect to an external EPROM, etc., it is necessary to lead the conductor pattern on the board at the location where the microcomputer is to be mounted to the outside.

従来、プリント基板に実装された電子回路装置
においては、第2図の斜視図に示すように、プリ
ント基板6上の導体パターンにあわせてフラツト
ケーブル用コネクタ5を搭載し、そこからフラツ
トケーブル7にて導体パターンを外部に導き出し
ていた。
Conventionally, in an electronic circuit device mounted on a printed circuit board, a flat cable connector 5 is mounted in line with the conductor pattern on the printed circuit board 6, as shown in the perspective view of FIG. 7, the conductor pattern was brought out to the outside.

〔考案が解決しようとする問題点〕[Problem that the invention attempts to solve]

しかしながら、電子回路の高集積化が進み、表
面実装を用いた混成集積回路装置等においては、
その構成が微細である為に、上記のフラツトケー
ブル用コネクタ5を用いたものでは、簡単に表面
実装基板のマイコン実装用ランドから端子を取り
出す事は不可能であり、マイコン等が搭載される
基板の他に、ソフト開発専用の導体パターンを有
した基板を設ける等の配慮が必要であり、二度手
間となり、又、コスト的に悪影響をおよぼしてい
た。
However, as electronic circuits become more highly integrated, surface-mounted hybrid integrated circuit devices, etc.
Because the structure is minute, it is impossible to easily take out the terminals from the microcomputer mounting land of the surface mount board using the flat cable connector 5 described above, and the microcomputer etc. are mounted on the connector. In addition to the board, consideration must be given to providing a board with a conductor pattern dedicated to software development, which requires additional effort and has a negative impact on cost.

そこで本考案は、表面実装基板においても、新
たなソフト開発専用の基板を設けることなしに、
容易にマイコン実装用ランド等の導体パターンか
ら外部に端子を取り出す事が可能である表面実装
基板用コネクタを提供する事を目的としている。
Therefore, the present invention enables surface-mounted boards to be used without the need for a dedicated board for new software development.
The object of the present invention is to provide a connector for a surface mount board that allows terminals to be easily taken out from a conductor pattern such as a land for mounting a microcomputer.

〔問題点を解決するための手段〕[Means for solving problems]

上記の目的を達成する為に本考案は、表面実装
基板の電子回路部品が搭載されるべきランドに、
該電子回路部品の代わりに搭載することによつ
て、該電子回路部品に接続されるべき導体パター
ンを装置外部に取り出すことを可能にするコネク
タであつて、 その裏面に前記導体パターンに対応して形成さ
れ前記導体パターンと電気接続する導体パターン
を有し、多層配線する事によつて、その表面に前
記裏面の導体パターンに応じた端子を二次元的に
配列した表面実装基板用コネクタを採用してい
る。
In order to achieve the above objective, the present invention has been developed to
A connector that is mounted in place of the electronic circuit component to allow a conductor pattern to be connected to the electronic circuit component to be taken out of the device, and has a back surface corresponding to the conductor pattern. A connector for a surface mount board is employed, which has a conductor pattern that is formed and electrically connects with the conductor pattern, and has terminals arranged two-dimensionally on the front surface according to the conductor pattern on the back surface by multilayer wiring. ing.

〔作用〕[Effect]

上記の手段を採用することにより、表面実装基
板上の導体パターンの各々の間隔を、二次元的に
配列する事によつて広くする事ができ、又、上記
の手段は表面実装基板上に搭載されるべきマイコ
ン等と同等の大きさで製造可能であることから、
新たにソフト開発専用の基板を設けることなしに
外部に容易に端子を取り出す事ができる。
By adopting the above means, it is possible to widen the distance between each conductor pattern on the surface mount board by arranging it two-dimensionally. Because it can be manufactured in the same size as the microcontroller that should be used,
Terminals can be easily taken out to the outside without the need for a new board dedicated to software development.

〔実施例〕〔Example〕

以下図面に示す実施例により本考案を詳細に説
明する。本考案の一実施例を第1図に示す表面実
装基板用コネクタの搭載状態の斜視図、及び第3
図の表面実装基板用コネクタの表面図(同図a)、
側面図(同図b)、裏面図、(同図c)に示す。第
1図及び第3図において、1は本実施例の表面実
装基板用コネクタであり、その裏面には表面実装
基板であるセラミツク基板1上の図示しないマイ
コン等が搭載されるべき位置の導体パターン4に
電気接続すべき、その導体パターン4に応じた導
体パターン1cが形成されており、その表面には
導体パターン1cに応じた数の端子1aが二次元
的に配列されており、導体パターン1cと端子1
aとは多層配線により接続されて、各々が対応し
ている。又、端子1aの各々からはピン1bが垂
直に突出している。尚、現在の技術力をもつてす
れば言うまでもないが、この表面実装基板用コネ
クタ1は搭載すべきマイコン等と同等の大きさに
製造可能なものである。この表面実装基板用コネ
クタ1をその裏面の導体パターン1cがセラミツ
ク基板1上の導体パターン4に合うようにしてロ
ー付け等を行い搭載する。そして、ピン1bに合
わせて穴が開けられており、又、その穴から導体
の配線が形成されているフレキシブルプリント配
線板3を、その穴にピン1bを差し込んでロー付
け等で接続し、図示しない電子回路装置外部の
EPROM等に電気接続している。
The present invention will be explained in detail below with reference to embodiments shown in the drawings. An embodiment of the present invention is shown in FIG.
A surface view of the surface mount board connector shown in the figure (a),
It is shown in a side view (b) and a back view (c). In FIGS. 1 and 3, reference numeral 1 is a connector for a surface mount board according to the present embodiment, and on the back side there is a conductor pattern at a position where a microcomputer, etc. (not shown) is to be mounted on a ceramic board 1, which is a surface mount board. A conductor pattern 1c corresponding to the conductor pattern 4 to be electrically connected to the conductor pattern 1c is formed on its surface, and terminals 1a of the number corresponding to the conductor pattern 1c are arranged two-dimensionally on the surface of the conductor pattern 1c. and terminal 1
It is connected to a by multilayer wiring, and corresponds to each other. Further, a pin 1b vertically projects from each terminal 1a. It goes without saying that with the current technological capabilities, this connector 1 for surface mount board can be manufactured to the same size as the microcomputer etc. to be mounted. This surface mount board connector 1 is mounted by brazing or the like so that the conductor pattern 1c on the back side matches the conductor pattern 4 on the ceramic board 1. Then, the flexible printed wiring board 3, in which a hole is drilled to match the pin 1b and conductor wiring is formed through the hole, is connected by brazing or the like by inserting the pin 1b into the hole, as shown in the figure. Do not use external electronic circuit devices.
Electrically connected to EPROM etc.

上記の如く本実施例の表面実装基板用コネクタ
を採用する事により、セラミツク基板2上の導体
パターン4の各々の間隔ccは、二次元的に配列し
直される事により、その間隔がaaとなり広がる
事がわかる。そして、間隔が広がるおかげでピン
1bに比較的容易にフレキシブルプリント配線板
3を接続する事ができる。又、搭載すべきマイコ
ン等と同等の大きさに製造可能であるので、その
マイコン等の置き換えとして搭載でき、表面実装
基板上の他の素子に対し面積的にさまたげとなる
事はなく、マイコン等のソフト開発専用の基板を
新たに設ける必要がない等の効果がある。
As described above, by employing the surface mount board connector of this embodiment, the distance cc between each of the conductor patterns 4 on the ceramic substrate 2 is two-dimensionally rearranged, so that the distance increases to aa. I understand. And, thanks to the wide spacing, it is possible to connect the flexible printed wiring board 3 to the pins 1b relatively easily. In addition, since it can be manufactured to the same size as the microcontroller, etc. to be mounted, it can be mounted as a replacement for the microcontroller, etc., without interfering with other elements on the surface mount board, and the microcontroller, etc. This has the advantage that there is no need to provide a new board exclusively for software development.

次に、上記実施例の応用としての他の実施例を
第4図の搭載状態の斜視図に示す。上記実施例で
は、フレキシブルプリント配線板3を、表面実装
基板用コネクタ1の端子1aに接続することによ
り、外部に端子を取り出していたが、本実施例に
示す如く、ピン1bに適合するメス側のコネクタ
8を接続する事によりワイヤハーネス9によつて
任意に端子を取り出してもよい。尚、図において
第1図に示す実施例と同一構成部分には同一符号
を付してその説明は省略する。
Next, another embodiment as an application of the above embodiment is shown in the perspective view of the installed state in FIG. In the above embodiment, the flexible printed wiring board 3 is connected to the terminal 1a of the surface mount board connector 1 to take out the terminal to the outside, but as shown in this embodiment, the female side that fits the pin 1b By connecting the connector 8 of the wire harness 9, terminals may be arbitrarily taken out. In the drawings, the same components as those in the embodiment shown in FIG. 1 are denoted by the same reference numerals, and the explanation thereof will be omitted.

〔考案の効果〕[Effect of idea]

以上述べた如く、本考案の表面実装基板用コネ
クタを採用する事によつて、表面実装基板上の導
体パターンは二次元的に配列し直されるので、そ
の間隔を広げる事ができ、フレキシブルプリント
配線板等の接続が比較的容易となり、又、本考案
の表面実装基板用コネクタは搭載すべきマイコン
等と同等の大きさに製造可能である事から、マイ
コン等の置き換えとして搭載し、新たなソフト開
発専用の基板を設ける事なしに、容易に外部に端
子を取り出す事が出来るという効果がある。
As mentioned above, by employing the surface mount board connector of the present invention, the conductor patterns on the surface mount board can be rearranged two-dimensionally, so the spacing between them can be increased, and flexible printed wiring can be realized. It is relatively easy to connect boards, etc., and the connector for surface mount boards of this invention can be manufactured to the same size as the microcontroller, etc. to be installed, so it can be installed as a replacement for the microcontroller, etc., and new software can be installed. This has the effect that terminals can be easily taken out to the outside without providing a board exclusively for development.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図に本考案の一実施例の搭載状態を表す斜
視図、第2図に従来のプリント基板における表面
実装基板用コネクタの搭載状態を表す斜視図、第
3図aに第1図における表面実装基板用コネクタ
の表面図、同図bにその側面図、同図cにその裏
面図、第4図に本考案の他の実施例の搭載状態を
表す斜視図を示す。 1……表面実装基板用コネクタ、2……セラミ
ツク基板、3……フレキシブルプリント配線板、
4……導体パターン、1a……端子、1b……ピ
ン、1c……導体パターン。
Fig. 1 is a perspective view showing the mounting state of an embodiment of the present invention, Fig. 2 is a perspective view showing the mounting state of a surface mount board connector on a conventional printed circuit board, and Fig. 3a shows the surface of the surface in Fig. 1. FIG. 4 shows a front view of the mounting board connector, a side view thereof in FIG. 1B, a rear view thereof in FIG. 1... Connector for surface mount board, 2... Ceramic board, 3... Flexible printed wiring board,
4... Conductor pattern, 1a... Terminal, 1b... Pin, 1c... Conductor pattern.

Claims (1)

【実用新案登録請求の範囲】 (1) 表面実装基板の電子回路部品が搭載されるべ
きランドに、該電子回路部品の代わりに搭載す
ることによつて、該電子回路部品に接続される
べき導体パターンを装置外部に取り出すことを
可能にするコネクタであつて、 その裏面に前記導体パターンに対応して形成
され前記導体パターンと電気接続する導体パタ
ーンを有し、多層配線することによつて、その
表面に前記裏面の導体パターンに応じた端子を
二次元的に配置した事を特徴とする表面実装基
板用コネクタ。 (2) 上記端子の各々からピンが突出している実用
新案登録請求の範囲第1項記載の表面実装基板
用コネクタ。
[Claims for Utility Model Registration] (1) A conductor to be connected to an electronic circuit component by being mounted in place of the electronic circuit component on the land on which the electronic circuit component is to be mounted on the surface mount board. A connector that allows a pattern to be taken out to the outside of the device, and has a conductor pattern formed corresponding to the conductor pattern on the back surface and electrically connected to the conductor pattern, and is connected by multilayer wiring. A connector for a surface mount board, characterized in that terminals are two-dimensionally arranged on the front surface in accordance with the conductor pattern on the back surface. (2) The surface mount board connector according to claim 1, wherein pins protrude from each of the terminals.
JP1986050244U 1986-04-02 1986-04-02 Expired JPH043431Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986050244U JPH043431Y2 (en) 1986-04-02 1986-04-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986050244U JPH043431Y2 (en) 1986-04-02 1986-04-02

Publications (2)

Publication Number Publication Date
JPS62161778U JPS62161778U (en) 1987-10-14
JPH043431Y2 true JPH043431Y2 (en) 1992-02-03

Family

ID=30873426

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986050244U Expired JPH043431Y2 (en) 1986-04-02 1986-04-02

Country Status (1)

Country Link
JP (1) JPH043431Y2 (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59138394A (en) * 1983-01-29 1984-08-08 松下電器産業株式会社 Electronic circuit part

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5565789U (en) * 1978-10-31 1980-05-07

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59138394A (en) * 1983-01-29 1984-08-08 松下電器産業株式会社 Electronic circuit part

Also Published As

Publication number Publication date
JPS62161778U (en) 1987-10-14

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