JPH0722577A - Hybrid integrated circuit device - Google Patents
Hybrid integrated circuit deviceInfo
- Publication number
- JPH0722577A JPH0722577A JP15711393A JP15711393A JPH0722577A JP H0722577 A JPH0722577 A JP H0722577A JP 15711393 A JP15711393 A JP 15711393A JP 15711393 A JP15711393 A JP 15711393A JP H0722577 A JPH0722577 A JP H0722577A
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- hybrid integrated
- integrated circuit
- circuit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Landscapes
- Combinations Of Printed Boards (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、混成集積回路装置に関
し、特にファストン端子が取付けられた混成集積回路と
プリント基板等の配線回路基板およびパワー外部回路と
を相互接続する混成集積回路装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid integrated circuit device, and more particularly to a hybrid integrated circuit device for interconnecting a hybrid integrated circuit having faston terminals attached thereto and a wiring circuit board such as a printed circuit board and a power external circuit.
【０００２】[0002]
【従来の技術】従来、例えば図４に示す如き、パワーイ
ンバータ回路等のパワー回路とコントロール回路をユニ
ット化する場合には、図５に示すような接続構造で対応
していた。すなわち、混成集積回路（５０）上にはイン
バータ回路の主要回路（８０）が集積化され、配線回路
基板（６０）上にはインバータ回路をコントロールする
コントロール回路（９０）およびそのコントロール回路
（９０）に電源を供給するレギュレータ（１００）が実
装され、さらに、外部パワー基板（図示しない）上には
ブリッジ接続された整流素子および平滑コンデンサから
なる整流回路（１１０）が実装されている。2. Description of the Related Art Conventionally, when a power circuit such as a power inverter circuit and a control circuit are unitized as shown in FIG. 4, a connection structure as shown in FIG. 5 has been used. That is, a main circuit (80) of an inverter circuit is integrated on the hybrid integrated circuit (50), and a control circuit (90) for controlling the inverter circuit on the printed circuit board (60) and its control circuit (90). A regulator (100) for supplying electric power is mounted on the board, and a rectifier circuit (110) including a bridge-connected rectifying element and a smoothing capacitor is mounted on an external power board (not shown).
【０００３】かかる、混成集積回路（５０）と配線回路
基板（６０）および外部パワー基板を相互接続する場合
には、混成集積回路（５０）に固着された信号用端子
（５１）およびパワー用のファストン端子（５２）と配
線回路基板（６０）を半田付けし、配線回路基板（６
０）上に実装されたコネクタ（１２０）等の接続手段を
介して外部パワー基板から延在されたリード配線（７
０）と配線回路基板（６０）を接続してユニット化する
ものであった。When the hybrid integrated circuit (50), the printed circuit board (60) and the external power board are interconnected, signal terminals (51) and power terminals fixed to the hybrid integrated circuit (50) are used. The faston terminal (52) and the wiring circuit board (60) are soldered to each other, and the wiring circuit board (6
0) lead wires (7) extended from the external power board through connecting means such as a connector (120) mounted on
0) and the printed circuit board (60) were connected to form a unit.
【０００４】[0004]
【発明が解決しようとする課題】図５で示した従来の混
成集積回路装置では、外部パワー基板から延在されたリ
ード配線（７０）と配線回路基板（６０）とを接続する
場合に、配線回路基板（６０）上にあらかじめ実装した
コネクタ（１２０）を介して接続する構造であるため
に、以下の問題があった。すなわち、両者を接続する
専用のコネクタ（１２０）が必要でありコスト高とな
る。配線回路基板上にコネクタを実装する専用のスペ
ースが必要となり配線回路基板が大型化になりシステム
全体の小型化に寄与することができない。コネクタと
配線回路基板を接続する半田付点数が増加し接続信頼性
面での問題がある。In the conventional hybrid integrated circuit device shown in FIG. 5, when the lead wiring (70) extending from the external power board and the wiring circuit board (60) are connected to each other, wiring is provided. Since the structure is such that the connector (120) is mounted on the circuit board (60) in advance, the following problems occur. That is, a dedicated connector (120) for connecting the two is required, resulting in high cost. A dedicated space for mounting the connector on the printed circuit board is required, and the printed circuit board becomes large, which cannot contribute to downsizing of the entire system. The number of soldering points for connecting the connector and the printed circuit board increases, and there is a problem in connection reliability.
【０００５】かかる、不具合を解消するためには、図示
しないが、配線回路基板上にコネクタを実装せずに、そ
の回路基板を短かくして混成集積回路のパワー用のファ
ストン端子に直接、外部パワー基板から延在されるリー
ド配線を接続する構造で解消することができる。しかし
ながら、かかる接続構造では、上述した不具合は解消で
きるものの、配線回路基板を保持する保持部を設ける必
要があり、混成集積回路の構造が煩雑になる事および作
業性が低下するという問題がある。In order to solve such a problem, although not shown in the figure, without mounting the connector on the wiring circuit board, the circuit board is shortened and directly connected to the faston terminal for power of the hybrid integrated circuit, and the external power board is used. This can be solved by the structure in which the lead wiring extending from is connected. However, in such a connection structure, although the above-mentioned problems can be solved, it is necessary to provide a holding portion for holding the printed circuit board, which causes a problem that the structure of the hybrid integrated circuit becomes complicated and the workability is deteriorated.
【０００６】本発明は上述した課題に鑑みて為されたも
のであり、この発明の目的は、混成集積回路と配線回路
基板との保持を容易にし、且つ、ユニット全体を小型化
した混成集積回路装置を提供する事である。The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to facilitate holding of a hybrid integrated circuit and a wiring circuit board and to downsize the entire unit. It is to provide a device.
【０００７】[0007]
【課題を解決するための手段】上述した課題を解決し、
目的を達成するため、この発明に係わる混成集積回路装
置は、絶縁性基板上に形成された所望形状の導電路を介
して複数の回路素子が固着され、前記導電路が延在され
る所定位置に信号用およびパワー用の外部リード端子が
接続された混成集積回路と、少なくとも一主面上に複数
の回路素子が実装され、混成集積回路と接続された配線
回路基板とを備え、パワー用外部リード端子は第１の端
子部と第２の端子部の２系統の端子部を有し、その第１
の端子部は外部回路から延在されるリード配線と直接接
続され、第２の端子部は配線回路基板と接続することを
特徴としている。[Means for Solving the Problems]
In order to achieve the object, a hybrid integrated circuit device according to the present invention is provided with a predetermined position where a plurality of circuit elements are fixed through a conductive path of a desired shape formed on an insulating substrate and the conductive path extends. A hybrid integrated circuit to which external lead terminals for signals and power are connected, and a wiring circuit board having a plurality of circuit elements mounted on at least one main surface and connected to the hybrid integrated circuit. The lead terminal has two types of terminal portions, a first terminal portion and a second terminal portion.
The terminal portion is directly connected to the lead wiring extending from the external circuit, and the second terminal portion is connected to the printed circuit board.
【０００８】[0008]
【作用】以上のように構成される混成集積回路装置にお
いては、外部回路から延在されるリード配線と２系統の
端子を有するリード端子の第１の端子部を接続し、第２
の端子部と配線回路基板を接続することにより、コネク
タを介する必要がないため、配線回路基板サイズを小型
化した状態で混成集積回路、配線回路基板および外部回
路の相互接続が可能となる。In the hybrid integrated circuit device configured as described above, the lead wire extending from the external circuit and the first terminal portion of the lead terminal having two terminals are connected to each other, and
Since it is not necessary to interpose a connector by connecting the terminal portion of the wiring circuit board to the wiring circuit board, the hybrid integrated circuit, the wiring circuit board, and the external circuit can be interconnected in a state in which the wiring circuit board size is reduced.
【０００９】また、混成集積回路と接続される配線回路
基板は信号用リード端子とパワー用リード端子の第２の
端子部の接続構造により保持することができる。Further, the printed circuit board connected to the hybrid integrated circuit can be held by the connection structure of the second terminal portion of the signal lead terminal and the power lead terminal.
【００１０】[0010]
【実施例】以下に図１〜図３に示した実施例に基づい
て、本発明の混成集積回路装置を説明する。本発明の混
成集積回路装置は、図１に示す如き、混成集積回路（１
０）と、その混成集積回路（１０）と接続される配線回
路基板（２０）と、混成集積回路（１０）のパワー端子
（１４）と接続される外部回路（図示しない）より延在
されるリード配線（３０）とから構成される。DESCRIPTION OF THE PREFERRED EMBODIMENTS The hybrid integrated circuit device of the present invention will be described below with reference to the embodiments shown in FIGS. A hybrid integrated circuit device according to the present invention includes a hybrid integrated circuit (1
0), a printed circuit board (20) connected to the hybrid integrated circuit (10), and an external circuit (not shown) connected to the power terminal (14) of the hybrid integrated circuit (10). It is composed of a lead wire (30).
【００１１】本発明に用いられる混成集積回路（１０）
は、金属基板（１１）とその基板（１１）上に固着され
る複数の回路素子（１２）および信号用リード端子（１
３）、パワー用リード端子（１４）とケース材（１５）
とから構成される。金属基板（１１）上には図示されな
いが絶縁樹脂層を介して所望形状の導電路が形成されて
おり、その導電路上に、例えば図３のインバータの主回
路（８０）を構成する複数のスイッチング素子、ドライ
ブ回路（４３）および保護回路（４４）を構成する複数
の回路素子が固着されている。そして、導電路上の所定
位置には、後述する配線回路基板（２０）と接続するた
めの複数の信号用リード端子（１３）およびパワー用リ
ード端子（１４）が半田付け等の手段によって固着され
ている。Hybrid integrated circuit (10) used in the present invention
Is a metal substrate (11), a plurality of circuit elements (12) fixed on the substrate (11), and a signal lead terminal (1).
3), power lead terminal (14) and case material (15)
Composed of and. Although not shown, a conductive path having a desired shape is formed on the metal substrate (11) through an insulating resin layer, and on the conductive path, for example, a plurality of switching elements constituting the main circuit (80) of the inverter of FIG. 3 are formed. A plurality of circuit elements forming the element, the drive circuit (43) and the protection circuit (44) are fixed. A plurality of signal lead terminals (13) and power lead terminals (14) for connecting to a wiring circuit board (20) described later are fixed to predetermined positions on the conductive path by means of soldering or the like. There is.
【００１２】本発明で用いられるパワー用リード端子
（１４）は、２つの第１、第２の端子部（１４Ａ）（１
４Ｂ）を有している。すなわち、第１の端子部（１４
Ａ）には、後述するリード配線が直接接続され、第２の
端子部（１４Ｂ）は配線回路基板（２０）と接続され
る。さらに述べると、リード端子（１４）の第１、第２
の端子部（１４Ａ）（１４Ｂ）はリード端子（１４）の
半田接合部より分割形成することができるが、この場
合、リード端子（１４）の半田接合部の半田接合面積が
大きくなるために、この実施例では図２に示す如き、リ
ード端子（１４）の中間部から第２の端子部（１４Ｂ）
が導出するように折曲げ加工されている。この実施例の
リード端子（１４）構造では半田接合面積を加工上小さ
く形成することができ基板（１１）のサイズの小型化に
寄与することができる。The power lead terminal (14) used in the present invention has two first and second terminal portions (14A) (1).
4B). That is, the first terminal portion (14
A lead wire described later is directly connected to A), and the second terminal portion (14B) is connected to the printed circuit board (20). More specifically, the first and second lead terminals (14)
The terminal portions (14A) and (14B) of can be formed separately from the solder joint portion of the lead terminal (14), but in this case, the solder joint area of the solder joint portion of the lead terminal (14) becomes large, In this embodiment, as shown in FIG. 2, from the middle portion of the lead terminal (14) to the second terminal portion (14B).
Is bent so that In the lead terminal (14) structure of this embodiment, the solder joint area can be formed small in terms of processing, which can contribute to the size reduction of the substrate (11).
【００１３】本実施例では信号用リード端子（１３）お
よびパワー用リード端子（１４）の先端部は共に、上側
方向、すなわち天面構造となるように導出されている
が、その先端部を天面方向に導出する必要があるもの
は、信号用リード端子（１３）およびパワー用リード端
子（１４）の第２の端子部（１４Ｂ）であるために、パ
ワー用リード端子（１４）の第１の端子部（１４Ａ）の
先端部は水平あるいは下方向に配置するように折曲げ加
工しても何んら支障はない。In the present embodiment, the tip portions of the signal lead terminal (13) and the power lead terminal (14) are both led out in the upward direction, that is, the top surface structure. Since it is the second terminal portion (14B) of the signal lead terminal (13) and the power lead terminal (14) that needs to be led out in the plane direction, the first of the power lead terminals (14) is There is no problem even if the tip of the terminal portion (14A) is bent so that it is arranged horizontally or downward.
【００１４】基板（１１）上に両リード端子（１３）
（１４）を半田接続した後、その基板（１１）の周端辺
には樹脂製で略枠状に形成されたケース材（１５）が接
着される。そして、そのケース材（１５）によって囲ま
れた領域内にはエポキシ樹脂あるいは／およびシリコン
ゲル等の樹脂が充填され、基板（１１）上に実装した回
路素子の保護が行われ、配線回路基板との接続が行われ
る。この際、パワーリード端子（１４）の第２の端子部
（１４Ｂ）の折曲げ部の一部は樹脂中に埋没され、第２
の端子部（１４Ｂ）の補強が行われている。Both lead terminals (13) on the substrate (11)
After soldering (14), a case member (15) made of a resin and having a substantially frame shape is adhered to the peripheral edge of the substrate (11). The area surrounded by the case material (15) is filled with a resin such as epoxy resin and / or silicon gel to protect the circuit elements mounted on the board (11), and Connection is made. At this time, a part of the bent portion of the second terminal portion (14B) of the power lead terminal (14) is embedded in the resin,
The terminal portion (14B) is reinforced.
【００１５】混成集積回路（１０）と接続される配線回
路基板（２０）は、プリント基板等のＰＣＢが用いら
れ、少なくともその一主面には所望形状の導電パターン
が形成され、その導電パターン上に複数の回路素子（２
１）が実装される。本実施例の配線回路基板（２０）上
には、図３に示したインバータ回路のコントロール（４
１）およびレギュレータ（４２）を構成するための回路
素子（２１）が実装されている。さらに、配線回路基板
（２０）上には、リード端子（１４）の第２端子部（１
４Ｂ）とコントロール回路（４１）およびレギュレータ
（４２）を接続するためのパターンが形成されている。
配線回路基板（２０）には信号用リード端子（１３）お
よびパワー用リード端子（１４）の第２の端子部（１４
Ｂ）を挿入接続するための複数のスルーホールが設けら
れており、そのスルーホールに前述したリード端子（１
３）（１４Ｂ）が挿入されて、配線回路基板（２０）上
に形成された導電パターンと半田固着され電気的接続が
行われる。The printed circuit board (20) connected to the hybrid integrated circuit (10) is a PCB such as a printed circuit board, and a conductive pattern of a desired shape is formed on at least one main surface of the printed circuit board. Multiple circuit elements (2
1) is implemented. On the printed circuit board (20) of this embodiment, the inverter circuit control (4) shown in FIG.
1) and the circuit element (21) for constituting the regulator (42) are mounted. Further, the second terminal portion (1) of the lead terminal (14) is provided on the printed circuit board (20).
4B), a pattern for connecting the control circuit (41) and the regulator (42) is formed.
The printed circuit board (20) has a second terminal portion (14) of the signal lead terminal (13) and the power lead terminal (14).
A plurality of through holes for inserting and connecting B) are provided, and the lead terminals (1
3) (14B) is inserted and soldered and fixed to the conductive pattern formed on the printed circuit board (20) for electrical connection.
【００１６】すなわち、配線回路基板（２０）は混成集
積回路（１０）の複数の信号用リード端子（１３）とパ
ワー用リード端子（１４）の第２の端子部（１４Ｂ）と
のみ接続される構造となり、リード端子（１４）の第１
の端子部（１４Ａ）は個別に独立した状態で導出される
ことになる。配線回路基板（２０）と複数のリード端子
（１３）および第２の端子部（１４Ｂ）を半田接続する
ことで回路基板（２０）上に形成された導電路と混成集
積回路（１０）とが電気的に接続されるのと同時に、配
線回路基板（２０）の保持がリード端子（１３）と第２
の端子部（１４Ｂ）の接続力で保たれることになる。そ
の結果、配線回路基板（２０）を一定に保持するための
専用の保持部材を用いることがない。That is, the printed circuit board (20) is connected only to the plurality of signal lead terminals (13) of the hybrid integrated circuit (10) and the second terminal portion (14B) of the power lead terminal (14). The structure, the first of the lead terminals (14)
The terminal portion (14A) of is to be led out individually and independently. By connecting the printed circuit board (20) to the lead terminals (13) and the second terminal portions (14B) by soldering, the conductive paths formed on the circuit board (20) and the hybrid integrated circuit (10) are separated. At the same time as being electrically connected, the printed circuit board (20) is held by the lead terminal (13) and the second terminal.
The connection force of the terminal portion (14B) is maintained. As a result, there is no need to use a dedicated holding member for holding the printed circuit board (20) constantly.
【００１７】混成集積回路（１０）のリード端子（１
３）と第２の端子部（１４Ｂ）と配線回路基板（２０）
を半田接続した後、パワーリード端子（１４）の第１の
端子部（１４Ａ）に外部回路から延在されるリード配線
（３０）のコネクタ（３１）が挿入接続される。図示さ
れないが外部回路には、図３に示すパワーインバータ回
路のパワー段の整流回路（４５）が構成されており、そ
の外部回路と混成集積回路（１０）はリード配線（３
０）によって接続される。リード配線（３０）の先端部
はメス型のコネクタ構造を有しており、配線回路基板
（２０）より突出したパワーリード端子（１４）にその
メス型のコネクタが挿入されて相互接続が行われる。The lead terminal (1) of the hybrid integrated circuit (10)
3), the second terminal portion (14B) and the printed circuit board (20)
After soldering, the connector (31) of the lead wiring (30) extending from the external circuit is inserted and connected to the first terminal portion (14A) of the power lead terminal (14). Although not shown, the rectifier circuit (45) at the power stage of the power inverter circuit shown in FIG. 3 is configured in the external circuit, and the external circuit and the hybrid integrated circuit (10) are connected to the lead wiring (3).
0). The tip portion of the lead wire (30) has a female connector structure, and the female connector is inserted into the power lead terminal (14) protruding from the printed circuit board (20) for mutual connection. .
【００１８】[0018]
【発明の効果】以上に詳述した如き、本発明の混成集積
回路装置においては、外部回路から延在されるリード配
線と２系統の端子を有するリード端子の第１の端子部を
接続し、第２の端子部と配線回路基板を接続することに
より、コネクタを介する必要がないため、配線回路基板
サイズを小型化した状態で混成集積回路、配線回路基板
および外部回路の相互接続が可能となる。その結果、混
成集積回路装置システム全体の小型化を図ることが可能
となる。As described above in detail, in the hybrid integrated circuit device of the present invention, the lead wiring extending from the external circuit and the first terminal portion of the lead terminal having the terminals of two systems are connected, By connecting the second terminal portion and the printed circuit board, it is not necessary to interpose a connector, so that the hybrid integrated circuit, the printed circuit board, and the external circuit can be interconnected in a state where the size of the printed circuit board is reduced. . As a result, the overall size of the hybrid integrated circuit device system can be reduced.
【００１９】また、本発明に依れば、混成集積回路と接
続される配線回路基板は信号用リード端子とパワー用リ
ード端子の第２の端子部の接続構造により保持すること
ができる。その結果、配線回路基板を保持するための専
用の保持部材を不要にすることができる。Further, according to the present invention, the printed circuit board connected to the hybrid integrated circuit can be held by the connection structure of the second terminal portions of the signal lead terminal and the power lead terminal. As a result, a dedicated holding member for holding the printed circuit board can be eliminated.
【図１】本発明の混成集積回路装置を示す断面図であ
る。FIG. 1 is a cross-sectional view showing a hybrid integrated circuit device of the present invention.
【図２】本発明の実施例で用いられるリード端子を示す
図である。FIG. 2 is a diagram showing a lead terminal used in an embodiment of the present invention.
【図３】インバータ回路を示す回路図である。FIG. 3 is a circuit diagram showing an inverter circuit.
【図４】インバータ回路を示す回路図である。FIG. 4 is a circuit diagram showing an inverter circuit.
【図５】従来の混成集積回路装置を示す断面図である。FIG. 5 is a cross-sectional view showing a conventional hybrid integrated circuit device.
（１０） 混成集積回路 （１１） 金属基板 （１２） 回路素子 （１３） 信号用リード端子 （１４） パワーリード端子 （１５） ケース材 （２０） 配線回路基板 （２１） 回路素子 （３０） リード配線 (10) Hybrid integrated circuit (11) Metal substrate (12) Circuit element (13) Signal lead terminal (14) Power lead terminal (15) Case material (20) Wiring circuit board (21) Circuit element (30) Lead wiring
Claims (3)
電路を介して複数の回路素子が固着され、前記導電路が
延在される所定位置に信号用およびパワー用の外部リー
ド端子が接続された混成集積回路と、 少なくとも一主面上に複数の回路素子が実装され、前記
混成集積回路と接続された配線回路基板とを備え、前記
パワー用外部リード端子は第１の端子部と第２の端子部
の２系統の端子部を有し、その第１の端子部は外部回路
から延在されるリード配線と直接接続され、第２の端子
部は前記配線回路基板と接続されたことを特徴とする混
成集積回路装置。1. A plurality of circuit elements are fixed via conductive paths of a desired shape formed on an insulating substrate, and external lead terminals for signals and power are provided at predetermined positions where the conductive paths extend. A connected hybrid integrated circuit; and a wiring circuit board having a plurality of circuit elements mounted on at least one main surface and connected to the hybrid integrated circuit, wherein the power external lead terminal is a first terminal portion. The second terminal portion has two systems of terminal portions, the first terminal portion is directly connected to the lead wiring extending from the external circuit, and the second terminal portion is connected to the printed circuit board. A hybrid integrated circuit device characterized by the above.
電路を介して複数の回路素子が固着され、前記導電路が
延在される所定位置に信号用およびパワー用の外部リー
ド端子が接続された混成集積回路と、 少なくとも一主面上に複数の回路素子が実装され、前記
混成集積回路と接続された配線回路基板とを備え、前記
パワー用外部リード端子は第１の端子部と第２の端子部
の２系統の端子部を有し、その第１の端子部は混成集積
回路および配線回路基板と相互接続される外部回路から
延在されるリード配線と直接接続され、前記配線回路基
板は前記信号用外部リード端子および前記第２の端子部
で接続保持されたことを特徴とする混成集積回路装置。2. A plurality of circuit elements are fixed through a conductive path of a desired shape formed on an insulating substrate, and external lead terminals for signals and power are provided at predetermined positions where the conductive paths extend. A connected hybrid integrated circuit; and a wiring circuit board having a plurality of circuit elements mounted on at least one main surface and connected to the hybrid integrated circuit, wherein the power external lead terminal is a first terminal portion. The second terminal portion has two types of terminal portions, and the first terminal portion is directly connected to a lead wiring extending from an external circuit interconnected with the hybrid integrated circuit and the wiring circuit board. The circuit board is connected and held by the signal external lead terminal and the second terminal portion.
形状の導電路を介して複数の回路素子が固着され、その
導電路が延在される所定位置に信号用外部リード端子お
よび第１、第２の２系統の端子部を有したパワー用外部
リード端子が接続され、前記信号用リード端子およびパ
ワー用外部リード端子の第１あるいは第２の端子部の先
端部が前記基板の一主面側に導出された混成集積回路
と、 少なくとも一主面上に複数の回路素子が実装され、前記
信号用外部リード端子および前記第１あるいは第２の端
子部を挿入する孔を用いて半田接続された配線回路基板
とを具備したことを特徴とする混成集積回路装置。3. A plurality of circuit elements are fixed through a conductive path of a desired shape formed on one main surface of an insulating substrate, and a signal external lead terminal and a signal external lead terminal are provided at predetermined positions where the conductive paths extend. An external power lead terminal having two first and second terminal portions is connected, and the tip of the first or second terminal portion of the signal lead terminal and the power external lead terminal is the substrate. Using a hybrid integrated circuit led out to one main surface side, a plurality of circuit elements mounted on at least one main surface, and a hole for inserting the signal external lead terminal and the first or second terminal portion A hybrid integrated circuit device comprising: a wired circuit board connected by soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15711393A JPH0722577A (en) | 1993-06-28 | 1993-06-28 | Hybrid integrated circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15711393A JPH0722577A (en) | 1993-06-28 | 1993-06-28 | Hybrid integrated circuit device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0722577A true JPH0722577A (en) | 1995-01-24 |
Family
ID=15642513
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15711393A Pending JPH0722577A (en) | 1993-06-28 | 1993-06-28 | Hybrid integrated circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0722577A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010035304A (en) * | 2008-07-28 | 2010-02-12 | Keihin Corp | Terminal having bus bar |
| JP2012195374A (en) * | 2011-03-15 | 2012-10-11 | Toyota Industries Corp | Semiconductor device |
| JP2013046447A (en) * | 2011-08-23 | 2013-03-04 | Hitachi Automotive Systems Ltd | Power conversion device |
-
1993
- 1993-06-28 JP JP15711393A patent/JPH0722577A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010035304A (en) * | 2008-07-28 | 2010-02-12 | Keihin Corp | Terminal having bus bar |
| JP2012195374A (en) * | 2011-03-15 | 2012-10-11 | Toyota Industries Corp | Semiconductor device |
| JP2013046447A (en) * | 2011-08-23 | 2013-03-04 | Hitachi Automotive Systems Ltd | Power conversion device |
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