JP2798108B2 - Hybrid integrated circuit device - Google Patents
Hybrid integrated circuit deviceInfo
- Publication number
- JP2798108B2 JP2798108B2 JP25429092A JP25429092A JP2798108B2 JP 2798108 B2 JP2798108 B2 JP 2798108B2 JP 25429092 A JP25429092 A JP 25429092A JP 25429092 A JP25429092 A JP 25429092A JP 2798108 B2 JP2798108 B2 JP 2798108B2
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit device
- hybrid integrated
- external leads
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Description
【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION
【０００１】[0001]
【産業上の利用分野】本発明は、混成集積回路装置に関
し、特に外部端子の構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid integrated circuit device, and more particularly to a structure of an external terminal.
【０００２】[0002]
【従来の技術】従来、図２に示すように例えば、有機基
材１０１の両面に所定の銅箔パターン１０２と、銅箔パ
ターン１０２上にニッケルメッキおよび金メッキを施し
たメッキ部１０３と、ソルダーレジスト１０４と、スル
ホール１０５とを具備した有機基材から成るプリント配
線基板において、ＩＣチップ１０６ａ，１０６ｂを所定
の位置にマウントし、金線１０７にて、ＩＣチップ１０
６ａ，１０６ｂの所定電極とプリント配線基板上の所定
のメッキ部１０３とをワイヤボンディング法にて接続
し、樹脂１０８にて封止し、さらに、外部リードとして
クリップ端子１０９を半田１１０にて端部の所定の銅箔
パターン１０２へ接続した構造の混成集積回路装置があ
る。2. Description of the Related Art Conventionally, as shown in FIG. 2, for example, a predetermined copper foil pattern 102 on both sides of an organic base material 101, a plating portion 103 in which nickel plating and gold plating are applied on the copper foil pattern 102, a solder resist IC chips 106a and 106b are mounted at predetermined positions on a printed wiring board made of an organic base material having a through hole 104 and a through hole 105.
The predetermined electrodes 6a and 106b and the predetermined plating portion 103 on the printed wiring board are connected by a wire bonding method, sealed with a resin 108, and a clip terminal 109 as an external lead is soldered to an end portion with a solder 110. There is a hybrid integrated circuit device having a structure connected to a predetermined copper foil pattern 102.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、従来の
混成集積回路装置では、外部リードがクリップ端子構造
であり、クリップ端子間のピッチを例えば０．８ｍｍ以
下に小さくすると、クリップ端子の加工が、難しいこ
と、及び半田にて接続する場合において、隣り合うクリ
ップ端子間の半田ショートが発生する等の問題があり、
クリップ端子では、外部リードのピッチを０．８ｍｍ以
下に小さくすることは困難であった。However, in the conventional hybrid integrated circuit device, the external leads have a clip terminal structure, and if the pitch between the clip terminals is reduced to, for example, 0.8 mm or less, it is difficult to process the clip terminals. When connecting with solder, there is a problem such as the occurrence of solder short between adjacent clip terminals,
With clip terminals, it has been difficult to reduce the pitch of the external leads to 0.8 mm or less.
【０００４】そこで、本発明の技術的課題は、上記欠点
に鑑み、外部リード間のピッチを小さくすることができ
る混成集積回路装置を提供することにある。Accordingly, it is an object of the present invention to provide a hybrid integrated circuit device capable of reducing the pitch between external leads in view of the above-mentioned drawbacks.
【０００５】[0005]
【課題を解決するための手段】本発明によれば、両面を
有する有機基材と該有機基材の両面にそれぞれ配される
第１及び第２の配線パターンとを有するプリント配線基
板と、該配線基板上に設けられるＩＣチップとを含む混
成集積回路装置において、前記第１及び第２の配線パタ
ーンのうちの前記有機基材の両面の端部側から延在して
なる第１及び第２の外部リードを有し、かつ、これらの
第１及び第２の外部リードは互いに延長端側で電気的に
接続されてなることを特徴とする混成集積回路装置が得
られる。According to the present invention, there is provided a printed wiring board having an organic substrate having both surfaces and first and second wiring patterns respectively disposed on both surfaces of the organic substrate. In a hybrid integrated circuit device including an IC chip provided on a wiring board, a first and a second wiring pattern extending from both ends of both surfaces of the organic base material in the first and second wiring patterns. , And the first and second external leads are electrically connected to each other on the extended end side, thereby obtaining a hybrid integrated circuit device.
【０００６】また、本発明によれば、上記混成集積回路
装置において、前記第１及び第２の外部リードは、実質
的に、前記第１及び第２の配線パターンと同一材料から
なることを特徴とする混成集積回路装置が得られる。According to the present invention, in the hybrid integrated circuit device, the first and second external leads are substantially made of the same material as the first and second wiring patterns. Is obtained.
【０００７】即ち、本発明の混成集積回路装置は、有機
基材１の両面に設けられた銅箔から成る配線パターン２
と、前記有機基材１の両面でかつ該面の端部方向の面外
に延在する銅箔から成る外部リード７ａ，７ｂとを有す
るプリント配線基板上に、少なくとも一つのＩＣチップ
８ａ，８ｂをマウントし、金線９にてワイヤボンディン
グし、樹脂１０にて封止し、外部リード７ａ，７ｂを所
定の形状に加工するとともに熱圧着等により、外部リー
ド７ａ，７ｂを互いに電気的に接続したことを特徴とし
ている。That is, according to the hybrid integrated circuit device of the present invention, the wiring pattern 2 made of copper foil provided on both surfaces of the organic substrate 1 is provided.
And at least one IC chip 8a, 8b on a printed wiring board having copper foil and external leads 7a, 7b extending on both surfaces of the organic base material 1 and out of the surface in the end direction of the surface. Is mounted, wire-bonded with a gold wire 9, sealed with a resin 10, the external leads 7a and 7b are processed into a predetermined shape, and the external leads 7a and 7b are electrically connected to each other by thermocompression bonding or the like. It is characterized by doing.
【０００８】[0008]
【実施例】次に本発明の実施例について図面を参照して
説明する。Next, an embodiment of the present invention will be described with reference to the drawings.
【０００９】図１は、本発明の一実施例の混成集積回路
装置の断面図である。FIG. 1 is a sectional view of a hybrid integrated circuit device according to one embodiment of the present invention.
【００１０】プリント配線基板は、有機基材１の両面に
例えば３５μｍ厚の銅箔を所定の配線が得られるように
パターニングして得られた配線パターン２と、該配線パ
ターン２の所定パターン上に例えば１０μｍ厚のニッケ
ルメッキと０．５μｍ厚の金メッキを施したメッキ部３
と、ソルダーレジスト４と、スルホール５と、有機基材
１の両面でかつ端部方向の面外に具備させた例えば半田
メッキ６が施された例えば３５μｍ厚の銅箔から成る外
部リード７ａ，７ｂとを有する。A printed wiring board includes a wiring pattern 2 obtained by patterning copper foil of, for example, 35 μm thickness on both surfaces of an organic base material 1 so as to obtain a predetermined wiring, and a wiring pattern 2 on the predetermined pattern of the wiring pattern 2. For example, a plated portion 3 having a nickel plating of 10 μm thickness and a gold plating of 0.5 μm thickness.
External leads 7a and 7b made of, for example, 35 μm thick copper foil provided with solder plating 6 on both surfaces of the organic base material 1 and out of the surface in the end direction. And
【００１１】前記プリント配線基板上にＩＣチップ８
ａ，８ｂをマウントし、金線９にてワイヤボンディング
接続し、樹脂１０にて封止し、外部リード７ａ，７ｂを
所定の形状に加工および切断するとともに、熱圧着等に
より外部リード７ａ，７ｂの表面の半田メッキを溶かし
外部リード７ａ，７ｂを電気的に接続することにより本
実施例による混成集積回路装置が得られる。An IC chip 8 is mounted on the printed circuit board.
a, 8b are mounted, wire-bonded with gold wire 9, sealed with resin 10, processed and cut into external leads 7a, 7b into a predetermined shape, and external leads 7a, 7b are formed by thermocompression bonding or the like. The hybrid integrated circuit device according to the present embodiment can be obtained by melting the solder plating on the surface and electrically connecting the external leads 7a and 7b.
【００１２】例えば、外部リード間のピッチは、本発明
によれば、０．３ｍｍピッチが容易に実現できる。さら
に、プリント配線基板内のスルホール数が例えば、従来
に比べ、約４０％削減できた。なお、外部リード７ａ，
７ｂをプリント配線基板の端面から裏面の方向へ加工し
たＪリード型の外部リードとしても良い。For example, according to the present invention, the pitch between the external leads can be easily realized as 0.3 mm. Further, the number of through holes in the printed wiring board can be reduced, for example, by about 40% as compared with the conventional case. The external leads 7a,
7b may be a J-lead type external lead processed from the end face to the back face of the printed wiring board.
【００１３】[0013]
【発明の効果】本発明は、外部リードとしてプリント配
線基板上の銅箔を利用しているから、外部リード間のピ
ッチが銅箔をパターニングすることにより従来に比べ小
さくでき、かつ、外部リードにて両面の配線を互いに接
続できるからプリント配線基板内のスルホールの数を少
なくできるという効果がある。According to the present invention, since the copper foil on the printed wiring board is used as the external lead, the pitch between the external leads can be reduced by patterning the copper foil as compared with the prior art. Thus, since the wiring on both sides can be connected to each other, the number of through holes in the printed wiring board can be reduced.
【図１】本発明の一実施例を示す断面図である。FIG. 1 is a sectional view showing an embodiment of the present invention.
【図２】従来の混成集積回路装置を示す断面図である。FIG. 2 is a sectional view showing a conventional hybrid integrated circuit device.
１，１０１ 有機基材 ２ 配線パターン １０２ 銅箔パターン ３，１０３ メッキ部 ４，１０４ ソルダーレジスト ５，１０５ スルホール ６ 半田メッキ ７ａ，７ｂ 外部リード ８ａ，８ｂ，１０６ａ，１０６ｂ ＩＣチップ ９，１０７ 金線 １０，１０８ 樹脂 １０９ クリップ端子 １１０ 半田 DESCRIPTION OF SYMBOLS 1, 101 Organic base material 2 Wiring pattern 102 Copper foil pattern 3, 103 Plating part 4, 104 Solder resist 5, 105 Through hole 6 Solder plating 7a, 7b External lead 8a, 8b, 106a, 106b IC chip 9, 107 Gold wire 10 , 108 Resin 109 Clip terminal 110 Solder
Claims (2)
面にそれぞれ配される第１及び第２の配線パターンとを
有するプリント配線基板と、該配線基板上に設けられる
ＩＣチップとを含む混成集積回路装置において、前記第
１及び第２の配線パターンのうちの前記有機基材の両面
の端部側から延在してなる第１及び第２の外部リードを
有し、かつ、これらの第１及び第２の外部リードは互い
に延長端側で電気的に接続されてなることを特徴とする
混成集積回路装置。1. A printed wiring board having an organic base material having both surfaces and first and second wiring patterns respectively disposed on both surfaces of the organic base material, and an IC chip provided on the wiring substrate. A hybrid integrated circuit device that includes first and second external leads extending from end portions of both surfaces of the organic substrate in the first and second wiring patterns, and Wherein the first and second external leads are electrically connected to each other on the extended end side.
て、前記第１及び第２の外部リードは実質的に前記第１
及び第２の配線パターンと同一材料からなることを特徴
とする混成集積回路装置。2. The hybrid integrated circuit device according to claim 1, wherein said first and second external leads are substantially connected to said first and second external leads.
And a hybrid integrated circuit device made of the same material as the second wiring pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25429092A JP2798108B2 (en) | 1992-09-24 | 1992-09-24 | Hybrid integrated circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25429092A JP2798108B2 (en) | 1992-09-24 | 1992-09-24 | Hybrid integrated circuit device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06112395A JPH06112395A (en) | 1994-04-22 |
| JP2798108B2 true JP2798108B2 (en) | 1998-09-17 |
Family
ID=17262916
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25429092A Expired - Lifetime JP2798108B2 (en) | 1992-09-24 | 1992-09-24 | Hybrid integrated circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2798108B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3466237B2 (en) * | 1993-09-09 | 2003-11-10 | 理想科学工業株式会社 | Method for producing solvent stencil stencil sheet |
| JPH0776189A (en) * | 1993-09-09 | 1995-03-20 | Riso Kagaku Corp | Manufacture of stencil printing raw sheet |
| JP2773707B2 (en) * | 1995-10-23 | 1998-07-09 | 日本電気株式会社 | Manufacturing method of hybrid integrated circuit device |
| JP2001068742A (en) * | 1999-08-25 | 2001-03-16 | Sanyo Electric Co Ltd | Hybrid integrated circuit device |
| JP4524570B2 (en) * | 2004-03-10 | 2010-08-18 | 富士電機システムズ株式会社 | Semiconductor device |
-
1992
- 1992-09-24 JP JP25429092A patent/JP2798108B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH06112395A (en) | 1994-04-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 19980603 |