JPH0582947A - Printed board - Google Patents
Printed boardInfo
- Publication number
- JPH0582947A JPH0582947A JP23925591A JP23925591A JPH0582947A JP H0582947 A JPH0582947 A JP H0582947A JP 23925591 A JP23925591 A JP 23925591A JP 23925591 A JP23925591 A JP 23925591A JP H0582947 A JPH0582947 A JP H0582947A
- Authority
- JP
- Japan
- Prior art keywords
- pad
- pads
- solder
- electrically
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、ＩＣ（半導体集積回
路）、ＴＡＢ（テープ オートメイティド ボンディン
グ）、ＦＰＣ（フレキシブル プリンティド サーキッ
ト）、コネクタ等の、複数本の接続用端子を有する（す
なわち、多ピンの）種々の電子部品を実装（搭載）する
プリント基板に関する。BACKGROUND OF THE INVENTION The present invention has a plurality of connecting terminals such as IC (semiconductor integrated circuit), TAB (tape automated bonding), FPC (flexible printed circuit), connector, etc. The present invention relates to a printed circuit board on which various electronic components (of pins) are mounted.
【０００２】[0002]
【従来の技術】プリント基板は、その面上に電気回路が
形成され、かつ、ＩＣ、コンデンサ、抵抗、コイル、フ
ィルタ等の各種の電子部品を搭載し、各種の電子製品に
組み込まれ、目的とする電気的特性を入出力するもの
で、電子部品の保持、電気回路の中継機能を果たす。2. Description of the Related Art A printed circuit board has an electric circuit formed on the surface thereof and is equipped with various electronic parts such as an IC, a capacitor, a resistor, a coil and a filter, and is incorporated into various electronic products. It is used to input and output the electrical characteristics of the electronic components, and it functions to hold electronic components and relay electric circuits.
【０００３】プリント基板は、種々のタイプのものが作
製されている。図２は、各種の電子部品が実装されたプ
リント基板の一例を示す斜視図である。１はプリント基
板、２はプリント基板１に搭載された各種の電子部品、
３は電子部品２のうちのＩＣである。Various types of printed circuit boards are manufactured. FIG. 2 is a perspective view showing an example of a printed circuit board on which various electronic components are mounted. 1 is a printed circuit board, 2 is various electronic components mounted on the printed circuit board 1,
Reference numeral 3 is an IC of the electronic component 2.
【０００４】図３は、多ピンのＩＣの斜視図を示し、
（ａ）はＳＯＰ（スモール アウトライン パッケー
ジ）、（ｂ）はＱＦＰ（クワッド（４方向） フラット
パッケージ）を示す。FIG. 3 shows a perspective view of a multi-pin IC,
(A) is SOP (small outline package), (b) is QFP (quad (4 directions) flat
Package).
【０００５】図４は、電子部品のうち、多ピンのＩＣを
実装した様子を示す断面図（図１のＡ−Ａ線断面図）で
ある。４はＩＣ３の複数本の接続用端子、５は各端子４
が半田付けにより接続される複数個のパッド、６は半
田、７ａはパッド５に接続されたリード、８はソルダー
レジスト（詳細は図５を用いて後述）である。FIG. 4 is a cross-sectional view (cross-sectional view taken along the line AA in FIG. 1) showing a state in which a multi-pin IC is mounted among electronic components. 4 is a plurality of terminals for connecting the IC 3 and 5 is each terminal 4
Is a plurality of pads connected by soldering, 6 is solder, 7a is a lead connected to the pad 5, and 8 is a solder resist (details will be described later with reference to FIG. 5).
【０００６】図５は、従来のプリント基板のパッドを示
す部分平面図である。FIG. 5 is a partial plan view showing a pad of a conventional printed circuit board.
【０００７】５ａはプリント基板１に実装するＩＣ３の
各端子４（図４参照）に対応してプリント基板１に設け
た複数個のパッド、５ｂはＩＣ３の電気的空き端子（図
示せず）に対応するパッド、７ａはパッド５ａに接続さ
れ、電気回路の一部を構成するリード、８は半田を付け
るべき領域以外の領域に設けられ（すなわち、半田を付
けない領域を覆う）、配線の保護膜を兼ねるソルダーレ
ジストである。Reference numeral 5a designates a plurality of pads provided on the printed circuit board 1 corresponding to each terminal 4 (see FIG. 4) of the IC 3 mounted on the printed circuit board 1, and 5b designates an electrically vacant terminal (not shown) of the IC3. Corresponding pad, 7a is connected to pad 5a, leads forming a part of the electric circuit, 8 is provided in a region other than the region to be soldered (that is, covers the region not soldered), and protects the wiring. It is a solder resist that doubles as a film.
【０００８】[0008]
【発明が解決しようとする課題】図５に示したような従
来のプリント基板１に多ピンのＩＣ３を実装した場合、
ＩＣ３の電気的空き端子（図示せず）とパッド５ｂとの
接続部の半田量が、ＩＣ３の他の端子とパッド５ａとの
接続部より多くなり、短絡等の問題が生じることがあっ
た。最近では、素子の高密度化に伴って、ＩＣが小型化
し、ピンのピッチが狭くなる傾向にあるため、これは大
きな問題となる。When the multi-pin IC 3 is mounted on the conventional printed circuit board 1 as shown in FIG. 5,
The amount of solder in the connecting portion between the electrically vacant terminal (not shown) of the IC3 and the pad 5b becomes larger than that in the connecting portion between the other terminal of the IC3 and the pad 5a, which may cause a problem such as a short circuit. In recent years, as the density of devices has increased, ICs have tended to become smaller and the pin pitch has become narrower, which is a serious problem.
【０００９】本発明の目的は、電気的空き端子とそれに
対応するパッドとの接続部の半田量が多くなることに起
因する短絡等の問題を解決できるプリント基板を提供す
ることにある。An object of the present invention is to provide a printed circuit board capable of solving a problem such as a short circuit caused by an increase in the amount of solder at a connecting portion between an electrically vacant terminal and a corresponding pad.
【００１０】[0010]
【課題を解決するための手段】上記の課題を解決するた
めに、本発明のプリント基板は、多ピンの電子部品の電
気的空き端子用のパッドの形状を改良したもので、該パ
ッドにも他のパッドと同様に、リード部を設けたことを
特徴とする。In order to solve the above-mentioned problems, the printed circuit board of the present invention has an improved shape of a pad for an electrically vacant terminal of a multi-pin electronic component. Like the other pads, a lead portion is provided.
【００１１】[0011]
【作用】電気的空き端子用パッドにも他のパッドと同様
にリード部を設けたため、ソルダーレジストの存在しな
い範囲内では、電気的空き端子用パッドを他のパッドと
同一の条件にすることができるので、両パッドにおける
半田の流れが均一になり、電気的空き端子用パッドに起
因する短絡等の問題を解決することができる。Since the lead portion is provided on the electrically vacant terminal pad like the other pads, the electrically vacant terminal pad can be set to the same condition as the other pads within the range where the solder resist does not exist. As a result, the flow of solder on both pads becomes uniform, and problems such as a short circuit due to the electrically vacant terminal pads can be solved.
【００１２】[0012]
【実施例】図１は、本発明の一実施例のプリント基板の
パッドを示す部分平面図である。1 is a partial plan view showing a pad of a printed circuit board according to an embodiment of the present invention.
【００１３】５ａはプリント基板１に実装するＩＣ３の
各端子４（図４参照）に対応してプリント基板１に設け
た複数個のパッド、５ｂはＩＣ３の電気的空き端子（図
示せず）用のパッド、７ａはパッド５ａに接続され、電
気回路の一部を構成するリード、７ｂは電気的空き端子
用パッド５ｂに設けたリード、８は半田を付けるべき領
域以外の領域に設けられ（すなわち、半田を付けない領
域を覆う）、配線の保護膜を兼ねるソルダーレジストで
ある。電気的空き端子５ｂのリード７ｂは、ソルダーレ
ジスト８の下まで伸びているが、電気回路に接続されて
いない。本実施例では、電気的空き端子用パッド５ｂに
も電気回路に接続される他のパッド５ａと同様に、ソル
ダーレジスト８の下まで伸びたリード部７ｂを設けたた
め、ソルダーレジスト８の存在しない範囲内では、電気
的空き端子用パッド５ｂを他のパッド５ａと同一の形状
となっているので、電気的空き端子用パッド５ｂにおけ
る半田もリード７ｂの方に流れ、両パッド５ａ、５ｂに
おける半田の流れが均一になり、電気的空き端子用パッ
ド５ｂに起因する短絡等の問題を解決することができ
る。Reference numeral 5a designates a plurality of pads provided on the printed circuit board 1 corresponding to the respective terminals 4 (see FIG. 4) of the IC 3 mounted on the printed circuit board 1, and 5b designates electrical empty terminals (not shown) of the IC3. Pad, 7a is a lead that is connected to the pad 5a and forms a part of an electric circuit, 7b is a lead that is provided on the pad 5b for an electrically vacant terminal, and 8 is provided in an area other than the area to which solder is applied (that is, , A region where solder is not applied), and a solder resist that also serves as a wiring protective film. The lead 7b of the electrically vacant terminal 5b extends below the solder resist 8 but is not connected to an electric circuit. In this embodiment, the lead portion 7b extending to the bottom of the solder resist 8 is provided in the electrically vacant terminal pad 5b as in the case of the other pads 5a connected to the electric circuit. Since the pad 5b for electrically empty terminals has the same shape as the other pads 5a inside, the solder in the pad 5b for electrically empty terminals also flows toward the lead 7b, and the solder in both pads 5a, 5b The flow becomes uniform, and it is possible to solve a problem such as a short circuit caused by the electrically vacant terminal pad 5b.
【００１４】以上本発明を実施例に基づいて具体的に説
明したが、本発明は上記実施例に限定されるものではな
く、その要旨を逸脱しない範囲において種々変更可能で
あることは勿論である。例えば、上記実施例では、複数
本の接続用端子を有する電子部品として、ＩＣ３を実装
する場合を例に挙げて説明したが、ＴＡＢ、ＦＰＣ、コ
ネクタ等の種々の多ピンの電子部品を実装する場合にも
適用することができる。また、プリント基板も、図１、
２、４に示したようなプリント基板１に限らず、ワイヤ
布線法（マルチワイヤ方式）による高密度配線基板、セ
ラミックやポリイミドの多層基板、モールド基板、メタ
ルベース基板、プラスチック基板、あるいはフレキシブ
ル基板等、種々のプリント基板に適用することができ
る。Although the present invention has been specifically described based on the embodiments, the present invention is not limited to the above embodiments, and it is needless to say that various modifications can be made without departing from the scope of the invention. . For example, in the above embodiment, the case where the IC 3 is mounted as an electronic component having a plurality of connecting terminals has been described as an example, but various multi-pin electronic components such as TAB, FPC, and connector are mounted. It can also be applied in cases. Also, the printed circuit board is
Not only the printed circuit board 1 as shown in 2 and 4, but also a high-density wiring board by a wire wiring method (multi-wire method), a multilayer board of ceramic or polyimide, a mold board, a metal base board, a plastic board, or a flexible board. It can be applied to various printed circuit boards.
【００１５】[0015]
【発明の効果】以上説明したように、本発明のプリント
基板では、複数本の端子を有する電子部品の電気的空き
端子を含む全端子のパッドを同一条件とすることによ
り、電子部品の実装時、半田の流れが均一になるので、
短絡等の問題を解決することができ、電子部品が実装さ
れたプリント基板の品質を向上することができる。As described above, in the printed circuit board of the present invention, when the electronic components are mounted, the pads of all terminals including the electrically empty terminals of the electronic component having a plurality of terminals are set to the same condition. , Because the solder flow is uniform,
Problems such as short circuits can be solved, and the quality of a printed circuit board on which electronic components are mounted can be improved.
【図１】本発明の一実施例のプリント基板のパッドを示
す部分平面図である。FIG. 1 is a partial plan view showing a pad of a printed circuit board according to an embodiment of the present invention.
【図２】各種の電子部品が実装されたプリント基板の一
例を示す斜視図である。FIG. 2 is a perspective view showing an example of a printed circuit board on which various electronic components are mounted.
【図３】多ピンのＩＣの斜視図である。FIG. 3 is a perspective view of a multi-pin IC.
【図４】多ピンのＩＣを実装した様子を示す断面図（図
１のＡ−Ａ線断面図）である。FIG. 4 is a cross-sectional view (cross-sectional view taken along the line AA of FIG. 1) showing a state in which a multi-pin IC is mounted.
【図５】従来のプリント基板のパッドを示す部分平面図
である。FIG. 5 is a partial plan view showing a pad of a conventional printed circuit board.
１…プリント基板、２…電子部品、３…ＩＣ、４…ＩＣ
の端子、５、５ａ…パッド、５ｂ…電気的空き端子用の
パッド、６…半田、７ａ…電気回路に接続されたリー
ド、７ｂ…電気的空き端子用パッドのリード、８…ソル
ダーレジスト。1 ... Printed circuit board, 2 ... Electronic component, 3 ... IC, 4 ... IC
, 5, 5a ... Pads, 5b ... Pads for electrically empty terminals, 6 ... Solder, 7a ... Leads connected to an electric circuit, 7b ... Leads for electrically empty terminal pads, 8 ... Solder resist.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 久保 毅一郎 千葉県茂原市早野3300番地株式会社日立製 作所茂原工場内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Keiichiro Kubo 3300 Hayano, Mobara-shi, Chiba Hitachi Ltd. Mobara factory
Claims (1)
ルダーレジストのない領域内で電気的空き端子用のパッ
ドの形状が他のパッドの形状と同一である電子部品の上
記各端子に対応する複数個のパッドを設けたプリント基
板において、上記電子部品の電気的空き端子に対応して
接続されるパッドにもリード部を設けたことを特徴とす
るプリント基板。1. Corresponding to each terminal of an electronic component in which the shape of a pad for an electrically vacant terminal is the same as the shape of another pad in a region without a solder resist having a plurality of connection terminals to be mounted. A printed circuit board provided with a plurality of pads, wherein a lead portion is also provided on a pad connected in correspondence with an electrically vacant terminal of the electronic component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23925591A JPH0582947A (en) | 1991-09-19 | 1991-09-19 | Printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23925591A JPH0582947A (en) | 1991-09-19 | 1991-09-19 | Printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0582947A true JPH0582947A (en) | 1993-04-02 |
Family
ID=17042045
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23925591A Pending JPH0582947A (en) | 1991-09-19 | 1991-09-19 | Printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0582947A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002204055A (en) * | 2000-12-28 | 2002-07-19 | Airex Inc | Method for manufacturing printed board |
-
1991
- 1991-09-19 JP JP23925591A patent/JPH0582947A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002204055A (en) * | 2000-12-28 | 2002-07-19 | Airex Inc | Method for manufacturing printed board |
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