JPH07169904A - Surface-mount type semiconductor package with circuit components - Google Patents

Abstract

PURPOSE:To enhance packaging density and workability required when ICs and circuit components are surface-mounted to a printed wiring board. CONSTITUTION:IC lead wires 2 are bent upwardly where circuit component units 3 are soldered with electrodes 5X on the top of each component unit on the bottom of a row of base units 2a of the lead wires 2. The circuit components 3 are formed by integrating circuit components 4A to 4F in the shape of a column. Each circuit component forms the shapes of a conductor, a resistor or a capacitor. The circuit component units 3 are soldered with a wiring pattern 7 of a printed wiring board 6 with an electrode 5Y on the lower side. It is, therefore, possible to connect the lead wires of the IC to the conductor, the resistor or the components of the capacitor in series.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit capable of improving mounting density and workability when mounting a surface mount type semiconductor package on a printed wiring board together with surface mount type circuit components such as resistors and capacitors. The present invention relates to a surface mount type semiconductor package with components.

[0002]

2. Description of the Related Art A conventional example will be described with reference to a side view of FIG. In the figure, printed wiring board 6
A semiconductor integrated circuit as a semiconductor package (hereinafter,
An IC 1) and related circuit parts (chip parts) 14 are two-dimensionally arranged and surface-mounted. IC1 is
The base portion 2a of the lead 2 is soldered to the wiring pattern 4, and the circuit component 14 is directly soldered to the same wiring pattern 4. The circuit component 14 can take the form of a resistor, a capacitor, a conductor, or the like.

[0003]

On the other hand, in order to increase the mounting density of a printed wiring board, miniaturization of circuit components is promoted on the one hand, but each circuit component itself and the wiring pattern between each circuit component occupy it. It is not possible to eliminate the two-dimensional area. In particular, since circuit components are generally used in the form of resistors and capacitors, the total area occupied by them is considerable, which is a major impediment to improvement in packaging density. Moreover, miniaturization of circuit components not only makes mounting work difficult and hinders improvement in productivity, but also causes problems in terms of quality.

The problem to be solved by the present invention is to solve the above problems of the prior art and provide a surface mount type semiconductor package with circuit parts which can improve the mounting density and workability. Especially.

[0005]

According to another aspect of the present invention, there is provided a surface mount type semiconductor package having circuit parts, wherein a surface mount type circuit part having electrodes on both ends is provided on one surface of a lead base portion.
Conductivity is fixed through one of the electrodes. In the surface mount type semiconductor package with circuit parts according to a second aspect of the present invention, a surface mount type circuit part having electrodes on both ends corresponding to the lead base part is integrally formed on one surface of the lead base part arranged in parallel. The circuit component unit formed by the above is electrically conductively fixed via one of the electrodes.

A surface mount type semiconductor package with circuit parts according to a third aspect is the semiconductor package according to the second aspect, wherein the circuit part units corresponding to the respective side surfaces are integrally connected and held by a common annular frame. It

[0007]

In the surface mount type semiconductor package with circuit parts according to the first aspect, it is different whether the surface mount type part is conductively fixed to the front surface or the back surface of the semiconductor package. , Resistors, capacitors, etc.), and the connection relationship between the circuit component and the wiring pattern of the printed wiring board, the semiconductor package and the circuit component can be mounted on the printed wiring board in various circuit formats.

In the surface mount type semiconductor package with circuit parts according to the second or third aspect, it is different whether the surface mount unit is conductively fixed to the front surface or the back surface of the lead base portion of the semiconductor package, and the type of each circuit part. (Conductor, resistance,
The semiconductor package and the circuit component can be mounted on the printed wiring board in various circuit formats depending on the connection relationship between the capacitor) and the wiring pattern of the printed wiring board of each circuit component.

Particularly, in the surface mount type semiconductor package with circuit parts according to the third aspect, the surface mount units corresponding to the respective side surfaces of the semiconductor package are integrally connected and held by a common annular frame.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a surface mount type semiconductor package with circuit parts according to the present invention will be described below with reference to the drawings. 1 is a plan view of the first embodiment, FIG. 2 is a side view of the same, and FIG. 3 is a perspective view of a circuit component unit in the first embodiment. 1 and 2, the lead 2 of the IC1 is bent upward and the base portion 2a of the lead 2 is bent.
The circuit component unit 3 is installed on the bottom surface of the
Soldered with 5X. This circuit component unit 3 is
As shown in 3, the circuit components 4A, 4B, 4C, 4D, 4E, 4F are integrated in a row. Each of these circuit components may be a conductor, a resistor, or a capacitor depending on the overall circuit configuration. The above electrode 5X on the upper surface of each circuit component
However, the electrodes 5Y are respectively provided on the lower surface (not shown).
The circuit component unit 3 is soldered to the wiring pattern 7 of the printed wiring board 6 with the respective electrodes 5Y. Therefore, the lead of IC1 and the circuit component such as the conductor, the resistor or the capacitor can be connected in series. For example, if the lead is a power pin, the circuit component will be a conductor and connected to the power pattern. Further, when connecting the leads to the signal lines, if the circuit components are resistors, a series damping resistor is inserted. By the way, the circuit component does not take the form of the circuit component unit arranged in a row as in the first embodiment, and even in the case of a single unit, the size is small, but it is useful for substantially improving the packaging density.

FIG. 4 is a plan view of the second embodiment, and FIG. 5 is a side view of the same. 4 and 5, the lead 2 of the IC1 is bent downward and the base portion 2a of the lead 2 is bent.
The circuit component unit 3 is soldered to the upper surface of the row of the above with the electrode on the lower side thereof, and the base 2a is soldered to the wiring pattern not marked at the lower surface. The upper electrode of the circuit component unit 3 and the electrode pattern 8 of the printed wiring board 6 are
Connected by jumper wires 9. Therefore, IC1
Can be connected in parallel with a conductor, resistor or capacitor circuit component. For example, if a circuit component is a resistor, it can be used as a load resistor or a terminating resistor for the signal line, and if it is a capacitor, it can be used as a load capacitance. Can be achieved. If the circuit components are decoupling capacitors corresponding to the power pins of IC1, it is possible to reduce power noise with short wiring.

FIG. 6 is a plan view of the third embodiment. The third embodiment is a modification of the above second embodiment. The IC 11 has leads on all four sides, and the upper and lower lead rows each have a circuit component unit 3 consisting of six circuit components, and the right and left lead rows each have four circuit components. The respective circuit component units 13 are soldered. Here, the pair of circuit component units 3 and 13 facing each other are integrally held and connected by the rectangular annular frame 10. Therefore, workability can be improved by soldering or the like.

[0013]

In the surface mount type semiconductor package with circuit parts according to the first aspect of the present invention, it is determined whether the surface mount type part is conductively fixed to the surface or the back surface of the lead / base portion of the semiconductor package. The semiconductor package and the circuit component can be mounted on the printed wiring board in various circuit formats depending on (conductors, resistors, capacitors, etc.) and the connection relationship between the circuit component and the wiring pattern of the printed wiring board. Therefore, although small in scale,
It is possible to substantially improve the mounting density without downsizing the surface mount type circuit component.

In the surface mount type semiconductor package with circuit parts according to the second or third aspect, it is different whether the surface mount unit is conductively fixed to the front surface or the back surface of the lead base portion of the semiconductor package, and the type of each circuit part. (Conductor, resistance,
The semiconductor package and the circuit component can be mounted on the printed wiring board in various circuit formats depending on the connection relationship between the capacitor) and the wiring pattern of the printed wiring board of each circuit component. Therefore, it is possible to substantially improve the mounting density without downsizing the surface mount type circuit component.

Particularly, in the surface mount type semiconductor package with circuit parts according to the third aspect, the surface mount units corresponding to the respective side surfaces of the semiconductor package are integrally connected and held by a common annular frame. Can be improved.

[Brief description of drawings]

FIG. 1 is a plan view of a first embodiment according to the invention.

FIG. 2 is a side view of the same.

FIG. 3 is a perspective view of a circuit component unit according to the first embodiment.

FIG. 4 is a plan view of the second embodiment.

FIG. 5 is a side view of the same.

FIG. 6 is a plan view of the third embodiment.

FIG. 7 is a side view of a conventional example.

[Explanation of symbols]

 1 IC 2 Lead 2a Base Part 3 Circuit Parts Unit 4A to 4F Circuit Parts 5X, 5Y Electrodes 6 Printed Wiring Board 7 Wiring Pattern 8 Power Supply Pattern 9 Jumper Wire 10 Frame 11 IC 13 Circuit Parts Unit

Claims (3)

[Claims] 1. A surface mount type semiconductor with circuit parts, characterized in that a surface mount type circuit part having electrodes at both ends is electrically connected and fixed to one surface of a lead base part through one of the electrodes. package. 2. A circuit component unit in which surface mount type circuit components corresponding to the lead base portion and having electrodes on both ends corresponding to the lead base portion are integrally formed on one surface of the lead base portion arranged in parallel. A surface-mount type semiconductor package with a circuit component, which is electrically conductively fixed via electrodes. 3. The semiconductor package according to claim 2, wherein the circuit component units corresponding to the respective side surfaces are integrally connected and held by a common annular frame, and are mounted on a surface. Semiconductor package.